Kalispell, Montana
United States
127
2026-02-05
The entities that hold a legal rights for patent applications filed by inventor Hanson Kyle M.:
Kyle M. Hanson from Kalispell, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SYSTEMS AND METHODS FOR REMOVING CONTAMINANTS IN ELECTROPLATING SYSTEMS
#2 | 2026-01-22ELECTROPLATING WETTING CHAMBER WITH REDUCED BUBBLE ENTRAPMENT
#3 | 2025-04-10ELECTROPLATING CHAMBER USING JET ARRAY TO ENABLE HIGH MASS-TRANSFER
#4 | 2025-01-02ELECTROPLATING WETTING CHAMBER WITH REDUCED BUBBLE ENTRAPMENT
#5 | 2024-10-10PLATING SEAL WITH IMPROVED SURFACE
#6 | 2024-05-16PROCESS CELL FOR FILED GUIDED POST EXPOSURE BAKE PROCESS
#7 | 2024-05-02SEMICONDUCTOR FILM PLATING PERIMETER MAPPING AND COMPENSATION
#8 | 2023-10-05ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENTRATIONS
#9 | 2023-10-05ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENTRATIONS
#10 | 2023-08-31ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENTRATIONS
#11 | 2023-06-27Electroplating systems and methods with increased metal ion concentrations
#12 | 2023-06-01Electroplating system
#13 | 2022-08-18Fluid recovery in semiconductor processing
#14 | 2022-05-12Electroplating system
#15 | 2022-04-28Multi-compartment electrochemical replenishment cell
#16 | 2021-11-11Electroplating system
#17 | 2021-01-28Post exposure processing apparatus
#18 | 2021-01-21Fluid recovery in semiconductor processing
#19 | 2020-12-10Apparatus for post exposure bake
#20 | 2019-12-12Post exposure processing apparatus
#21 | 2019-11-14SYSTEMS AND METHODS FOR REMOVING CONTAMINANTS IN ELECTROPLATING SYSTEMS
#22 | 2019-10-24Seal apparatus for an electroplating system
#23 | 2019-10-24Cleaning components and methods in a plating system
#24 | 2019-08-01Cleaning components and methods in a plating system
#25 | 2018-08-09Post exposure processing apparatus
#26 | 2018-08-02APPARATUS FOR POST EXPOSURE BAKE
#27 | 2018-05-08Post exposure processing apparatus
#28 | 2018-04-19Apparatus for post exposure bake
#29 | 2018-01-04Apparatus for post exposure bake
#30 | 2017-09-14MULTIPLE WAFER ROTARY PROCESSING
#31 | 2016-07-14SUBSTRATE HOLDER ASSEMBLY, APPARATUS, AND METHODS
#32 | 2016-06-23Systems and methods for rinsing and drying substrates
#33 | 2016-06-23Substrate rinsing systems and methods
#34 | 2015-03-26Electrolytic copper process using anion permeable barrier
#35 | 2015-03-12Anneal module for semiconductor wafers
#36 | 2015-02-19METHODS FOR CLEANING A WAFER EDGE INCLUDING A NOTCH
#37 | 2014-12-04Flow battery systems
#38 | 2014-09-04METHODS FOR ELECTROCHEMICAL DEPOSITION OF MULTI-COMPONENT SOLDER USING CATION PERMEABLE BARRIER
#39 | 2014-07-31ELECTROLYTIC PROCESS USING CATION PERMEABLE BARRIER
#40 | 2012-11-22Electrolytic process using cation permeable barrier
#41 | 2012-11-22Electrochemical processor
#42 | 2012-06-21Electrolytic process using anion permeable barrier
#43 | 2012-06-07Processing assembly for semiconductor workpiece and methods of processing same
#44 | 2012-06-07Processing assembly for semiconductor workpiece and methods of processing same
#45 | 2012-03-01Flow battery systems
#46 | 2012-03-01WORKPIECE WETTING AND CLEANING
#47 | 2012-02-16Deplating contacts in an electrochemical plating apparatus
#48 | 2010-04-01Electro-chemical processor
#49 | 2009-05-07Chambers, systems, and methods for electrochemically processing microfeature workpieces
#50 | 2008-09-11APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSING OF MICROELECTRONIC WORKPIECES
#51 | 2008-09-11APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSSING OF MICROELECTRONIC WORKPIECES
#52 | 2008-09-11APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSING OF MICROELECTRONIC WORKPIECES
#53 | 2008-05-15Microelectronic Workpiece Processing Tool Including A Processing Reactor Having A Paddle Assembly for Agitation of a Processing Fluid Proximate to the Workpiece
#54 | 2008-04-15Electroplating apparatus with segmented anode array
#55 | 2008-02-28Electro-chemical processor
#56 | 2008-02-07SONIC AND CHEMICAL WAFER PROCESSOR
#57 | 2008-01-17Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces
#58 | 2008-01-17Apparatus and Method for Thermally Controlled Processing of Microelectronic Workpieces
#59 | 2008-01-17Single side workpiece processing
#60 | 2008-01-03Electro-chemical processor
#61 | 2007-12-27WET CHEMICAL PROCESSING CHAMBERS FOR PROCESSING MICROFEATURE WORKPIECES
#62 | 2007-11-15Reactors, systems, and methods for electroplating microfeature workpieces
#63 | 2007-11-15MULTIPLE WORKPIECE PROCESSOR
#64 | 2007-11-13Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece
#65 | 2007-09-11Workpiece processor having processing chamber with improved processing fluid flow
#66 | 2007-09-04Apparatus and methods for electrochemical processing of microelectronic workpieces
#67 | 2007-08-07Apparatus and method for thermally controlled processing of microelectronic workpieces
#68 | 2007-07-24Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces
#69 | 2007-06-21Single side workpiece processing
#70 | 2007-06-14Apparatus and methods for electrochemical processing of microelectronic workpieces
#71 | 2007-05-15System for processing a workpiece
#72 | 2007-04-19System for processing a workpiece
#73 | 2007-03-29Electrolytic copper process using anion permeable barrier
#74 | 2007-01-30Apparatus and method for deposition of an electrophoretic emulsion
#75 | 2006-12-28Electroprocessing workpiece contact assemblies, and apparatus with contact assemblies for electroprocessing workpieces
#76 | 2006-12-19Apparatus and method for deposition of an electrophoretic emulsion
#77 | 2006-11-23Copper electrolytic process using cation permeable barrier
#78 | 2006-10-26Electrolytic process using cation permeable barrier
#79 | 2006-10-12Microelectronic workpiece holders and contact assemblies for use therewith
#80 | 2006-10-10Electroplating reactor
#81 | 2006-10-03Apparatuses and method for transferring and/or pre-processing microelectronic workpieces
#82 | 2006-08-31Apparatus and method for electrochemically processing a microelectronic workpiece
#83 | 2006-08-31Apparatus and method for electrochemically processing a microelectronic workpiece
#84 | 2006-08-24Method for applying metal features onto barrier layers using ion permeable barriers
#85 | 2006-08-15Apparatus and methods for electrochemical processing of microelectronic workpieces
#86 | 2006-07-27Electrolytic process using anion permeable barrier
#87 | 2006-07-20Electrolytic process using anion permeable barrier
#88 | 2006-02-23Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
#89 | 2006-02-16Method and system for idle state operation
#90 | 2005-11-29Single workpiece processing system
#91 | 2005-10-13System for electrochemically processing a workpiece
#92 | 2005-09-29Apparatus and methods for electrochemical processing of microelectronic workpieces
#93 | 2005-09-22Apparatus and methods for electrochemical processsing of microelectronic workpieces
#94 | 2005-09-22Apparatus and methods for electrochemical processing of microelectronic workpieces
#95 | 2005-09-22Method and apparatus for processing a microfeature workpiece with multiple fluid streams
#96 | 2005-09-08Apparatus and methods for electrochemical processing of microelectronic workpieces
#97 | 2005-09-01Apparatus and methods for electrochemical processing of microelectronic workpieces
#98 | 2005-09-01Apparatus and methods for electrochemical processing of microelectronic workpieces
#99 | 2005-09-01Method and apparatus for copper plating using electroless plating and electroplating
#100 | 2005-08-16Single workpiece processing system
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