Bigfork, Montana
United States
36
2015-03-26
The entities that hold a legal rights for patent applications filed by inventor Ritzdorf Thomas L.:
Thomas L. Ritzdorf from Bigfork, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Electrolytic copper process using anion permeable barrier
#2 | 2014-09-04METHODS FOR ELECTROCHEMICAL DEPOSITION OF MULTI-COMPONENT SOLDER USING CATION PERMEABLE BARRIER
#3 | 2010-05-13Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
#4 | 2008-12-09Method for low temperature annealing of metallization micro-structures in the production of a microelectronic device
#5 | 2008-09-11APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSING OF MICROELECTRONIC WORKPIECES
#6 | 2008-09-11APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSSING OF MICROELECTRONIC WORKPIECES
#7 | 2008-09-11APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSING OF MICROELECTRONIC WORKPIECES
#8 | 2007-09-27TUNING ELECTRODES USED IN A REACTOR FOR ELECTROCHEMICALLY PROCESSING A MICROELECTRONIC WORKPIECE
#9 | 2007-09-04Apparatus and methods for electrochemical processing of microelectronic workpieces
#10 | 2007-07-17Method for filling recessed micro-structures with metallization in the production of a microelectronic device
#11 | 2007-06-12Apparatus for controlling and/or measuring additive concentration in an electroplating bath
#12 | 2007-04-26Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
#13 | 2007-03-13Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
#14 | 2007-02-15Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
#15 | 2006-09-21Method for filling recessed micro-structures with metallization in the production of a microelectronic device
#16 | 2006-03-28Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
#17 | 2006-02-23Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
#18 | 2006-02-21Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device
#19 | 2006-02-07Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device
#20 | 2005-09-29Apparatus and methods for electrochemical processing of microelectronic workpieces
#21 | 2005-09-22Apparatus and methods for electrochemical processsing of microelectronic workpieces
#22 | 2005-09-22Apparatus and methods for electrochemical processing of microelectronic workpieces
#23 | 2005-09-22Method and apparatus for processing a microfeature workpiece with multiple fluid streams
#24 | 2005-09-08Apparatus and methods for electrochemical processing of microelectronic workpieces
#25 | 2005-09-01Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
#26 | 2005-09-01Apparatus and methods for electrochemical processing of microelectronic workpieces
#27 | 2005-09-01Apparatus and methods for electrochemical processing of microelectronic workpieces
#28 | 2005-08-25Tuning electrodes used in a reactor for electrochemically processing a microelectric workpiece
#29 | 2005-08-04Tuning electrodes used in a reactor for electrochemically processing a microelectronics workpiece
#30 | 2005-08-04Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
#31 | 2005-07-26Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
#32 | 2005-05-19Apparatus and method for processing a microelectronic workpiece using metrology
#33 | 2005-05-05Baths, methods, and tools for superconformal deposition of conductive materials other than copper
#34 | 2005-04-21Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
#35 | 2005-03-10Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density
#36 | 2005-01-06Method, chemistry, and apparatus for noble metal electroplating on a microelectronic workpiece
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