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Patent application title:

HEAT SINK ASSEMBLY

Publication number:

US20130014920A1

Publication date:
Application number:

13/444,088

Filed date:

2012-04-11

Abstract:

A heat sink assembly includes a heat sink, a first fan, and a second fan. The heat sink includes a first base contacting a first heat generating element, a first heat pipe connected to the first base, and a fin assembly. The first heat pipe is located in the fin assembly. The first fan defines a first input opening and a first output opening substantially perpendicular to the first input opening. The second fan defines a second input opening and a second output opening substantially parallel to the second input opening. The first and second input openings correspond to the fin assembly.

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Assignee:

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Classification:

  1. Mechanical engineering
  2. -

F28D15/0275 »  CPC main

Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores

F28F1/32 »  CPC further

Tubular elements; Assemblies of tubular elements; Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements

H01L23/427 »  CPC further

Details of semiconductor or other solid state devices; Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements; Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling Cooling by change of state, e.g. use of heat pipes

H01L23/3672 »  CPC further

Details of semiconductor or other solid state devices; Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements; Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks; Cooling facilitated by shape of device Foil-like cooling fins or heat sinks

H01L23/467 »  CPC further

Details of semiconductor or other solid state devices; Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air

H01L2924/0002 »  CPC further

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and

H01L2924/00 »  CPC further

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by

F28D15/04 IPC

Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure

F28D1/03 IPC

Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits

F28F3/00 IPC

Plate-like or laminated elements; Assemblies of plate-like or laminated elements

Description

BACKGROUND

1. Technical Field

The disclosure generally relates to heat sink assemblies, especially to a heat sink assembly with a fan.

2. Description of Related Art

Electronic components, such as central processing units (CPUs), in computers generate a lot of heat that can affect operation and may be prone to damage if the heat is not dissipated from the electronic components efficiently.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an exploded, isometric view of a heat sink assembly of one embodiment.

FIG. 2 is similar to FIG. 1, but viewed from another aspect.

FIG. 3 is an assembly view of FIG. 1.

DETAILED DESCRIPTION

The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.

FIGS. 1 and 2, is a heat sink assembly including a heat sink 10, a first fan 30, and a second fan 50.

The heat sink 10 includes a first base 11, two first heat pipes 12 mounted to the first base 11, a second base 13, a second heat pipe 14 mounted to the second base 13, and a fin assembly 15.

The first base 11 includes a first base body 111 and four first securing portions 113, extending from four corners of the first base body 111. Each first securing portion 113 includes a first fastener 115. The first base body 111 is mounted to a heat generating element (not shown).

The second base 13 includes a second base body 131 and four second securing portions 133, extending from four corners of the second base body 131. Each second securing portion 133 includes a second fastener 135. The second base body 131 is mounted on a second heat generating element (not shown).

The fin assembly 15 includes a first fin module 151 and a second fin module 153. The area of each fin of the first fin module 151 is less than the area of each fin of the second fin module 153. The fin assembly 15 defines a first through hole 155 extending through the first fin module 151 and the second fin module 153. The first through hole 155 corresponds to the first heat pipe 12. The second fin module 153 defines a second through hole 157. The second through hole 157 corresponds to the second heat pipe 14. The extending direction of the first through hole 155 is substantially parallel to the extending direction of the second through hole 157. The second through hole 157 is located above the first through hole 155, and does not extend through the first fin module 151. The fin assembly 15 is L-shaped.

The first fan 30 defines a first input opening 31 and a first output opening 33. The first input opening 31 corresponds to the first fin module 151. The first input opening 31 is substantially perpendicular to the first output opening 33.

The second fan 50 defines a second input opening 51 and a second output opening 53. The second input opening 51 corresponds to the second fin module 153. The second input opening 51 is substantially parallel to the second output opening 53.

FIGS. 1 to 3, show in assembly, the first heat pipe 12 and the second heat pipe 14 are inserted into the first through hole 155 and the second through hole 157. The first fan 30 is mounted to a panel (not shown) to enable the first input opening 31 of the first fan 30 to align with the first fin module 151. The second fan 50 is mounted to the panel to enable the second input opening 51 of the second fan 50 to align with the second fin module 153.

The heat sink assembly has a high efficiency for heat dissipation in an enclosure with little space.

It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of preferred embodiments, together with details of the structures and functions of the preferred embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

What is claimed is:

1. A heat sink assembly, comprising:

a heat sink, the heat sink comprising a first base configured to contact a first heat generating element, a first heat pipe connected to the first base, and a fin assembly; and the first heat pipe located in the fin assembly;

a first fan, the first fan defining a first input opening and a first output opening that is substantially perpendicular to the first input opening; and the first input opening corresponds to the fin assembly; and

a second fan, the second fan defining a second input opening and a second output opening substantially parallel to the second input opening; the second input opening corresponding to the fin assembly.

2. The heat sink assembly of claim 1, wherein the fin assembly comprises a first fin module and a second fin module; the first fin module comprises a plurality of first fins; the second fin module comprises a plurality of second fins; an area of each first fin is greater than an area of each second fin; the first fan corresponds to the first fin module; and the second fan corresponds to the second fin module.

3. The heat sink assembly of claim 2, wherein the fin assembly defines a first through hole extending through the first fin module and the second fin module, and the first heat pipe is located in the first through hole.

4. The heat sink assembly of claim 3, wherein the heat sink further comprises a second base configured to contact a second heat generating element and a second heat pipe connected to the second base; the fin assembly defines a second through hole only extending through the second fin module; and the second heat pipe is located in the second through hole.

5. The heat sink assembly of claim 4, wherein the first through hole defines a first extending direction; the second through hole defines a second extending direction; the first extending direction is substantially parallel to the second extending direction.

6. The heat sink assembly of claim 2, wherein the fin assembly is L-shaped.

7. The heat sink assembly of claim 1, wherein the first base comprises a first base body and four first securing portions extending from four corners of the first base body.

8. The heat sink assembly of claim 7, wherein each first securing portion comprises a fastener configured to mount the first base to a panel.

9. A heat sink assembly, comprising:

a heat sink, the heat sink comprising a first base configured to contact a first heat generating element, a first heat pipe connected to the first base, a second base, a second heat pipe connected to the second base, and a fin assembly; the fin assembly comprising a first fin module and a second fin module aligned with the first fin module; the first heat pipe located in the first fin module and the second fin module; the second heat pipe located in the second fin module; the second heat pipe located above the first heat pipe;

a first fan, the first fan defining a first input opening and a first output opening that is substantially perpendicular to the first input opening; and the first input opening that corresponds to the first fin module; and

a second fan, the second fan defining a second input opening and a second output opening substantially parallel to the second input opening; and the second input opening corresponding to the second fin module;

wherein the first fan and the second fan are located on the same side of the fin assembly.

10. The heat sink assembly of claim 9, wherein the first fin module comprises a plurality of first fins; the second fin module comprises a plurality of second fins; and an area of each first fin is greater than an area of each second fin.

11. The heat sink assembly of claim 10, wherein the fin assembly defines a first through hole extending through the first fin module and the second fin module, and the first heat pipe is located in the first through hole.

12. The heat sink assembly of claim 11, wherein the fin assembly defines a second through hole only extending through the second fin module; and the second heat pipe is located in the second through hole.

13. The heat sink assembly of claim 12, wherein the first through hole defines a first extending direction; the second through hole defines a second extending direction; the first extending direction is substantially parallel to the second extending direction.

14. The heat sink assembly of claim 9, wherein the fin assembly is L-shaped.

15. The heat sink assembly of claim 9, wherein the first base comprises a first base body and four first securing portions extending from four corners of the first base body.

16. The heat sink assembly of claim 15, wherein each first securing portion comprises a fastener configured to mount the first base to a panel.

Resources

Images & Drawings included:

Fig. 01 - HEAT SINK ASSEMBLY
Fig. 01
Fig. 02 - HEAT SINK ASSEMBLY
Fig. 02
Fig. 03 - HEAT SINK ASSEMBLY
Fig. 03
Fig. 04 - HEAT SINK ASSEMBLY
Fig. 04

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