Assignee profile:

Qoniac GmbH

City:

Dresden

Country:

Germany

Published Applications:

11

Last publication date:

2021-06-24

Patent Grants:

11

Last grant date:

2021-08-17

Top Inventors for applications by Qoniac GmbH

These are the the leading inventors for applications assigned to Qoniac GmbH:

Recent patent applications by Qoniac GmbH

Qoniac GmbH based in Dresden, DE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2021-06-24 βœ… Patent 11,092,901 granted on 2021-08-17
US20210191272A1
Physics

Wafer exposure method using wafer models and wafer fabrication assembly

#2 | 2020-07-02 βœ… Patent 11,181,830 granted on 2021-11-23
US20200209762A1
Physics

Lithographic apparatus and method of controlling a lithographic apparatus

#3 | 2019-11-28 βœ… Patent 11,366,397 granted on 2022-06-21
US20190361354A1
Physics

Method and apparatus for simulation of lithography overlay

#4 | 2019-08-15 βœ… Patent 10,739,685 granted on 2020-08-11
US20190250516A1
Physics

Process control method for lithographically processed semiconductor devices

#5 | 2019-08-08 βœ… Patent 10,739,688 granted on 2020-08-11
US20190243255A1
Physics

Method and apparatus for fabricating wafer by calculating process correction parameters

#6 | 2018-11-29 βœ… Patent 10,699,971 granted on 2020-06-30
US20180342429A1
Electricity

Method for processing of a further layer on a semiconductor wafer

#7 | 2017-08-03 βœ… Patent 10,310,490 granted on 2019-06-04
US20170221741A1
Electricity

Method and apparatus of evaluating a semiconductor manufacturing process

#8 | 2017-03-16 βœ… Patent 10,295,914 granted on 2019-05-21
US20170075230A1
Physics

Method and apparatus for fabricating wafer by calculating process correction parameters

#9 | 2017-02-23 βœ… Patent 10,008,422 granted on 2018-06-26
US20170053842A1
Electricity

Method for assessing the usability of an exposed and developed semiconductor wafer

#10 | 2015-01-15 βœ… Patent 10,379,447 granted on 2019-08-13
US20150019192A1
Physics

Method and apparatus for simulation of lithography overlay

#11 | 2014-07-31 βœ… Patent 9,543,223 granted on 2017-01-10
US20140212817A1
Physics

Method and apparatus for fabricating wafer by calculating process correction parameters

Also check out Qoniac GmbH's (Dresden, Germany) applicant profile with 9 patent applications submitted.

AssigneeID:

142263 ⎘