42806 ⎘
Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods; Solder feeding devices; Solder melting pans; Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
Bumping electronic components using transfer substrates
#302Repaired pre-soldering structure of circuit board and method thereof
#303Apparatus and method for supplying electrically conductive material
#304Positioning stage, bump forming apparatus equipped with the positioning stage, and bump forming method performed using the positioning stage
#305Microball placement solutions
#306CONDUCTIVE MEMBER SUPPLY APPARATUS AND CONDUCTIVE MEMBER SUPPLY METHOD
#307Method for step-down transition of a solder head in the injection molding soldering process
#308Mold fill improvements for a molded solder C4 process
#309Solder elements with columnar structures and methods of making the same
#310Ball transferring method and apparatus
#311Method for self-assembling microstructures
#312Ball capturing apparatus, solder ball disposing apparatus, ball capturing method, and solder ball disposing method
#313Arrangement for solder bump formation on wafers
#314Method of providing solder bumps of mixed sizes on a substrate using solder transfer in two stages
#315Semiconductor device, manufacturing method and apparatus for the same
#316METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS
#317Temporary chip attach using injection molded solder
#318Method and device for applying a solder to a substrate
#319Conductive ball arraying apparatus
#320Solder ball loading apparatus
#321Universal mold for injection molding of solder
#322ELECTRICALLY-ISOLATED INTERCONNECTS AND SEAL RINGS IN PACKAGES USING A SOLDER PREFORM
#323Method of forming solder connection portions, method of forming wiring substrate and method of producing semiconductor device
#324ADJOINING APPARATUS AND NOZZLE UNIT THEREFOR
#325Soldering flux and method for bonding semiconductor element
#326Heater, reflow apparatus, and solder bump forming method and apparatus
#327OPTICAL STRUCTURES INCLUDING LIQUID BUMPS
#328System, assembly and method for jetting viscous medium onto a substrate
#329Solder ball placement system
#330Method and apparatus for mounting conductive ball
#331Conductive ball arraying apparatus
#332Damascene patterning of barrier layer metal for C4 solder bumps
#333SOLDERING METHOD AND APPARATUS
#334Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same
#335Method of making a circuitized substrate having a plurality of solder connection sites thereon
#336Printed wiring board
#337Soldering device and method for forming electrical solder connections in a disk drive unit
#338Continuous mode solder jet apparatus
#339Metallic pattern for manufacturing prism sheet and method of manufacturing the same
#340Support with solder ball elements and a method for populating substrates with solder balls
#341Electronic component and electronic configuration
#342Method of bonding metal ball for magnetic head assembly
#343Method for self-assembling microstructures
#344Electrically-isolated interconnects and seal rings in packages using a solder preform
#345Method of soldering or brazing articles having surfaces that are difficult to bond
#346Apparatus and method for solder ball placement
#347Mask and method for electrokinetic deposition and patterning process on substrates
#348Conductive ball mounting apparatus
#349Conductive ball mounting apparatus
#350Soldering method, soldering device, bonding method, bonding device, and nozzle unit
#351Conductive ball mounting method, and apparatus therefor
#352Forming solder balls on substrates
#353Method to accommodate increase in volume expansion during solder reflow
#354METALLIC PLATING FOR SOCKET APPLICATION IN BALL GRID ARRAY PACKAGES
#355METHOD AND APPARATUS FOR MOUNTING AND REMOVING AN ELECTRONIC COMPONENT
#356Ball mounting method
#357Accurate relative alignment and epoxy-free attachment of optical elements
#358Tools and methods for forming conductive bumps on microelectronic elements
#359Soldering method and apparatus
#360Apparatus and method for filling a ball grid array template
#361Continuous mode solder jet apparatus and method
#362Solder ball loading method and solder ball loading unit background of the invention
#363Method of manufacturing a semiconductor device
#364Micro-C-4 semiconductor die and method for depositing connection sites thereon
#365Reinforced solder bump structure and method for forming a reinforced solder bump
#366Solder ball formation and transfer method
#367METHOD OF MITIGATING VOIDS DURING SOLDER REFLOW
#368Method and apparatus for placing conductive balls
#369Method and apparatus for mounting and removing an electronic component
#370Bonding apparatus using conductive material
#371Conductive ball bonding method and conductive ball bonding apparatus
#372Method for supplying solder
#373Method for bonding flip chip on leadframe
#374Dense intermetallic compound layer
#375Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux
#376Damascene patterning of barrier layer metal for C4 solder bumps
#377IMPROVED DECAL SOLDER TRANSFER METHOD
#378Method for fabricating electrical connection structure of circuit board
#379Automated ball mounting process and system with solder ball testing
#380Semiconductor device, manufacturing method and apparatus for the same
#381Optical structures including liquid bumps and related methods
#382Method for the precise and reliable placement of solid metallic and non-metallic particles
#383Method for forming interconnects on thin wafers
#384Injection molded continuously solidified solder method and apparatus
#385Flip chip bonding tool and ball placement capillary
#386Method of connecting wiring member
#387Bumpless die and heat spreader lid module bonded to bumped die carrier
#388Solder bump structure and method for forming a solder bump
#389Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same
#390Area array and leaded SMT component stenciling apparatus and area array reballing method
#391Ball transferring method and apparatus
#392Colored conductive wires for a semiconductor package
#393Bumping electronic components using transfer substrates
#394Solder contact reworking using a flux plate and squeegee
#395Method and apparatus for conductive ball bonding of components
#396Apparatus for immobilizing a solid solder element to a contact surface of interest
#397Ball mounting method
#398Rapid surface cooling of solder droplets by flash evaporation
#399Connection site coating method and solder joints
#400Process of manufacturing a solder-fill for applying to semiconductor package
#401Method and system for forming ball grid array ("BGA") packages
#402Solder ball bonding method and bonding device
#403Solder ball supplying method and supplying device
#404Solder-fill application for mounting semiconductor chip on PCB
#405Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device
#406Fluidization of agglomerated solder microspheres
#407Injection molded solder bumping
#408Refillable apparatus for aligning and depositing solder columns in a column grid array