LOW STRESS FLIPCHIP MEMS PACKAGE

SENSOR PACKAGE AND SENSING MODULE THEREOF

HIGH RELIABILITY SENSOR

MONOCRYSTALLINE NICKEL-TITANIUM FILMS ON SINGLE CRYSTAL SILICON SUBSTRATES USING SEED LAYERS

STRESS ISOLATION USING THREE-DIMENSIONAL TRENCHES

MEMS DIES EMBEDDED IN GLASS CORES

LENS AND EYEWEAR

STRESS ISOLATION PROCESS

MEMS MODULE

Application specific integrated circuit (ASIC) chip, and sensor and electric toothbrush using same

MEMS MODULE

ENCAPSULATION STRUCTURE, SUBSTRATE, AND ENCAPSULATION METHOD

MICROELECTROMECHANICAL DEVICE AND PROCESS FOR MANUFACTURING A MICROELECTROMECHANICAL DEVICE

STRESS ISOLATION FOR INTEGRATED CIRCUIT PACKAGE INTEGRATION

MEMS DEVICE

PRESSURE SENSOR STRUCTURE, PRESSURE SENSOR DEVICE, AND METHOD OF MANUFACTURING PRESSURE SENSOR STRUCTURE

MICRO-MIRROR DIE ATTACHED TO A PACKAGE SUBSTRATE THROUGH DIE ATTACH MATERIALS WITH DIFFERENT YOUNG'S MODULUSES

SINGLE-AXIS INERTIAL SENSOR MODULE WITH INTERPOSER

Attachment of Stress Sensitive Integrated Circuit Dies

Method of forming monocrystalline nickel-titanium films on single crystal silicon substrates using seed layers

INTEGRATED CIRCUIT PACKAGE WITH WARPAGE CONTROL USING CAVITY FORMED IN LAMINATED SUBSTRATE BELOW THE INTEGRATED CIRCUIT DIE

Vibrator device, oscillator, gyro sensor, electronic apparatus, and vehicle

PRESSURE SENSOR ASSEMBLY

MEMS stress reduction structure embedded into package

Methods and apparatuses for packaging an ultrasound-on-a-chip

Sensor device and sensor

MEMS strain gauge pressure sensor with mechanical symmetries

Low-stress packaging structure for MEMS acceleration sensor chip

Sensor Arrangement and Method for Fabricating A Sensor Arrangement

PHYSICAL QUANTITY SENSOR AND SEMICONDUCTOR DEVICE

Stress isolation using three-dimensional trenches

Low stress integrated device package

MEMS PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

Method and apparatus for a transducer assembly with a standoff

Constraint for a sensor assembly

Sensor device

Reducing delamination in sensor package

Stress-isolated MEMS device comprising substrate having cavity and method of manufacture

Micromechanical sensor device having an ASIC chip integrated into a capping unit and corresponding manufacturing method

Electronic assembly and pressure measurement device with improved durability

Sensor package and method of producing the sensor package

Semiconductor package structures and methods of manufacturing the same

MEMS microphone and method of manufacture

Surface micromechanical element and method for manufacturing the same

PHYSICAL QUANTITY SENSOR AND SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

Use of an uncoupling structure for assembling a component having a casing

Attachment of stress sensitive integrated circuit dies

Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

Segmented stress decoupling via frontside trenching

Inertial sensor, electronic instrument, vehicle, and method for manufacturing inertial sensor

Micromechanical pressure sensor device and corresponding manufacturing method

Segmented stress decoupling via frontside trenching

Mechanical stress decoupling for microelectromechanical systems (MEMS) elements with gel-filling

Vibrator device, oscillator, gyro sensor, electronic apparatus, and vehicle

Method for manufacturing micromechanical diaphragm sensors

Device for Attaching Two Elements Such as a Chip, an Interposer and a Support

Decoupling structure for accelerometer

Conductor path structure having a component received in a vibration-damped manner

Carrier substrate for stress sensitive device and method of manufacture

Sensor package

Method for manufacturing a MEMS unit for a micromechanical pressure sensor

MEMS package and method of manufacturing the same

MEMS device stress-reducing structure

Sensor package and method of producing the sensor package

System of non-acoustic sensor combined with MEMS microphone

PHYSICAL QUANTITY SENSOR AND SEMICONDUCTOR DEVICE

Physical quantity sensor, inertial measurement unit, electronic apparatus, portable electronic apparatus, and vehicle

Methods and apparatuses for packaging an ultrasound-on-a-chip

Microphone and pressure sensor package and method of producing the microphone and pressure sensor package

Bulk acoustic wave resonator on a stress isolated platform

PRESSURE SENSOR

Method for producing a stress-decoupled micromechanical pressure sensor

Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

Sensor assembly and arrangement and method for manufacturing a sensor assembly

Synthetic resin molded article and method for producing the same

Electronic sensors with sensor die in package structure cavity

Surface micromechanical element and method for manufacturing the same

REDUCING VIBRATION OF A MEMS INSTALLATION ON A PRINTED CIRCUIT BOARD

Electroacoustic transducer

Inductively coupled microelectromechanical system resonator

Physical quantity sensor, complex sensor, inertial measurement unit, portable electronic device, electronic device, and vehicle

Physical quantity sensor, complex sensor, inertial measurement unit, portable electronic device, electronic device, and vehicle

PHYSICAL QUANTITY SENSOR, COMPLEX SENSOR, INERTIAL MEASUREMENT UNIT, PORTABLE ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND VEHICLE

Stress isolation platform for MEMS devices

Microelectromechanical systems and method of manufacturing the same

Actuator device

Method and structure of attachment layer for reducing stress transmission to attached MEMS die

Multi-layer, stress-isolation platform for a MEMS die

Vibrator device, oscillator, gyro sensor, electronic apparatus, and vehicle

Conductor path structure having a component received in a vibration-damped manner

Resiliently mounted sensor system with damping

MEMS isolation platform with three-dimensional vibration and stress isolation

Out-of plane-accelerometer

Electronic sensors with sensor die in package structure cavity

Semiconductor package with a through port for sensor applications

Microelectromechanical sensor device with reduced stress-sensitivity and corresponding manufacturing process

Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

Micro electromechanical systems (MEMS)inertial sensor

Semiconductor packages having an electric device with a recess

Module comprising a MEMS component mounted without subjecting same to stress

Low stress integrated device packages

Method and structure of MEMS PLCSP fabrication

Micromechanical device having a decoupled micromechanical structure

Stress decoupling in MEMS transducers

Sensor unit including a decoupling structure and manufacturing method therefor

Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

ANGULAR VELOCITY SENSOR HAVING SUPPORT SUBSTRATES

Packaged microsystems

Strain decoupled sensor

Structures and process for preventing a projection of the laser resealing structure beyond the wafer surface

MEMS element including a stress decoupling structure and a component including such a MEMS element

Mechanical low pass filter for motion sensors

Various stress free sensor packages using wafer level supporting die and air gap technique

Encapsulated device of semiconductor material with reduced sensitivity to thermo-mechanical stresses

INTERPOSER FOR MOUNTING A VERTICALLY INTEGRATED HYBRID COMPONENT ON A COMPONENT CARRIER

Microelectromechanical sensor device with reduced stress-sensitivity and corresponding manufacturing process

Mechanically isolated MEMS device

Microphone and method for producing a microphone

Strain Reduction and Sensing on Package Substrates

Stress relief MEMS structure and package

Stress isolation features for stacked dies

Pressure sensor package with stress isolation features

Method of lower profile MEMS package with stress isolations

Integrated device die and package with stress reduction features

Micromechanical pressure sensor device and corresponding manufacturing method

MEMS Sensor Component

Electromechanical device including a suspended structure and method of fabricating the same

Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applications

MEMS cavity substrate

Packaged Microchip with Patterned Interposer

Stress relief MEMS structure and package

Z-axis microelectromechanical detection structure with reduced drifts

Stress isolated differential pressure sensor

Hermetically sealed package having stress reducing layer

MEMS cavity substrate

Micromechanical sensor device and corresponding manufacturing method

Method and apparatus of making MEMS packages

Microintegrated encapsulated MEMS sensor with mechanical decoupling and manufacturing process thereof

Stress isolation for MEMS device

Integrated device packages having a MEMS die sealed in a cavity by a processor die and method of manufacturing the same

Stress isolation platform for MEMS devices

Various stress free sensor packages using wafer level supporting die and air gap technique

Hermetically sealed package having stress reducing layer

MONOLITHIC INTEGRATION OF STRESS ISOLATION FEAUTURES IN A MICROELECTROMECHANICAL SYSTEM (MEMS) STRUCTURE

Sensor apparatus and method for producing a sensor apparatus

Die interconnect

Sensor and method for manufacturing a sensor

Device including interposer between semiconductor and substrate

Functional device, acceleration sensor, and switch

Micromechanical sensor device

Microelectromechanical device with protection for bonding

Pressure sensor package with integrated sealing

DEVICE WITH A MICRO- OR NANOSCALE STRUCTURE

Strain decoupled sensor

Apparatus and method for reduced strain on MEMS devices

MEMS pressure transducer assembly

Microelectromechanical device and a method of manufacturing

Micro-electromechanical structure with low sensitivity to thermo-mechanical stress

Semiconductor packages having an electric device with a recess

Angular velocity sensor for suppressing fluctuation of detection sensitivity

MEMS device with stress relief structures

Micro-electromechanical pressure sensor having reduced thermally-induced stress

Sensor package

Stress isolated MEMS structures and methods of manufacture

Controlled area solder bonding for dies

MEMS pressure transducer assembly and method of packaging same

Semiconductor component and corresponding production method

Die attach stress isolation

Semiconductor package substrate in particular for MEMS devices

Thin semiconductor die package

Unattached contained semiconductor devices

Component assembly using a temporary attach material

Method for retaining a device to a substrate

Micro-electro-mechanical systems (MEMS)

Vertical mount package for MEMS sensors

MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME

MEMS SENSOR PACKAGE

Electronic component device, method of manufacturing the same and wiring substrate

MEMS Sensor Package

SENSOR APPARATUS AND METHOD FOR MOUNTING SEMICONDUCTOR SENSOR DEVICE

MEMS microphone

PACKAGED DEVICE INCLUDING A WELL FOR CONTAINING A DIE

MEMS TRANSDUCER DEVICE HAVING STRESS MITIGATION STRUCTURE AND METHOD OF FABRICATING THE SAME

MICROELECTROMECHANICAL SYSTEMS (MEMS) PACKAGE

Sensor module and method for producing sensor modules

Component comprising a chip in a cavity and a stress-reduced attachment

Microstructural body and production method therefor

Sensor system

Micromechanical system and method for manufacturing a micromechanical system

MICROELECTROMECHANICAL SENSOR DEVICE PACKAGE AND METHOD FOR MAKING THE SAME

System support for electronic components and method for production thereof

Manufacturing method for electronic component, electronic component, and electronic equipment

SUSPENDED LEAD FRAME ELECTRONIC PACKAGE

High bond line thickness for semiconductor devices

Acceleration sensor

MEMS device and interposer and method for integrating MEMS device and interposer

Mechanical isolation for MEMS electrical contacts

Isolated active temperature regulator for vacuum packaging of a disc resonator gyroscope

SYSTEMS AND METHODS FOR AFFIXING A SILICON DEVICE TO A SUPPORT STRUCTURE

Package interface plate for package isolation structures

Electronic component with mechanically decoupled ball connections

Sensor device and manufacturing method thereof

Systems and methods for affixing a silicon device to a support structure

MEMS devices and methods with controlled die bonding areas

Vertical mount package for MEMS sensors

Semiconductor package substrate

Sensor device including two sensors embedded in a mold material

Microelectromechanical system package with strain relief bridge

Electromechanical device comprising electronic components and at least one nanotube-based interface, and manufacturing method

Microelectromechanical device and method for manufacturing the same

Microwave Cure of Semiconductor Devices

THREE-DIMENSIONAL MODULE

Mechanical isolation for MEMS devices

Wafer level package structure and production method therefor

Mounting arrangement

SENSOR ARRAY HAVING A SUBSTRATE AND A HOUSING, AND METHOD FOR MANUFACTURING A SENSOR ARRAY

Die mounting stress isolator

Stress-Isolated MEMS Device and Method Therefor

Sensor device for detecting physical quantity

Design of MEMS Packaging

Sensor device, sensor system and methods for manufacturing them

Manufacturing method for electronic component with sealing film

Semiconductor package substrate and methods for forming same, in particular for MEMS devices

Method for manufacturing electronic component, and electronic component

Semiconductor package substrate and method, in particular for MEMS devices

MEMS device and interposer and method for integrating MEMS device and interposer

Semiconductor device having microstructure and method of manufacturing microstructure

MECHANICAL ISOLATION FOR MEMS DEVICES

MEMS device package with thermally compliant insert

Integrated Pedestal Mount for MEMS Structure

Electronic device having a groove partitioning functional and mounting parts from each other

Electronic assembly and method for forming the same

Discrete stress isolator attachment structures for MEMS sensor packages

Semiconductor dynamic sensor and method of manufacturing the same

MEMS PERFORMANCE IMPROVEMENT USING HIGH GRAVITY FORCE CONDITIONING

Semiconductor device with acceleration sensor

Method for producing a polymer structure on a substrate surface

Micromirror array device with compliant adhesive

Manufacturing method for electronic component, electronic component, and electronic equipment

Acceleration sensor

Micro-electromechanical structure with improved insensitivity to thermomechanical stresses induced by the package

Device packages with low stress assembly process

Sensor isolation system

Method for mounting semiconductor chips and corresponding semiconductor chip system

Acceleration sensor system

Device packages with low stress assembly process

Stress sensitive microchip with premolded-type package

Method for integrating MEMS device and interposer

Packaged microchip with premolded-type package

MEMS assembly substrates including a bond layer

Configurable micro-electro-mechanical systems (MEMS) transfer switch and methods

Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device