B81C1/005 - CPC Classification Index

ClassID:

83978 ⎘

B81C1/005 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate; Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate Bulk micromachining

Sub-classes:

B81C1/00507 » {Formation of buried layers by techniques other than deposition, e.g. by deep implantation of elements } 13
B81C1/00515 » {Bulk micromachining techniques not provided for in } 13

Recent Application in this class:

20120074527

2012-03-29

Integrated circuit comprising a device with a vertical mobile element integrated in a support substrate and method for producing the device with a mobile element

20110073560

2011-03-31

Microneedle structure and production method therefor

20110034031

2011-02-10

Manufacturing method of semiconductor device including etching step

20100106105

2010-04-29

Microneedle structure and production method therefor

20050029223

2005-02-10

Microneedle structure and production method therefor