ClassID:

83987

B81C1/00571 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate; Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate; Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity; Avoid or control over-etching Avoid or control under-cutting

Recent Application in this class:
#1
20260116744
2026-04-30

METHOD OF FABRICATING MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE

#2
20240375942
2024-11-14

DOUBLE NOTCH ETCH TO REDUCE UNDER CUT OF MICRO ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICES

#3
20230294980
2023-09-21

MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICES AND FABRICATION METHODS THEREOF

#4
20230219808
2023-07-13

METHOD FOR PRODUCING A BONDING PAD FOR A MICROMECHANICAL SENSOR ELEMENT

#5
20200369512
2020-11-26

Method of manufacturing a microelectromechanical systems (MEMS) device

#6
20200369511
2020-11-26

Sidewall stopper for MEMS device

#7
20200102209
2020-04-02

Sidewall stopper for MEMS device

#8
20200055728
2020-02-20

MEMS ISOLATION STRUCTURES

#9
20180029879
2018-02-01

MEMS isolation structures

#10
20170365507
2017-12-21

Field emission devices and methods of making thereof

#11
20170362081
2017-12-21

MEMS structure and method of fabricating the same

#12
20170040076
2017-02-09

Method of manufacturing high aspect ratio structure and method of manufacturing ultrasonic probe

#13
20160272485
2016-09-22

MEMS isolation structures

#14
20160133546
2016-05-12

Method of making a semiconductor device package with dummy gate

#15
20160112807
2016-04-21

MEMS microphone structure and method of manufacturing the same

#16
20160054160
2016-02-25

Vacuum-cavity-insulated flow sensors

#17
20150197420
2015-07-16

Micro-electro-mechanical-system device with guard ring and method for making same

#18
20150102465
2015-04-16

Material quality, suspended material structures on lattice-mismatched substrates

#19
20150031161
2015-01-29

Inertial sensor and method of manufacturing the same

#20
20140363968
2014-12-11

Method of making a semiconductor device package

#21
20140069185
2014-03-13

Vacuum cavity-insulated flow sensors

#22
20140036342
2014-02-06

Electrical routing

#23
20140028192
2014-01-30

Field emission devices and methods of making thereof

#24
20120133002
2012-05-31

Method for producing MEMS structures, and MEMS structure

#25
20120119611
2012-05-17

Electrical routing

#26
20120119325
2012-05-17

Guard trench

#27
20120119324
2012-05-17

MEMS isolation structures

#28
20120098122
2012-04-26

Wafer level packaging of micro-electro-mechanical systems (MEMS) and complementary metal-oxide-semiconductor (CMOS) substrates

#29
20120068276
2012-03-22

Microstructure with an enhanced anchor

#30
20120043626
2012-02-23

Microstructure device with an improved anchor

#31
20110314435
2011-12-22

Etching technique for creation of thermally-isolated microstructures

#32
20110290022
2011-12-01

Inertial sensor and method of manufacturing the same

#33
20110250397
2011-10-13

Method of forming an undercut microstructure

#34
20110223771
2011-09-15

Wet metal-etching method and apparatus for MEMS device fabrication

#35
20100213568
2010-08-26

Micro-electro-mechanical-system device with guard ring and method for making same

#36
20090061578
2009-03-05

Method of Manufacturing a Semiconductor Microstructure

#37
20080245674
2008-10-09

SYSTEM AND METHOD FOR OBTAINING ANISOTROPIC ETCHING OF PATTERNED SUBSTRATES

#38
20080179713
2008-07-31

Etching technique for creation of thermally-isolated microstructures

#39
20080050919
2008-02-28

High aspect ratio via etch

#40
20080023441
2008-01-31

METHOD OF DEEP ETCHING

#41
20080007814
2008-01-10

MEMS structure and method of fabricating the same

#42
20070281489
2007-12-06

Methods for minimizing mask undercuts and notches for plasma processing system

#43
20060219654
2006-10-05

Silicon substrate comprising positive etching profiles with a defined slope angle, and production method

#44
20060209520
2006-09-21

Method of manufacturing a wiring board

#45
20060108576
2006-05-25

Layer system comprising a silicon layer and a passivation layer, method for production a passivation layer on a silicon layer and the use of said system and method

#46
20060099811
2006-05-11

Method for structuring of silicon substrates for microsystem technological device elements and associated silicon substrate

#47
20060068510
2006-03-30

Layer and system with a silicon layer and a passivation layer, method for production of a passivation layer on a silicon layer and use thereof

#48
20060021965
2006-02-02

Method of double-sided etching

#49
20050224449
2005-10-13

Corner compensation method for fabricating MEMS and structure thereof