ClassID:

83986

B81C1/00563 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate; Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate; Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity Avoid or control over-etching

Sub-classes:
Recent Application in this class: