ClassID:

83988

B81C1/00579 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate; Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate; Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity; Avoid or control over-etching Avoid charge built-up

Recent Application in this class:
#1
20190144265
2019-05-16

Wafer level packaging for MEMS device

#2
20190023563
2019-01-24

Method of production of semiconductor device having semiconductor layer and support substrate spaced apart by recess

#3
20170166435
2017-06-15

Semiconductor devices with moving members and methods for making the same

#4
20120313235
2012-12-13

Semiconductor devices with moving members and methods for making the same

#5
20120223613
2012-09-06

Electrical bypass structure for MEMS device

#6
20090068781
2009-03-12

Method of manufacture for microelectromechanical devices

#7
20080233673
2008-09-25

Method for fabrication MEMS-resonator

#8
20080160251
2008-07-03

Switches for shorting during MEMS etch release

#9
20080032501
2008-02-07

SILICON ON METAL FOR MEMS DEVICES

#10
20080029481
2008-02-07

Methods for reducing surface charges during the manufacture of microelectromechanical systems devices

#11
20060110843
2006-05-25

Method of manufacturing external force detection sensor

#12
20060081929
2006-04-20

Silicon-on-insulator substrate, fabricating method thereof, and method for fabricating floating structure using the same

#13
20060014358
2006-01-19

Method for microfabricating structures using silicon-on-insulator material

#14
20060006139
2006-01-12

Selection of wavelengths for end point in a time division multiplexed process

#15
20050249966
2005-11-10

Method of manufacture for microelectromechanical devices

#16
20050212077
2005-09-29

Dissipation of a charge buildup on a wafer portion

#17
20050132798
2005-06-23

Method for fabricating a gyroscope