ClassID:

83989

B81C1/00587 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate; Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate; Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity; Avoid or control over-etching Processes for avoiding or controlling over-etching not provided for in  - 

Recent Application in this class:
#1
20230239628
2023-07-27

Package structure of micro speaker and method for forming the same

#2
20220204394
2022-06-30

Method for producing microstructures in a glass substrate

#3
20210002131
2021-01-07

Method for manufacturing micromechanical structures in a device wafer

#4
20190256350
2019-08-22

Method for manufacturing microelectromechanical system structure having a cavity and through-holes of different widths

#5
20190172721
2019-06-06

Insulator semiconductor device-structure

#6
20190119105
2019-04-25

MEMS method and structure

#7
20190084826
2019-03-21

Through silicon interposer wafer and method of manufacturing the same

#8
20180346326
2018-12-06

Method for manufacturing micromechanical structures in a device wafer

#9
20180068888
2018-03-08

Method for reducing cracks in a step-shaped cavity

#10
20180068864
2018-03-08

Method for preventing excessive etching of edges of an insulator layer

#11
20170154830
2017-06-01

Method of manufacturing semiconductor device

#12
20170036905
2017-02-09

MEMS structure with an etch stop layer buried within inter-dielectric layer

#13
20160325988
2016-11-10

MEMS method and structure

#14
20160137494
2016-05-19

Electronic device, physical quantity sensor, pressure sensor, altimeter, electronic apparatus, and moving object

#15
20150259198
2015-09-17

Methods of forming MEMS device

#16
20150024605
2015-01-22

Substrate processing method

#17
20150008788
2015-01-08

Low temperature ceramic Microelectromechanical structures

#18
20140264644
2014-09-18

MEMS method and structure

#19
20130026659
2013-01-31

MICROELECTRONIC COMPONENT

#20
20120025333
2012-02-02

MEMS element and method for manufacturing same

#21
20110186945
2011-08-04

MEMS diaphragm

#22
20110169110
2011-07-14

MEMS diaphragm

#23
20110111545
2011-05-12

Low temperature ceramic microelectromechanical structures

#24
20100090298
2010-04-15

MEMS diaphragm

#25
20080134757
2008-06-12

Method And Apparatus For Monitoring Plasma Conditions In An Etching Plasma Processing Facility

#26
20080113087
2008-05-15

Method for quantifying over-etch of a conductive feature

#27
20070119814
2007-05-31

APPARATUS AND METHOD FOR DETECTING AN ENDPOINT IN A VAPOR PHASE ETCH

#28
20070077727
2007-04-05

Method of forming a cavity by two-step etching and method of reducing dimension of a MEMS device

#29
20060211253
2006-09-21

Method and apparatus for monitoring plasma conditions in an etching plasma processing facility

#30
20060180882
2006-08-17

MEMS device and manufacturing method of MEMS device

#31
20060110843
2006-05-25

Method of manufacturing external force detection sensor

#32
20060068564
2006-03-30

Micromachined electromechanical device

#33
20060024965
2006-02-02

Method of etching cavities having different aspect ratios

#34
20050014306
2005-01-20

Micromachined electromechanical device