84065 ⎘
Manufacture or treatment of microstructural devices or systems in or on a substrate; Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning; Surface micromachining Chemical-mechanical polishing [CMP]
METHOD FOR PRODUCING A MICROMECHANICAL LAYER STRUCTURE WITH HIGH ASPECT RATIO AND MICROMECHANICAL LAYER STRUCTURE
#2METHOD OF FABRICATING MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE
#3METHOD FOR PRODUCING MICROELECTROMECHANICAL STRUCTURES
#4MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) AND METHODS OF FABRICATING THE SAME
#5Reliable and Robust Zero Power Micro-Mechanical Switch
#6MEMS transducer having a carrier layer and at least two piezoelectric layers
#7ANCHOR STRUCTURE
#8MEMS Array Structures for Gyroscopes with High Resonant Frequencies
#9MEMS DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS
#10LOW VOLTAGE CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER (CMUT) DESIGN AND MANUFACTURING FLOW
#11DAMASCENE INTERCONNECT STRUCTURE, ACTUATOR DEVICE, AND METHOD OF MANUFACTURING DAMASCENE INTERCONNECT STRUCTURE
#12LOW NOISE ELECTROACOUSTIC TRANSDUCER AND METHOD FOR MANUFACTURING THE SAME
#13CMUT-on-CMOS ultrasonic transducer by bonding active wafers and manufacturing method thereof
#14MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICES AND FABRICATION METHODS THEREOF
#15Microelectromechanical infrared sensing device and fabrication method thereof
#16Damascene interconnect structure, actuator device, and method of manufacturing damascene interconnect structure
#17Substrate for sensing, a method of fabricating the substrate, and analyzing apparatus including the substrate
#18MANUFACTURING METHOD FOR BONDED SUBSTRATE
#19Method for manufacturing an etch stop layer and MEMS sensor comprising an etch stop layer
#20Curved micromachined ultrasonic transducer membranes
#21Process for forming inkjet nozzle devices
#22Actuator layer patterning with topography
#23Process for filling etched holes using first and second polymers
#24Method for manufacturing planar thin packages
#25Substrate for sensing, a method of fabricating the substrate, and analyzing apparatus including the substrate
#26Micro-electro-mechanical system (MEMS) structures and design structures
#27Micro-electro-mechanical system (MEMS) structures and design structures
#28Micro-electro-mechanical system (MEMS) structures and design structures
#29Process for filling etched holes using photoimageable thermoplastic polymer
#30Batch-processing method for super-high aspect ratio diffractive optics
#31TRANSDUCER ELEMENT AND METHOD OF MANUFACTURING A TRANSDUCER ELEMENT
#32Polishing slurry for silicon, method of polishing polysilicon and method of manufacturing a thin film transistor substrate
#33Substrate structure, semiconductor structure and method for fabricating the same
#34Nanogap structure for micro/nanofluidic systems formed by sacrificial sidewalls
#35Nanogap structure for micro/nanofluidic systems formed by sacrificial sidewalls
#36Method of increasing MEMS enclosure pressure using outgassing material
#37Chip structure
#38Method for Manufacturing Hollow Structure
#39Micro-electro-mechanical system (MEMS) structures and design structures
#40Micro-electro-mechanical system (MEMS) structures and design structures
#41Micro-Electro-Mechanical System (MEMS) structures and design structures
#42Curved RF electrode for improved Cmax
#43Process for filling etched holes
#44Method for adaptive feedback controlled polishing
#45Method to improve cantilever process performance
#46Ultrasonic transducer, method of producing same, and ultrasonic probe using same
#47Micro-electro-mechanical system (MEMS) structures and design structures
#48Device having element electrode connected to penetrating wire, and method for manufacturing the same
#49Method for forming micro-electro-mechanical system (MEMS) beam structure
#50Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
#51Polishing composition for nickel-phosphorous-coated memory disks
#52Method of forming non-planar membranes using CMP
#53Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
#54Electrochemical Fabrication Methods for Producing Multilayer Structures Including the use of Diamond Machining in the Planarization of Deposits of Material
#55ULTRASONIC TRANSDUCER, METHOD OF PRODUCING SAME, AND ULTRASONIC PROBE USING SAME
#56THINNING METHOD AND SILICON WAFER BASED STRUCTURE
#57CMP process flow for MEMS
#58Semiconductor device and method of manufacturing the same
#59Method and Apparatus for Maintaining Parallelism of Layers and/or Achieving Desired Thicknesses of Layers During the Electrochemical Fabrication of Structures
#60Electrochemical Fabrication Methods for Producing Multilayer Structures Including the use of Diamond Machining in the Planarization of Deposits of Material
#61Method for selective CMP of polysilicon
#62Thinning
#63Ultra-flat reflective MEMS optical elements
#64Electrochemical fabrication methods for producing multilayer structures including the use of diamond machining in the planarization of deposits of material
#65Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
#66Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
#67Micromechanical component and method for producing same
#68Substrate structure, semiconductor structure and method for fabricating the same