84071 ⎘
Manufacture or treatment of microstructural devices or systems in or on a substrate; Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning; Bulk micromachining Bosch process
DRIVE ELEMENT AND OPTICAL DEFLECTION ELEMENT
#2MEMS DEVICES SINGULATED BY PLASMA ETCH
#3LIQUID EJECTION CHIP AND METHOD FOR MANUFACTURING LIQUID EJECTION CHIP
#4ETCHING METHOD
#5Method for manufacturing mirror device
#6Etching method
#7Preparation Method Of Miniature Solid Silicon Needle
#8Inertial sensor, method for manufacturing inertial sensor, inertial measurement unit, portable electronic apparatus, electronic apparatus, and vehicle
#9Method for manufacturing micromechanical structures in a device wafer
#10Structure forming method and device
#11Method of fabricating a micro machined channel
#12Method of fabricating semiconductor structure
#13Methods for multiple-patterning nanosphere lithography for fabrication of periodic three-dimensional hierarchical nanostructures
#14MEMS microphone and manufacturing method for making same
#15Sensor
#16Method for producing a stress-decoupled micromechanical pressure sensor
#17Inertial sensor, method for manufacturing inertial sensor, inertial measurement unit, portable electronic apparatus, electronic apparatus, and vehicle
#18Method of fabricating semiconductor structure
#19Method of production of semiconductor device having semiconductor layer and support substrate spaced apart by recess
#20Method for fabricating laterally insulated integrated circuit chips
#21Method for manufacturing micromechanical structures in a device wafer
#22Material structure and method for deep silicon carbide etching
#23MEMS grid for manipulating structural parameters of MEMS devices
#24Method of manufacturing semiconductor device
#25Micromechanical component with a reduced contact surface and its fabrication method
#26Recess with tapered sidewalls for hermetic seal in MEMS devices
#27Multi-level micromechanical structure
#28METHODS FOR FABRICATING HIGH ASPECT RATIO PROBES AND DEFORMING HIGH ASPECT RATIO NANOPILLARS AND MICROPILLARS
#29Semiconductor element and methods for manufacturing the same
#30Microstructured substrate
#31Etching method for forming a carrier having inward side walls in particular for confining a droplet for capillary self-assembly
#32Substrate for diaphragm-type resonant MEMS devices, diaphragm-type resonant MEMS device and method for manufacturing same
#33Methods and apparatus for MEMS devices with increased sensitivity
#34Substrate etching method
#35Semiconductor device having a micro-mechanical structure
#36Reduction of chipping damage to MEMS structure
#37Reactive ion etching
#38Method for producing trench-like depressions in the surface of a wafer
#39Method for achieving smooth side walls after Bosch etch process
#40Methods for etching a substrate
#41Dry etching method
#42Method for creating a micromechanical membrane structure and MEMS component
#43Method of forming and patterning conformal insulation layer in vias and etched structures
#44Robust high aspect ratio semiconductor device
#45METHOD OF ETCHING BACKSIDE INK SUPPLY CHANNELS FOR AN INKJET PRINTHEAD
#46Method and apparatus for etching
#47Methods for fabricating high aspect ratio probes and deforming high aspect ratio nanopillars and micropillars
#48Methods for fabrication of high aspect ratio micropillars and nanopillars
#49Method of forming an ink supply channel
#50Method for producing porous microneedles and their use
#51Deep anisotropic silicon etch method
#52Small scale wires with microelectromechanical devices
#53Method of removing a polymer coating from an etched trench
#54Method of modifying an etched trench
#55Method and device for anisotropic etching of high aspect ratio
#56Method for manufacturing movable portion of semiconductor device
#57Gap tuning for surface micromachined structures in an epitaxial reactor