ClassID:

84074

B81C2201/0116 - CPC Classification

Classification description:

Manufacture or treatment of microstructural devices or systems in or on a substrate; Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning; Bulk micromachining Thermal treatment for structural rearrangement of substrate atoms, e.g. for making buried cavities

Recent Application in this class:
#1
20260152384
2026-06-04

MEMS DEVICE WITH COMPENSATION OF THE MECHANICAL STRESS AND RELATED MANUFACTURING PROCESS

#2
20260054980
2026-02-26

METHOD OF MANUFACTURING A LAYERED STRUCTURE FOR A MEMS APPARATUS AND MEMS APPARATUS HAVING SUCH A LAYERED STRUCTURE

#3
20250326630
2025-10-23

MICROMECHANICAL ARM ARRAY FOR MEMS ACTUATORS

#4
20240182298
2024-06-06

METHOD FOR PRODUCING A MICROELECTROMECHANICAL COMPONENT

#5
20230375416
2023-11-23

Micro-Electro-Mechanical System (Mems) Thermal Sensor

#6
20220386052
2022-12-01

MEMS microphone and preparation method therefor

#7
20210215550
2021-07-15

Micro-electro-mechanical system (MEMS) thermal sensor

#8
20210193488
2021-06-24

ANNEALING DEVICES INCLUDING THERMAL HEATERS

#9
20200363629
2020-11-19

Process for manufacturing a MEMS micromirror device, and associated device

#10
20200236470
2020-07-23

Microelectromechanical electroacoustic transducer with piezoelectric actuation and corresponding manufacturing process

#11
20200103290
2020-04-02

Micro-electro-mechanical system (MEMS) thermal sensor

#12
20200081160
2020-03-12

Method for producing a reflection-reducing layer system

#13
20200024132
2020-01-23

Micro-electro-mechanical device and manufacturing process thereof

#14
20190292045
2019-09-26

Integrated micro-electromechanical device of semiconductor material having a diaphragm

#15
20190233280
2019-08-01

METHOD FOR PROCESSING SILICON WAFER WITH THROUGH CAVITY STRUCTURE

#16
20190202688
2019-07-04

Method for transferring a useful layer into a supporting substrate

#17
20190152772
2019-05-23

Process for fabricating a micromechanical structure made of silicon carbide including at least one cavity

#18
20180346322
2018-12-06

MEMS-device manufacturing method, MEMS device, and MEMS module

#19
20180299337
2018-10-18

Process for manufacturing a MEMS pressure sensor, and corresponding MEMS pressure sensor

#20
20180290883
2018-10-11

Forming a microelectromechanical systems (MEMS) device using silicon-on-nothing and epitaxy

#21
20180065845
2018-03-08

MANUFACTURING METHOD FOR A MICROMECHANICAL DEVICE INCLUDING AN INCLINED OPTICAL WINDOW AND CORRESPONDING MICROMECHANICAL DEVICE

#22
20180031822
2018-02-01

Process for manufacturing a MEMS micromirror device, and associated device

#23
20170287772
2017-10-05

Silicon on nothing devices and methods of formation thereof

#24
20170253477
2017-09-07

Micro-electro-mechanical device and manufacturing process thereof

#25
20160347604
2016-12-01

Method for manufacturing resistive element, method for manufacturing pressure sensor element, pressure sensor element, pressure sensor, altimeter, electronic apparatus, and moving object

#26
20160176702
2016-06-23

Integrated micro-electromechanical device of semiconductor material having a diaphragm, such as a pressure sensor and an actuator

#27
20150340268
2015-11-26

Silicon on nothing devices and methods of formation thereof

#28
20140097521
2014-04-10

Silicon on nothing devices and methods of formation thereof

#29
20130328143
2013-12-12

Semiconductor manufacturing and semiconductor device with semiconductor structure

#30
20120237061
2012-09-20

Process for manufacturing a membrane microelectromechanical device, and membrane microelectromechanical device

#31
20120104589
2012-05-03

Deposition-free sealing for micro- and nano-fabrication

#32
20120068277
2012-03-22

Semiconductor manufacturing and semiconductor device with semiconductor structure

#33
20120018819
2012-01-26

Process for manufacturing a micromechanical structure having a buried area provided with a filter

#34
20100330721
2010-12-30

Method for forming buried cavities within a semiconductor body, and semiconductor body thus made

#35
20100187572
2010-07-29

SUSPENDED MONO-CRYSTALLINE STRUCTURE AND METHOD OF FABRICATION FROM A HETEROEPITAXIAL LAYER

#36
20090243003
2009-10-01

Manufacturing method of a gas sensor integrated on a semiconductor substrate

#37
20090127640
2009-05-21

Micromechanical semiconductor sensor

#38
20080224242
2008-09-18

Process for manufacturing a membrane of semiconductor material integrated in, and electrically insulated from, a substrate

#39
20080197512
2008-08-21

Process for manufacturing deep through vias in a semiconductor device, and semiconductor device made thereby

#40
20070181920
2007-08-09

Manufacturing method for a semiconductor substrate comprising at least a buried cavity and devices formed with this method

#41
20070126071
2007-06-07

Process for manufacturing thick suspended structures of semiconductor material

#42
20070057355
2007-03-15

Method for forming buried cavities within a semiconductor body, and semiconductor body thus made

#43
20060063293
2006-03-23

Method for manufacturing a micromechanical sensor element

#44
20050181529
2005-08-18

Method for manufacturing a membrane sensor

#45
15676457
2018-07-10

Combined laser drilling and the plasma etch method for the production of a micromechanical device and a micromechanical device