84077 ⎘
Manufacture or treatment of microstructural devices or systems in or on a substrate; Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning; Processes for the planarization of structures involving addition of material followed by removal of parts of said material, i.e. subtractive planarization
MEMS SENSOR ARRANGEMENT AND METHOD FOR MANUFACTURING A MEMS SENSOR ARRANGEMENT
#2MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) HAVING VERTICAL STOPS AND ANCHOR STRUCTURES
#3Method For Manufacturing Vibration Device
#4STRAIN SENSOR SWITCH FOR TIMING BASED SENSING
#5Method for manufacturing semiconductor structure and planarization process thereof
#6Process for forming inkjet nozzle devices
#7Process for filling etched holes using first and second polymers
#8Method for forming a planarization structure
#9Micro-electro-mechanical system (MEMS) structures and design structures
#10Micro-electro-mechanical system (MEMS) structures and design structures
#11Micro-electro-mechanical system (MEMS) structures and design structures
#12Process for filling etched holes using photoimageable thermoplastic polymer
#13Method of processing surface of polysilicon and method of processing surface of substrate assembly
#14Method of reverse tone patterning
#15Micro-electro-mechanical system (MEMS) structures and design structures
#16Micro-electro-mechanical system (MEMS) structures and design structures
#17Micro-Electro-Mechanical System (MEMS) structures and design structures
#18Process for filling etched holes
#19Micro-electro-mechanical system (MEMS) structures and design structures
#20Semiconductor arrangement and formation thereof
#21Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing (CMP) of III-V material in the presence of a CMP composition comprising a specific non-ionic surfactant
#22Method for forming micro-electro-mechanical system (MEMS) beam structure
#23Process for reconditioning semiconductor surface to facilitate bonding
#24Microelectromechanical device having a common ground plane and method for making aspects thereof
#25Method of producing a device with a movable portion
#26Microelectromechanical device having a common ground plane layer and a set of contact teeth and method for making aspects thereof
#27Method of fabricating semiconductor devices employing at least one modulation doped quantum well structure and one or more etch stop layers for accurate contact formation
#28Head electrode region for a reliable metal-to-metal contact micro-relay MEMS switch
#29Method for registering a deposited material with channel plate channels