B81C2201/0118 - CPC Classification Index

ClassID:

84075 ⎘

B81C2201/0118 - CPC Classification

Classification description:

Manufacture or treatment of microstructural devices or systems in or on a substrate; Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning Processes for the planarization of structures

Sub-classes:

B81C2201/0119 » involving only addition of materials, i.e. additive planarization 15
B81C2201/0121 » involving addition of material followed by removal of parts of said material, i.e. subtractive planarization 27
B81C2201/0122 » Selective addition 4
B81C2201/0123 » Selective removal 14
B81C2201/0125 » Blanket removal, e.g. polishing 66
B81C2201/0126 » Processes for the planarization of structures not provided for in to 9

Recent Application in this class:

20260138867

2026-05-21

METHOD FOR PRODUCING A MICROMECHANICAL LAYER STRUCTURE WITH HIGH ASPECT RATIO AND MICROMECHANICAL LAYER STRUCTURE

20230331546

2023-10-19

MEMS STRUCTURE

20230127991

2023-04-27

LIGHT SCANNER PACKAGE AND METHOD FOR MANUFACTURING SAME

20210354983

2021-11-18

Method for manufacturing semiconductor structure and planarization process thereof

20170140921

2017-05-18

Method of reverse tone patterning

20140263170

2014-09-18

Methods of polishing sapphire surfaces