ClassID:

84079

B81C2201/0123 - CPC Classification

Classification description:

Manufacture or treatment of microstructural devices or systems in or on a substrate; Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning; Processes for the planarization of structures Selective removal

Recent Application in this class:
#1
20260028220
2026-01-29

MEMS MICROPHONE AND METHOD FOR MANUFACTURING THE SAME

#2
20250145453
2025-05-08

MICRO-ELECTRO-MECHANICAL DEVICE HAVING CONTACT PADS THAT ARE PROTECTED AGAINST HUMIDITY AND MANUFACTURING PROCESS THEREOF

#3
20240253976
2024-08-01

MEMS DEVICE WITH MEMBRANE AND UPRIGHT NANOSTRUCTURES

#4
20240101413
2024-03-28

SELF-ALIGNED AIR GAP FORMATION IN MICROELECTRONICS PACKAGES

#5
20230382722
2023-11-30

MEMS Package and Method for Encapsulating an MEMS Structure

#6
20180277388
2018-09-27

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS

#7
20180257932
2018-09-13

MANUFACTURING METHOD FOR A MICROMECHANICAL DEVICE INCLUDING AN OBLIQUE SURFACE AND CORRESPONDING MICROMECHANICAL DEVICE

#8
20170267517
2017-09-21

Electronic device using MEMS technology

#9
20160376145
2016-12-29

METHOD FOR MANUFACTURING A MICROMECHANICAL STRUCTURE AND A COMPONENT HAVING THIS MICROMECHANICAL STUCTURE

#10
20160090300
2016-03-31

PIEZOELECTRIC MICROPHONE WITH INTEGRATED CMOS

#11
20160027660
2016-01-28

Manufacturing method of semiconductor device and semiconductor manufacturing apparatus

#12
20150175845
2015-06-25

Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing (CMP) of III-V material in the presence of a CMP composition comprising a specific non-ionic surfactant

#13
20120264249
2012-10-18

Method for etched cavity devices

#14
20080150150
2008-06-26

System and method for filling vias

#15
20080038916
2008-02-14

Method for the production of planar structures

#16
20060046497
2006-03-02

Manufacturing method