Patents-Review.com
ClassID:

84080 ⎘

B81C2201/0125 - CPC Classification

Classification description:

Manufacture or treatment of microstructural devices or systems in or on a substrate; Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning; Processes for the planarization of structures Blanket removal, e.g. polishing

Recent Application in this class:
#1
20250333297
2025-10-30

SELF-ALIGNED ACOUSTIC HOLE FORMATION IN PIEZOELECTRICAL MEMS MICROPHONE

 #2
20250229292
2025-07-17

ANTI-STICTION BOTTOM CAVITY SURFACE FOR MICROMACHINED ULTRASONIC TRANSDUCER DEVICES

 #3
20240416385
2024-12-19

ADAPTIVE CAVITY THICKNESS CONTROL FOR MICROMACHINED ULTRASONIC TRANSDUCER DEVICES

 #4
20240409398
2024-12-12

MEMS DEVICE WITH A CAP LAYER HAVING GAPS AND METHOD OF MANUFACTURING A MEMS DEVICE

 #5
20240270565
2024-08-15

COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A MEMS DEVICE

 #6
20240262682
2024-08-08

METHOD FOR PRODUCING A MICROMECHANICAL DEVICE COMPRISING A CAVITY HAVING A MELT SEAL

 #7
20240109769
2024-04-04

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

 #8
20240100566
2024-03-28

Anti-stiction bottom cavity surface for micromachined ultrasonic transducer devices

 #9
20240027488
2024-01-25

INERTIAL SENSOR AND FORMATION METHOD THEREFOR

 #10
20240024917
2024-01-25

Bottom electrode via structures for micromachined ultrasonic transducer devices

 #11
20230357000
2023-11-09

Self-Aligned Acoustic Hole Formation in Piezoelectrical MEMS Microphone

 #12
20230149977
2023-05-18

Adaptive cavity thickness control for micromachined ultrasonic transducer devices

 #13
20230149976
2023-05-18

Anti-stiction bottom cavity surface for micromachined ultrasonic transducer devices

 #14
20230045432
2023-02-09

MICROELECTROMECHANICAL INFRARED SENSING DEVICE AND FABRICATION METHOD THEREOF

 #15
20230017034
2023-01-19

Bottom electrode via structures for micromachined ultrasonic transducer devices

 #16
20220306454
2022-09-29

Composite spring structure to reinforce mechanical robustness of a MEMS device

 #17
20220009771
2022-01-13

Method and structure for sensors on glass

 #18
20210292157
2021-09-23

Composite spring structure to reinforce mechanical robustness of a MEMS device

 #19
20210269303
2021-09-02

Chip package and manufacturing method thereof

 #20
20210260622
2021-08-26

Capacitive micromachined ultrasonic transducer (CMUT) devices and methods of manufacturing

 #21
20210206629
2021-07-08

Method for manufacturing a membrane component and a membrane component

 #22
20210139321
2021-05-13

Laser-assisted material phase-change and expulsion micro-machining process

 #23
20210078858
2021-03-18

MEMS package comprising multi-depth trenches

 #24
20200413210
2020-12-31

Structure for integrated microphone

 #25
20200346923
2020-11-05

Multi-depth MEMS package

 #26
20200324319
2020-10-15

Bottom electrode via structures for micromachined ultrasonic transducer devices

 #27
20200269279
2020-08-27

Adaptive cavity thickness control for micromachined ultrasonic transducer devices

 #28
20200262700
2020-08-20

Integrated package structure for MEMS element and ASIC chip and method for manufacturing the same

 #29
20200216307
2020-07-09

METHOD FOR MANUFACTURING DUAL-CAVITY STRUCTURE, AND DUAL-CAVITY STRUCTURE

 #30
20200156111
2020-05-21

CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER AND METHOD OF MANUFACTURING THE SAME

 #31
20200156110
2020-05-21

Anti-stiction bottom cavity surface for micromachined ultrasonic transducer devices

 #32
20200140266
2020-05-07

CMOS-MEMS structure and method of forming the same

 #33
20200109046
2020-04-09

Method for forming multi-depth MEMS package

 #34
20200024137
2020-01-23

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

 #35
20200024136
2020-01-23

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

 #36
20190233280
2019-08-01

METHOD FOR PROCESSING SILICON WAFER WITH THROUGH CAVITY STRUCTURE

 #37
20190161347
2019-05-30

Method for manufacturing a micromechanical sensor

 #38
20190161346
2019-05-30

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

 #39
20190161342
2019-05-30

Method for forming multi-depth MEMS package

 #40
20190143325
2019-05-16

Plurality of filters

 #41
20180362335
2018-12-20

CMOS-MEMS structure and method of forming the same

 #42
20180288549
2018-10-04

Method for manufacturing a microphone

 #43
20180277388
2018-09-27

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS

 #44
20180201503
2018-07-19

Micro-electro-mechanical system (MEMS) structures and design structures

 #45
20180201502
2018-07-19

Micro-electro-mechanical system (MEMS) structures and design structures

 #46
20180179052
2018-06-28

Micro-electro-mechanical system (MEMS) structures and design structures

 #47
20180086632
2018-03-29

Temporary mechanical stabilization of semiconductor cavities

 #48
20170183222
2017-06-29

CMOS-MEMS structure and method of forming the same

 #49
20170015548
2017-01-19

Open cavity package using chip-embedding technology

 #50
20160264410
2016-09-15

Micro-electro-mechanical system (MEMS) structures and design structures

 #51
20160264406
2016-09-15

Micro-electro-mechanical system (MEMS) structures and design structures

 #52
20160264405
2016-09-15

Micro-Electro-Mechanical System (MEMS) structures and design structures

 #53
20160157038
2016-06-02

Method for manufacturing a microphone

 #54
20160027660
2016-01-28

Manufacturing method of semiconductor device and semiconductor manufacturing apparatus

 #55
20150368090
2015-12-24

Micro-electro-mechanical system (MEMS) structures and design structures

 #56
20140308771
2014-10-16

Method for forming micro-electro-mechanical system (MEMS) beam structure

 #57
20130313661
2013-11-28

Method for processing a wafer at unmasked areas and previously masked areas to reduce a wafer thickness

 #58
20130309797
2013-11-21

Method for manufacturing MEMS device

 #59
20120256517
2012-10-11

Method for microfabrication of a capacitive micromachined ultrasonic transducer comprising a diamond membrane and a transducer thereof

 #60
20110070675
2011-03-24

Method for manufacturing micromechanical components

 #61
20100276765
2010-11-04

Semiconductor device and method of manufacturing the same

 #62
20090206423
2009-08-20

Method for manufacturing micromechanical components

 #63
20080194076
2008-08-14

Process for wafer bonding

 #64
20070031984
2007-02-08

Method of fabricating submicron suspended objects and application to the mechanical characterization of said objects

 #65
20060138076
2006-06-29

Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component

 #66
20050085000
2005-04-21

Manufacturing methods of MEMS device

 #67
20050016251
2005-01-27

Forming tool for forming a contoured microelectronic spring mold

 #68
20050003566
2005-01-06

Micromachine production method