B81C2201/0126 - CPC Classification Index

ClassID:

84081 ⎘

B81C2201/0126 - CPC Classification

Classification description:

Manufacture or treatment of microstructural devices or systems in or on a substrate; Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning; Processes for the planarization of structures Processes for the planarization of structures not provided for in -

Recent Application in this class:

20250305152

2025-10-02

COMPOSITION, ITS USE AND A PROCESS FOR CLEANING SUBSTRATES COMPRISING COBALT AND COPPER

20200131033

2020-04-30

Actuator layer patterning with topography

20170275157

2017-09-28

System and method for an ovenized silicon platform using Si/SiOhybrid supports

20170140921

2017-05-18

Method of reverse tone patterning

20170113925

2017-04-27

Method of encapsulating a microelectronic component

20150175845

2015-06-25

Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing (CMP) of III-V material in the presence of a CMP composition comprising a specific non-ionic surfactant

20120228726

2012-09-13

MEMS and method of manufacturing the same

20100126961

2010-05-27

Polysilicon Planarization Solution for Planarizing Low Temperature Poly-Silicon Thin Film Panels

20080119051

2008-05-22

Method for selective CMP of polysilicon

#10

20060110893

2006-05-25

Glass-type planar substrate, use thereof, and method for the production thereof