B81C2201/0145 - CPC Classification Index

ClassID:

84094 ⎘

B81C2201/0145 - CPC Classification

Classification description:

Manufacture or treatment of microstructural devices or systems in or on a substrate; Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning; Processes for removing material Spark erosion

Recent Application in this class:

20250233327

2025-07-17

ELECTRICAL CONTACTS USING AN ARRAY OF MICROMACHINED FLEXURES

20240405454

2024-12-05

Electrical contacts using an array of micromachined flexures

20220005707

2022-01-06

Shaping nanomaterials by short electrical pulses

20210269304

2021-09-02

Method for ablating or roughening wafer surfaces

20180093884

2018-04-05

Method of manufacturing MEMS switches with reduced switching voltage

20180065847

2018-03-08

Method of manufacturing MEMS switches with reduced switching voltage

20180016138

2018-01-18

Methods of manufacturing for MEMS switches with reduced switching voltage

20180016137

2018-01-18

Methods of manufacture for MEMS switches with reduced switching voltage

20170294274

2017-10-12

Method of manufacturing a switch

#10

20160035513

2016-02-04

Method of manufacture MEMS switches with reduced voltage

#11

20160035511

2016-02-04

Method of manufacturing MEMS switches with reduced switching voltage

#12

20160035510

2016-02-04

Method of manufacturing MEMS switches with reduced switching volume

#13

20090260961

2009-10-22

MEMS switches with reduced switching voltage and methods of manufacture

#14

20080257867

2008-10-23

Apparatus and Method for Nano-Scale Electric Discharge Machining