Patents-Review.com
ClassID:

84113 ⎘

B81C2201/0171 - CPC Classification

Classification description:

Manufacture or treatment of microstructural devices or systems in or on a substrate; Controlling physical properties of the material Doping materials

Sub-classes:
Recent Application in this class:
#1
20260100692
2026-04-09

MEMS Resonator

 #2
20260048981
2026-02-19

MEMS Resonator with Co-packaged Thermistor

 #3
20250128937
2025-04-24

MEMS RESONATOR

 #4
20250026631
2025-01-23

MEMS ELEMENT AND PIEZOELECTRIC ACOUSTIC DEVICE

 #5
20240190702
2024-06-13

SEMICONDUCTOR COMPONENT AND METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT

 #6
20240056054
2024-02-15

Non-Lid-Bonded MEMS Resonator With Phosphorus Dopant

 #7
20240002218
2024-01-04

MICROMECHANICAL STRUCTURE WITH BONDED COVER

 #8
20230416081
2023-12-28

MEMS resonator

 #9
20230183060
2023-06-15

MEMS resonator

 #10
20210221678
2021-07-22

Microelectromechanical structure with bonded cover

 #11
20200298275
2020-09-24

Capacitive micromachined ultrasonic transducer and method of fabricating the same

 #12
20200079646
2020-03-12

Encapsulated microelectromechanical structure

 #13
20190189445
2019-06-20

Manufacturing methods to apply stress engineering to self-aligned multi-patterning (SAMP) processes

 #14
20190055121
2019-02-21

Encapsulated microelectromechanical structure

 #15
20190027559
2019-01-24

METHODS AND SYSTEMS FOR CHEMICALLY ENCODING HIGH-RESOLUTION SHAPES IN SILICON NANOWIRES

 #16
20180282154
2018-10-04

Method for manufacturing a micro electro-mechanical system

 #17
20170225943
2017-08-10

Micromechanical structure

 #18
20160190245
2016-06-30

METHODS AND SYSTEMS FOR CHEMICALLY ENCODING HIGH-RESOLUTION SHAPES IN SILICON NANOWIRES

 #19
20160167950
2016-06-16

Encapsulated microelectromechanical structure

 #20
20160101974
2016-04-14

Low-stress doped ultrananocrystalline diamond

 #21
20150235779
2015-08-20

MEMS device with constant capacitance

 #22
20130099629
2013-04-25

Temperature compensation in a semiconductor micromechanical resonator via charge carrier depletion

 #23
20100295018
2010-11-25

Nanostructures and methods of making the same

 #24
20100266768
2010-10-21

METHOD OF DOPING AND APPARATUS FOR DOPING

 #25
20070181962
2007-08-09

Wafer encapsulated microelectromechanical structure and method of manufacturing same

 #26
20070172976
2007-07-26

Wafer encapsulated microelectromechanical structure and method of manufacturing same

 #27
20070170532
2007-07-26

Wafer encapsulated microelectromechanical structure and method of manufacturing same

 #28
20070170531
2007-07-26

Wafer encapsulated microelectromechanical structure and method of manufacturing same

 #29
20070170530
2007-07-26

Wafer encapsulated microelectromechanical structure and method of manufacturing same

 #30
20070170529
2007-07-26

Wafer encapsulated microelectromechanical structure and method of manufacturing same

 #31
20070170528
2007-07-26

Wafer encapsulated microelectromechanical structure and method of manufacturing same

 #32
20070170440
2007-07-26

Wafer encapsulated microelectromechanical structure and method of manufacturing same

 #33
20070170439
2007-07-26

Wafer encapsulated microelectromechanical structure and method of manufacturing same

 #34
20070170438
2007-07-26

Wafer encapsulated microelectromechanical structure and method of manufacturing same

 #35
18372687
2024-04-23

Bipolar transistor type MEMS pressure sensor and preparation method thereof

 #36
16861778
2023-02-21

MEMS resonator

 #37
16591717
2024-09-17

MEMS resonator with colocated temperature sensor

 #38
15685879
2018-08-21

Pseudo SOI process

 #39
15676890
2020-06-09

MEMS resonator

 #40
15485182
2018-04-24

Method for making vias using a doped substrate