ClassID:

84125

B81C2201/0188 - CPC Classification

Classification description:

Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing; Selective deposition Selective deposition techniques not provided for in  - 

Recent Application in this class:
#1
20260099125
2026-04-09

Forming Antirelaxation Coatings on Interior Surfaces of Vapor Cells

#2
20260015224
2026-01-15

METHOD FOR MANUFACTURING A VIBRATORY MECHANICAL INERTIAL SENSOR, SENSOR OBTAINED BY SUCH A METHOD AND INERTIAL UNIT INCLUDING SUCH A SENSOR

#3
20230219804
2023-07-13

COMPACT ENHANCED SENSITIVITY TEMPERATURE SENSOR USING AN ENCAPSULATED CLAMPED-CLAMPED MEMS BEAM RESONATOR

#4
20220002149
2022-01-06

Three-dimensional features formed in molded panel

#5
20210395080
2021-12-23

Micro-electromechanical device having a soft magnetic material electrolessly deposited on a palladium layer coated metal beam

#6
20210380919
2021-12-09

LASER ASSISTED METAL ADHESION TO INDIUM TIN OXIDE ON GLASS, QUARTZ, SAPPHIRE AND SINGLE CRYSTAL SILICON WAFER SUBSTRATES FOR HEATED PLATFORMS FOR CELL CULTURING

#7
20200192081
2020-06-18

MEMS device having a tiltable suspended structure controlled by electromagnetic actuation

#8
20190308875
2019-10-10

Anti-wetting coating for Si-based MEMS fluidic device, and method of application of same

#9
20190176147
2019-06-13

Localized surface modification for microfluidic applications

#10
20190062150
2019-02-28

Method of manufacturing an electronic device

#11
20180326416
2018-11-15

Methods of making microfluidic devices

#12
20180265353
2018-09-20

Three-dimensional features formed in molded panel

#13
20180148319
2018-05-31

Hermetically sealed MEMS device and its fabrication

#14
20170278605
2017-09-28

Method for manufacturing a device having a three-dimensional magnetic structure

#15
20170210621
2017-07-27

Micromechanical component and method for producing same

#16
20170152136
2017-06-01

Hermetically sealed MEMS device and its fabrication

#17
20170015548
2017-01-19

Open cavity package using chip-embedding technology

#18
20160376147
2016-12-29

Micromechanical component with a reduced contact surface and its fabrication method

#19
20160236929
2016-08-18

Method for manufacturing microcantilever

#20
20160181040
2016-06-23

MEMS STRUCTURE WITH MULTILAYER MEMBRANE

#21
20160167958
2016-06-16

Through-wafer interconnects for MEMS double-sided fabrication process (TWIDS)

#22
20160023895
2016-01-28

Method for producing a micromechanical component, and corresponding micromechanical component

#23
20150263647
2015-09-17

Device having element electrode connected to penetrating wire, and method for manufacturing the same

#24
20150140687
2015-05-21

Forming magnetic microelectromechanical inductive components

#25
20150140686
2015-05-21

Forming magnetic microelectromechanical inductive components

#26
20140273283
2014-09-18

Micro-electromechanical device having a soft magnetic material electrolessly deposited on a metal layer

#27
20130196504
2013-08-01

Transfer substrate for forming metal wiring and method for forming metal wiring using said transfer substrate

#28
20130187169
2013-07-25

Systems and methods for depositing materials on either side of a freestanding film using selective thermally-assisted chemical vapor deposition (STA-CVD), and structures formed using same

#29
20130057557
2013-03-07

HIGH AREA STACKED LAYERED METALLIC STRUCTURES AND RELATED METHODS

#30
20130029480
2013-01-31

FREE FORM PRINTING OF SILICON MICRO- AND NANOSTRUCTURES

#31
20110311737
2011-12-22

VAPOR DEPOSITION APPARATUS FOR MINUTE-STRUCTURE AND METHOD THEREFOR

#32
20110212308
2011-09-01

Fibrous networks and a method and apparatus for continuous or batch fibrous network production

#33
20100055352
2010-03-04

Method of fabrication of fibers, textiles and composite materials

#34
17152942
2024-05-28

Plasma micronozzle adapter

#35
16015772
2020-03-31

Patterned atomic layer etching and deposition using miniature-column charged particle beam arrays