C04B2237/706 - CPC Classification Index

#1

20260124785

2026-05-07

RAPID CERAMIC PROCESSING TECHNIQUES AND EQUIPMENT

#2

20250263808

2025-08-21

RUHRSTAHL-HERAEUS SNORKEL DESIGN

#3

20250187228

2025-06-12

RAPID CERAMIC PROCESSING TECHNIQUES AND EQUIPMENT

#4

20250050536

2025-02-13

RAPID CERAMIC PROCESSING TECHNIQUES AND EQUIPMENT

#5

20240116826

2024-04-11

Rapid ceramic processing techniques and equipment

#6

20230415376

2023-12-28

Rapid ceramic processing techniques and equipment

#7

20230311451

2023-10-05

Joined body, holding device, and electrostatic chuck

#8

20230286872

2023-09-14

PROCESS FOR PRODUCING A METAL-CERAMIC SUBSTRATE, AND A METAL-CERAMIC SUBSTRATE PRODUCED USING SUCH A METHOD

#9

20230212083

2023-07-06

METHOD FOR MANUFACTURING CERAMIC SUSCEPTOR

#10

20230202137

2023-06-29

Bonded assembly, and ceramic circuit substrate and semiconductor device using the same

#11

20230164913

2023-05-25

Process for Producing a Metal-Ceramic Substrate, and a Metal-Ceramic Substrate Produced Using Such Method

#12

20210188719

2021-06-24

Metal-ceramic substrate and method for producing a metal-ceramic substrate

#13

20210188718

2021-06-24

COPPER-CERAMIC COMPOSITE

#14

20210179500

2021-06-17

Method for manufacturing large ceramic co-fired articles

#15

20210176860

2021-06-10

Ceramic circuit board and module using same

#16

20210134609

2021-05-06

Method for producing insulating circuit substrate with heat sink

#17

20200231509

2020-07-23

Method for manufacturing large ceramic co-fired articles

#18

20200111722

2020-04-09

METHOD FOR PRODUCING CERAMIC-ALUMINUM BONDED BODY, METHOD FOR PRODUCING POWER MODULE SUBSTRATE, CERAMIC-ALUMINUM BONDED BODY, AND POWER MODULE SUBSTRATE

#19

20190084893

2019-03-21

Copper-ceramic composite

#20

20190062224

2019-02-28

Heat-permeable tube containing ceramic matrix composite

#21

20190055166

2019-02-21

Copper-ceramic composite

#22

20190035710

2019-01-31

Bonded body, power module substrate, method for manufacturing bonded body, and method for manufacturing power module substrate

#23

20190023619

2019-01-24

COPPER-CERAMIC COMPOSITE

#24

20190002358

2019-01-03

Copper-ceramic substrate, copper precursor for producing a copper-ceramic substrate and process for producing a copper-ceramic substrate

#25

20180280872

2018-10-04

Conductive honeycomb structure

#26

20180190568

2018-07-05

Ceramic metal circuit board and semiconductor device using the same

#27

20180090413

2018-03-29

Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink

#28

20180084650

2018-03-22

Method for manufacturing substrate for power module with heat sink

#29

20180040535

2018-02-08

Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink

#30

20180002239

2018-01-04

Method of Joining Metal-Ceramic Substrates to Metal Bodies

#31

20180002237

2018-01-04

High thermal conductive silicon nitride sintered body, and silicon nitride substrate and silicon nitride circuit board and semiconductor apparatus using the same

#32

20170323842

2017-11-09

Bonded substrate and method for manufacturing bonded substrate

#33

20170151755

2017-06-01

Metal-on-ceramic substrates

#34

20170141011

2017-05-18

Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device

#35

20170141010

2017-05-18

Method for producing ceramic-aluminum bonded body, method for producing power module substrate, ceramic-aluminum bonded body, and power module substrate

#36

20170057880

2017-03-02

METHOD FOR MANUFACTURING LARGE CERAMIC CO-FIRED ARTICLES

#37

20170053852

2017-02-23

Power-module substrate unit and power module

#38

20170034905

2017-02-02

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

#39

20170009335

2017-01-12

Process for producing a target formed of a sintering-resistant material of a high-melting point metal alloy, silicide, carbide, nitride or boride

#40

20160358791

2016-12-08

Copper-ceramic bonded body and power module substrate

#41

20160304405

2016-10-20

Method for producing a metal-ceramic substrate

#42

20160297714

2016-10-13

MOLYBDENUM CARBIDE / CARBON COMPOSITE AND MANUFACTURING METHOD

#43

20160221305

2016-08-04

Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded body, and power module substrate

#44

20160163617

2016-06-09

Ceramic circuit board and electronic device

#45

20160052830

2016-02-25

Apparatus and method for producing (metal plate)-(ceramic board) laminated assembly, and apparatus and method for producing power-module substrate

#46

20160001388

2016-01-07

Manufacturing method of power-module substrate

#47

20150344374

2015-12-03

Joined material and method of manufacturing same

#48

20150328706

2015-11-19

Power-module substrate and manufacturing method thereof

#49

20150284296

2015-10-08

Metal/ceramic bonding substrate and method for producing same

#50

20150251376

2015-09-10

Layered arrangement, hot-gas path component, and process of producing a layered arrangement

#51

20150230334

2015-08-13

Metal-ceramic substrate and method for producing a metal-ceramic substrate

#52

20150208496

2015-07-23

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

#53

20150174863

2015-06-25

Composite plate and production method therefor

#54

20150055303

2015-02-26

Power module substrate with heat sink, and method for producing power module substrate with heat sink

#55

20150049442

2015-02-19

Ceramic circuit board and electronic device

#56

20150041188

2015-02-12

Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate

#57

20150000201

2015-01-01

Method for attaching a pre-sintered body of polycrystalline diamond material to a substrate

#58

20140345914

2014-11-27

Metal-ceramic substrate

#59

20140291699

2014-10-02

Ceramic/copper circuit board and semiconductor device

#60

20140220302

2014-08-07

Silicon nitride substrate and method for producing silicon nitride substrate

#61

20140192486

2014-07-10

Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate

#62

20140174633

2014-06-26

Super-hard structure, tool element and method of making same

#63

20140153688

2014-06-05

Multilayer tube in ceramic matrix composite material, resulting nuclear fuel cladding and associated manufacturing processes

#64

20140126155

2014-05-08

Brazing material, brazing material paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module

#65

20130232783

2013-09-12

Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrate

#66

20130171464

2013-07-04

Composite insulating layer and manufacturing method thereof

#67

20130022836

2013-01-24

BRAZED COATED DIAMOND-CONTAINING MATERIALS

#68

20120305281

2012-12-06

Method of joining metal-ceramic substrates to metal bodies

#69

20120268861

2012-10-25

Ceramic sheet product for ceramic electronic component, multilayer ceramic electronic component using the same and method of manufacturing multilayer ceramic electronic component

#70

20120267149

2012-10-25

Method of manufacturing power module substrate and power module substrate

#71

20120219749

2012-08-30

Transparent laminate structures

#72

20120214016

2012-08-23

CONSTRAINED METAL FLANGES AND METHODS FOR MAKING THE SAME

#73

20120182692

2012-07-19

Double-sided substrate, semiconductor device and method for the same

#74

20120174754

2012-07-12

Ceramic armour and method of construction

#75

20120168209

2012-07-05

Ceramic circuit board and process for producing same

#76

20120114966

2012-05-10

Ceramic/metal composite structure

#77

20120107642

2012-05-03

Metal-ceramic substrate and method for manufacturing such a substrate

#78

20120087457

2012-04-12

Cladding material, tube including such cladding material and methods of forming the same

#79

20120077023

2012-03-29

SINTERED CERAMIC AND SUBSTRATE COMPRISING SAME FOR SEMICONDUCTOR DEVICE

#80

20120068414

2012-03-22

Flexible graphite/metal multilayer gaskets suited to high-temperature service conditions

#81

20120045657

2012-02-23

Metal-Ceramic Substrate

#82

20120038038

2012-02-16

Aluminum nitride substrate, aluminum nitride circuit board, semiconductor apparatus, and method for manufacturing aluminum nitride substrate

#83

20110274888

2011-11-10

Composite Material, Method for Producing a Composite Material and Adhesive or Binding Material

#84

20110074010

2011-03-31

Power module substrate, power module, and method for manufacturing power module substrate

#85

20110045209

2011-02-24

Continuous or discrete metallization layer on a ceramic substrate

#86

20100260988

2010-10-14

Metal-ceramic substrate

#87

20100258233

2010-10-14

CERAMIC SUBSTRATE, METHOD OF MANUFACTURING CERAMIC SUBSTRATE, AND METHOD OF MANUFACTURING POWER MODULE SUBSTRATE

#88

20100247953

2010-09-30

MULTILAYER THERMAL PROTECTION SYSTEM AND METHOD FOR MAKING SAME

#89

20100230473

2010-09-16

Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material

#90

20100035024

2010-02-11

Bonded metal and ceramic plates for thermal management of optical and electronic devices

#91

20100032143

2010-02-11

Microheat exchanger for laser diode cooling

#92

20100012368

2010-01-21

Ceramic substrate manufacturing method and ceramic substrate

#93

20090229975

2009-09-17

Target formed of sintering-resistant material of high-melting point metal alloy, high-melting point metal silicide, high-melting point metal carbide, high-melting point metal nitride, or high-melting point metal boride, process for producing the target, assembly of the sputtering target-backing plate, and process for producing the same

#94

20090008784

2009-01-08

Power semiconductor substrates with metal contact layer and method of manufacture thereof

#95

20080292874

2008-11-27

Sintered power semiconductor substrate and method of producing the substrate

#96

20080257472

2008-10-23

METHOD FOR MANUFACTURING CERAMIC PLATES

#97

20080253060

2008-10-16

Laminated ceramic capacitor

#98

20080248326

2008-10-09

AI/AIN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, AND MANUFACTURING METHOD OF AI/AIN JOINT MATERIAL

#99

20080230585

2008-09-25

Different materials bonded member and production method thereof

#100

20080176087

2008-07-24

Silicide joint and method for manufacturing the same

#101

20080006365

2008-01-10

Production method of multilayer ceramic electronic device

#102

20070274047

2007-11-29

Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material

#103

20070264463

2007-11-15

Metal-ceramic substrate

#104

20070187907

2007-08-16

Flexible graphite/metal multilayer gaskets suited to high-temperature service conditions

#105

20070160858

2007-07-12

Ceramic circuit board, method for making the same, and power module

#106

20070125977

2007-06-07

Piezoelectric ceramic and laminated piezoelectric element

#107

20070119907

2007-05-31

Process for producing a composite body

#108

20060254693

2006-11-16

Method of production of multilayer ceramic electronic device

#109

20060169688

2006-08-03

Alumina member and manufacturing method thereof

#110

20060160693

2006-07-20

Dielectric ceramic composition and electronic device

#111

20060138957

2006-06-29

Plasma generating electrode and plasma reactor

#112

20060023399

2006-02-02

Multilayer ceramic capacitor and manufacturing method thereof

#113

20050286208

2005-12-29

Multilayer ceramic capacitor

#114

20050286207

2005-12-29

Multilayer ceramic capacitor

#115

20050263877

2005-12-01

Laminated radiation member, power semiconductor apparatus, and method for producing the same

#116

20050126682

2005-06-16

Monolithic ceramic substrate and method for making the same

#117

20050082726

2005-04-21

Ceramic components having multilayered architectures and processes for manufacturing the same

#118

20050067744

2005-03-31

Method of making ceramic electronic element

#119

20050019114

2005-01-27

Nanodiamond PCD and methods of forming