103462 ⎘
Polishing compositions containing abrasives or grinding agents
MULTI-SELECTIVE POLISHING SLURRY COMPOSITION AND A SEMICONDUCTOR ELEMENT PRODUCTION METHOD USING THE SAME
#1502Silicon polishing compositions with improved PSD performance
#1503Method for preparing chemical mechanical polishing slurry composition
#1504Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry comprising the same
#1505AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD USING SAME
#1506Polishing slurry including zirconia particles and a method of using the polishing slurry
#1507COMPOSITIONS AND METHODS FOR REMOVING SCRATCHES FROM PLASTIC SURFACES
#1508Polishing agent for copper polishing and polishing method using same
#1509Chemical mechanical polishing slurry composition and method for producing semiconductor device using the same
#1510Ceramic particulate material and processes for forming same
#1511POLISHING COMPOSITION
#1512Highly dilutable polishing concentrates and slurries
#1513Ultrapure colloidal silica for use in chemical mechanical polishing applications
#1514Polishing composition and polishing method using the same
#1515Chemical mechanical planarization composition and method with low corrosiveness
#1516Aluminum enhanced palladium CMP process
#1517POLISHING COMPOSITION AND POLISHING METHOD
#1518Polishing agent, concentrated one-pack type polishing agent, two-pack type polishing agent and method for polishing substrate
#1519Polishing composition for silicon wafers
#1520CMP fluid and method for polishing palladium
#1521CMP polishing liquid and polishing method
#1522Slurry for chemical mechanical polishing
#1523CMP compositions and methods for suppressing polysilicon removal rates
#1524COMPOSITIONS AND METHODS FOR MODIFYING A SURFACE SUITED FOR SEMICONDUCTOR FABRICATION
#1525DISPERSION COMPRISING CERIUM OXIDE AND SILICON DIOXIDE
#1526Method of polishing a silicon wafer
#1527Polishing liquid composition
#1528RASPBERRY-TYPE METAL OXIDE NANOSTRUCTURES COATED WITH CEO2 NANOPARTICLES FOR CHEMICAL MECHANICAL PLANARIZATION (CMP)
#1529Grinding stone, manufacturing method of grinding stone, and manufacturing apparatus of grinding stone
#1530Chemical mechanical polishing of silicon carbide comprising surfaces
#1531Slurry composition having tunable dielectric polishing selectivity and method of polishing a substrate
#1532Stabilized, concentratable chemical mechanical polishing composition and method of polishing a substrate
#1533Polishing slurry and polishing method
#1534Aqueous metal polishing agent comprising a polymeric abrasiv containing pendant functional groups and its use in a CMP process
#1535Silicon polishing compositions with high rate and low defectivity
#1536Aqueous polishing agent comprising solid polymer particles and two complexing agents and its use in a process for polishing patterned and unstructured metal surfaces
#1537POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
#1538SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING PROCESS AND METHOD OF FORMING PHASE CHANGE MEMORY DEVICE USING THE SAME
#1539Abrasive liquid for metal and method for polishing
#1540Oxidizing particles based slurry for nobel metal including ruthenium chemical mechanical planarization
#1541CMP SLURRY RECYCLING SYSTEM AND METHODS
#1542Easy rinsing polishing composition for polymer-based surfaces
#1543Polishing fluid and polishing method
#1544Method for chemical mechanical planarization of a tungsten-containing substrate
#1545Polishing agent for copper polishing and polishing method using same
#1546SYNTHETIC QUARTZ GLASS SUBSTRATE POLISHING SLURRY AND MANUFACTURE OF SYNTHETIC QUARTZ GLASS SUBSTRATE USING THE SAME
#1547Method of manufacturing perpendicular magnetic recording medium substrate and perpendicular magnetic recording medium substrate manufactured by the same
#1548SLURRY COMPOSITIONS FOR SELECTIVELY POLISHING SILICON NITRIDE RELATIVE TO SILICON OXIDE, METHODS OF POLISHING A SILICON NITRIDE LAYER AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
#1549Composition for advanced node front-and back-end of line chemical mechanical polishing
#1550Method Of Polishing Chalcogenide Alloy
#1551Polishing slurry for chalcogenide alloy
#1552CMP polishing solution and polishing method
#1553Polymeric Barrier Removal Polishing Slurry
#1554Abrasive, method of polishing target member and process for producing semiconductor device
#1555METHOD AND APPARATUS FOR CHEMICAL-MECHANICAL PLANARIZATION
#1556Method for chemical mechanical planarization of a copper-containing substrate
#1557Stabilized chemical mechanical polishing composition and method of polishing a substrate
#1558Abrading agent and abrading method
#1559Method for forming through-base wafer vias for fabrication of stacked devices
#1560Tunable polish rates by varying dissolved oxygen content
#1561Polishing solution for CMP and polishing method using the polishing solution
#1562HAND-POWERED POLISHING APPARATUS AND KIT WITH DIAMOND ABRASIVE AND METHOD
#1563Polishing solution for CMP and polishing method using the polishing solution
#1564Single step CMP for polishing three or more layer film stacks
#1565Solvent-Free Organosilane Quaternary Ammonium Compositions, Method of Making and Use
#1566Chemical mechanical polishing (CMP) polishing solution with enhanced performance
#1567GLASS SUBSTRATE FOR INFORMATION RECORDING MEDIUM, POLISHING COLLOIDAL SILICA SLURRY FOR MANUFACTURING THE SAME AND INFORMATION RECORDING MEDIUM
#1568AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECHANICAL POLISHING METHOD, KIT FOR CHEMICAL MECHANICAL POLISHING, AND KIT FOR PREPARING AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING
#1569METHOD OF POLISHING WAFER SURFACE ON WHICH COPPER AND SILICON ARE EXPOSED
#1570Polishing Composition and Polishing Method
#1571DILUTABLE CMP COMPOSITION CONTAINING A SURFACTANT
#1572Method of chemical mechanical polishing a substrate with polishing composition adapted to enhance silicon oxide removal
#1573Polishing liquid and polishing method
#1574Polishing liquid composition for magnetic-disk substrate
#1575METHOD FOR EXPOSING THROUGH-BASE WAFER VIAS FOR FABRICATION OF STACKED DEVICES
#1576Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride
#1577Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride
#1578Method of polishing a substrate comprising polysilicon, silicon oxide and silicon nitride
#1579Liquid suspensions and powders of cerium oxide particles and preparation and polishing applications thereof
#1580Polishing Composition and Polishing Method Using The Same
#1581Chemical-mechanical polishing compositions and methods of making and using the same
#1582Method for recycling cerium oxide abrasive
#1583Polishing Composition and Polishing Method Using The Same
#1584Abrasive composition and method for manufacturing semiconductor integrated circuit device
#1585ABRASIVE, POLISHING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#1586Slurry for polishing and planarization method of insulating layer using the same
#1587SLURRY MANUFACTURING METHOD, SLURRY AND POLISHING METHOD AND APPARATUS USING SLURRY
#1588Abrasive molten grains
#1589POLISHING LIQUID COMPOSITION FOR MAGNETIC DISK SUBSTRATE
#1590PAINTED SURFACE TREATING COMPOSITION, A PAINTED SURFACE TREATING METHOD AND A PAINTED SURFACE PATCHING METHOD
#1591COMPOSITION FOR POLISHING SILICON NITRIDE AND METHOD OF CONTROLLING SELECTIVITY USING SAME
#1592Compositions and methods for restoring aircraft windows and other plastic surfaces
#1593SLURRY CONTAINING MULTI-OXIDIZER AND MIXED NANO-ABRASIVES FOR TUNGSTEN CMP
#1594Oxidizing aqueous cleaner for the removal of post-etch residues
#1595Polishing composition and polishing method using the same
#1596Polishing composition and polishing method using the same
#1597Polishing solution for CMP, and method for polishing substrate using the polishing solution for CMP
#1598Polishing liquid and polishing method
#1599Chemical-mechanical polishing formulation and methods of use
#1600Glass substrate for a magnetic disk and magnetic disk
#1601Method and Slurry for Tuning Low-K Versus Copper Removal Rates During Chemical Mechanical Polishing
#1602Forming conductive features of electronic devices
#1603Preparation of synthetic quartz glass substrates
#1604Process for the production of metal oxide and metalloid oxide dispersions
#1605Composition and method for polishing polysilicon
#1606Polishing composition for polishing silver and alumina, and polishing method using the same
#1607Chemical Mechanical Polishing Composition Containing Polysilicon Polish Finisher
#1608METHOD FOR MANUFACTURING GLASS SUBSTRATE FOR MAGNETIC DISK
#1609Polishing composition
#1610Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method using the same, and method of recycling chemical mechanical polishing aqueous dispersion
#1611Method for preparing cerium oxide, cerium oxide prepared therefrom and CMP slurry comprising the same
#1612Process For Polishing A Silicon Surface By Means Of A Cerium Oxide-Containing Dispersion
#1613Chemical mechanical polishing composition and methods relating thereto
#1614Method for preparing cerium carbonate
#1615Polishing solution for metal films and polishing method using the same
#1616Metal-passivating CMP compositions and methods
#1617Highly dilutable polishing concentrates and slurries
#1618AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD
#1619Method of manufacturing semiconductor device
#1620POLISHING METHOD, POLISHING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#1621Method for preparing of cerium oxide powder for chemical mechanical polishing and method for preparing of chemical mechanical polishing slurry using the same
#1622Method for polishing through-silicon via (TSV) wafers and a polishing composition used in the method
#1623Method and composition for chemical mechanical planarization of a metal-containing substrate
#1624Metal cations for initiating polishing
#1625LIPOSOMAL COMPOSITIONS AND METHODS FOR USE
#1626Composition and method for polishing bulk silicon
#1627CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device
#1628Composition and method for polishing bulk silicon
#1629Polishing composition
#1630Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method
#1631Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method
#1632Auto-Stopping Abrasive Composition for Polishing High Step Height Oxide Layer
#1633Composition for polishing surfaces of silicon dioxide
#1634Germanium layer polishing
#1635Polishing agent and method for polishing substrate using the polishing agent
#1636Chemical mechanical polishing slurry composition including non-ionized, heat activated nano-catalyst and polishing method using the same
#1637CMP polishing slurry and polishing method
#1638POLISHING LIQUID FOR CMP AND POLISHING METHOD
#1639SLURRY COMPOSITION FOR A CHEMICAL MECHANICAL POLISHING PROCESS, METHOD OF POLISHING AN OBJECT LAYER AND METHOD OF MANUFACTURING A SEMICONDUCTOR MEMORY DEVICE USING THE SLURRY COMPOSITION
#1640POLISHING SLURRY FOR CMP
#1641Polishing slurry for metal films and polishing method
#1642CMP slurry and a polishing method using the same
#1643Planarization method using hybrid oxide and polysilicon CMP
#1644Cerium salt, producing method thereof, cerium oxide and cerium based polishing slurry
#1645POLISHING OIL SLURRY FOR POLISHING HARD CRYSTAL SUBSTRATE
#1646Diatomaceous Earth-Containing Slurry Composition And Method For Polishing Organic Polymer-Based Ophthalmic Substrates Using The Same
#1647POLISHING LIQUID FOR METALS
#1648Solution for forming polishing slurry, polishing slurry and related methods
#1649Methods for producing and processing semiconductor wafers
#1650Polishing liquid for metal film and polishing method
#1651Compositions for CMP of semiconductor materials
#1652DISPERSION COMPRISING CERIUM OXIDE AND SHEET SILICATE
#1653Polishing composition for nickel-phosphorous memory disks
#1654DISPERSION COMPRISING CERIUM OXIDE AND COLLOIDAL SILICON DIOXIDE
#1655POLISHING SLURRY AND METHOD OF POLISHING
#1656Slurry composition for a chemical mechanical polishing process and method of manufacturing a semiconductor device using the slurry composition
#1657Polishing composition and polishing method using the same
#1658Polishing composition
#1659Method for chemical mechanical polishing a substrate
#1660Polishing silicon carbide
#1661CMP SYSTEM UTILIZING HALOGEN ADDUCT
#1662Polishing composition
#1663Use of oxidants for the processing of semiconductor wafers, use of a composition and composition therefore
#1664Chemical mechanical polishing of silicon carbide comprising surfaces
#1665Slurry composition and method of fabricating damascene structure using the same
#1666POLISHING SLURRY, PROCESS FOR PRODUCING THE SAME, POLISHING METHOD AND PROCESS FOR PRODUCING GLASS SUBSTRATE FOR MAGNETIC DISK
#1667Buffing composition and method of finishing a surface of a material
#1668CHEMICAL MECHANICAL POLISHING COMPOSITIONS FOR COPPER AND ASSOCIATED MATERIALS AND METHOD OF USING SAME
#1669CMP method
#1670Method of processing a surface of group III nitride crystal and group III nitride crystal substrate
#1671POLISHING AGENT FOR SYNTHETIC QUARTZ GLASS SUBSTRATE
#1672COMPOSITION, METHOD AND PROCESS FOR POLISHING A WAFER
#1673Polishing Composition and Polishing Method
#1674GLASS POWDERS, METHODS FOR PRODUCING GLASS POWDERS AND DEVICES FABRICATED FROM SAME
#1675Chemical mechanical planarization using nanodiamond
#1676DISPERSION OF ALUMINIUM OXIDE, COATING COMPOSITION AND INK-ABSORBING MEDIUM
#1677AEROSOL METHOD AND APPARATUS, PARTICULATE PRODUCTS, AND ELECTRONIC DEVICES MADE THEREFROM
#1678METHOD OF SURFACE TREATMENT OF GROUP III NITRIDE CRYSTAL FILM, GROUP III NITRIDE CRYSTAL SUBSTRATE, GROUP III NITRIDE CRYSTAL SUBSTRATE WITH EPITAXIAL LAYER, AND SEMICONDUCTOR DEVICE
#1679KIT HAVING TWO TYPES OF CLAY
#1680AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND METHOD FOR PREPARING THE SAME, KIT FOR PREPARING AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, AND CHEMICAL MECHANICAL POLISHING METHOD FOR SEMICONDUCTOR DEVICE
#1681CMP POLISHING LIQUID AND METHOD FOR POLISHING SUBSTRATE USING THE SAME
#1682Conductive hydrocarbon fluid
#1683CPM slurry for silicon film polishing and polishing method
#1684CMP polishing slurry and method of polishing substrate
#1685METHOD OF MANUFACTURING A GLASS SUBSTRATE FOR A MAGNETIC RECORDING MEDIUM, A GLASS SUBSTRATE FOR A MAGNETIC RECORDING MEDIUM MANUFACTURED BY THE METHOD, AND A PERPENDICULAR MAGNETIC RECORDING MEDIUM
#1686POLISHING COMPOSITION
#1687POLISHING COMPOSITION
#1688COMPOSITION FOR CHEMICAL MECHANICAL POLISHING
#1689Oxidation-stabilized CMP compositions and methods
#1690Polishing liquid for metal and method of polishing
#1691Chemical Mechanical Polishing Composition
#1692Polishing composition for nickel-phosphorous memory disks
#1693Abrasive compounds for semiconductor planarization
#1694POLISHING COMPOSITION
#1695COMPOSITIONS AND METHODS FOR CHEMICAL-MECHANICAL POLISHING OF PHASE CHANGE MATERIALS
#1696Method for fabricating semiconductor device
#1697SYSTEMS, METHODS AND SLURRIES FOR CHEMICAL-MECHANICAL ROUGH POLISHING OF GAAS WAFERS
#1698AQUEOUS SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD
#1699Compositions comprising silane modified metal oxides
#1700Polymer particles having improved mechanical properties and applications of same
#1701Chemical-mechanical polishing composition comprising metal-organic framework materials
#1702Metal polishing slurry and method of polishing a film to be polished
#1703CMP Slurry Composition for Copper Damascene Process
#1704DISPERSION COMPRISING CERIUM OXIDE, SILICON DIOXIDE AND AMINO ACID
#1705Polishing liquid
#1706Method and composition for chemical mechanical planarization of a metal or a metal alloy
#1707Method and composition for chemical mechanical planarization of a metal
#1708CMP Slurry Composition for Barrier Polishing for Manufacturing Copper Interconnects, Polishing Method Using the Composition, and Semiconductor Device Manufactured by the Method
#1709POLISHING COMPOSITION
#1710Polishing composition for semiconductor wafer
#1711DISPERSION COMPRISING CERIUM OXIDE, SILICON DIOXIDE AND AMINO ACID
#1712Polymeric barrier removal polishing slurry
#1713Combination, method, and composition for chemical mechanical planarization of a tungsten-containing substrate
#1714POLISHING COMPOSITION
#1715Polishing composition
#1716SLURRY COMPOSITION FOR PRIMARY CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD
#1717Chemical mechanical polishing composition and methods relating thereto
#1718Chemical mechanical polishing method
#1719Method to selectively polish silicon carbide films
#1720SLURRY COMPOSITION FOR GST PHASE CHANGE MEMORY MATERIALS POLISHING
#1721Method for polishing a semiconductor wafer with a strained-relaxed SiGelayer
#1722Metal polishing slurry and polishing method
#1723Lapping composition and method using same
#1724Chemical mechanical polishing composition and methods relating thereto
#1725COMPOSITION COMPRISING CHELATING AGENTS CONTAINING AMIDOXIME COMPOUNDS
#1726DISPERSION COMPRISING CERIUM OXIDE AND COLLOIDAL SILICON DIOXIDE
#1727Polishing slurry for copper films
#1728Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device
#1729POLISHING COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#1730Polishing Composition and Polishing Method Using the Same
#1731COMPOSITIONS AND METHODS FOR BARRIER LAYER POLISHING
#1732Semiconductor polishing composition
#1733STABILIZATION OF POLYMER-SILICA DISPERSIONS FOR CHEMICAL MECHANICAL POLISHING SLURRY APPLICATIONS
#1734DISPERSION COMPRISING CERIUM OXIDE AND SHEET SILICATE
#1735Abrasive compositions for chemical mechanical polishing and methods for using same
#1736Method for Forming Through-base Wafer Vias in Fabrication of Stacked Devices
#1737Metal polishing slurry and chemical mechanical polishing method
#1738Polishing slurry
#1739Liquid suspensions and powders of cerium oxide particles and polishing applications thereof
#1740CMP slurry composition for forming metal wiring line
#1741TRANSPARENT ZINC SULPHIDE HAVING A HIGH SPECIFIC SURFACE AREA
#1742Polishing liquid composition
#1743SEMICONDUCTOR POLISHING COMPOUND, PROCESS FOR ITS PRODUCTION AND POLISHING METHOD
#1744Method for preparing cerium oxide powder using organic solvent and CMP slurry comprising the same
#1745Polishing Composition and Polishing Method Using the Same
#1746POLISHING AGENT COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#1747Methods and compositions for polishing silicon-containing substrates
#1748Aqueous cerium oxide dispersion
#1749Chemical mechanical polishing composition and methods relating thereto
#1750Additive for polishing composition
#1751Pyrogenic silica produced in a production facility with high capacity
#1752Chemical Mechanical Polishing Composition for Copper Comprising Zeolite
#1753CMP POLISHING SLURRY, ADDITIVE LIQUID FOR CMP POLISHING SLURRY, AND SUBSTRATE-POLISHING PROCESSES USING THE SAME
#1754Cerium oxide powder, method for preparing the same, and CMP slurry comprising the same
#1755Silicon nitride polishing liquid and polishing method
#1756Method of polishing nickel-phosphorous
#1757METHODS OF POLISHING AN OBJECT USING SLURRY COMPOSITIONS
#1758Wetting agent for semiconductors, and polishing composition and polishing method employing it
#1759CMP SLURRY FOR SILICON FILM
#1760CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION AND CHEMICAL MECHANICAL POLISHING METHOD FOR SEMICONDUCTOR DEVICE
#1761AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, PRODUCTION METHOD THEREOF, AND CHEMICAL MECHANICAL POLISHING METHOD
#1762CHEMICAL MECHANICAL POLISHING OF MOISTURE SENSITIVE SURFACES AND COMPOSITIONS THEREOF
#1763POLISHING COMPOSITION FOR SILICON WAFER, POLISHING COMPOSITION KIT FOR SILICON WAFER AND METHOD OF POLISHING SILICON WAFER
#1764CMP method for metal-containing substrates
#1765Polishing Composition for Silicon Wafer and Polishing Method of Silicon Wafer
#1766Polishing slurry
#1767Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers
#1768AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECHANICAL POLISHING METHOD, AND KIT FOR PREPARING AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING
#1769Polishing liquid and polishing method
#1770Chemical Mechanical Polishing Composition for Copper Comprising Zeolite
#1771Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and chemical mechanical polishing aqueous dispersion preparation kit
#1772Stable, high rate silicon slurry
#1773POLISHING COMPOSITION
#1774Polishing composition containing polyether amine
#1775POLISHING SLURRY FOR CMP
#1776Method for Polishing Semiconductor Layers
#1777Polishing slurry
#1778Slurry for polishing phase change material and method for patterning polishing phase change material using the same
#1779Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry
#1780Chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for use
#1781SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#1782Compositions for chemical-mechanical planarization of noble-metal-featured substrates, associated methods, and substrates produced by such methods
#1783ALUMINUM OXIDE PARTICLES
#1784CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive
#1785POLISHING COMPOSITIONS AND USE THEREOF
#1786Free Radical-Forming Activator Attached to Solid and Used to Enhance CMP Formulations
#1787Slurry composition and method for chemical mechanical polishing of copper integrated with tungsten based barrier metals
#1788POLISHING LIQUID AND POLISHING METHOD
#1789Metal polishing composition and chemical mechanical polishing method
#1790Polishing liquid for metal and polishing method using the same
#1791Chemical mechanical polishing method and method of manufacturing semiconductor device
#1792Compositions for polishing aluminum/copper and titanium in damascene structures
#1793Particulate silica
#1794METHOD FOR PREPARING A POLISHING SLURRY HAVING HIGH DISPERSION STABILITY
#1795POLISHING SLURRIES FOR CHEMICAL-MECHANICAL POLISHING
#1796Polishing compound for semiconductor wafer polishing and polishing method
#1797Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method for semiconductor device
#1798Metal polishing slurry and chemical mechanical polishing method
#1799Oxidizing aqueous cleaner for the removal of post-etch residues
#1800Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios