205407 ⎘
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof; Gas-filled discharge tubes operating with cathodic sputtering; Constructional aspects of the reactor; Magnet arrangements in particular for cathodic sputtering apparatus Movable magnets
Linear sweeping magnetron sputtering cathode and scanning in-line system for arc-free reactive deposition and high target utilization
#302Oscillating shielded cylindrical target assemblies and their methods of use
#303Method for the production of a substrate with a magnetron sputter coating and unit for the same
#304Method of manufacturing a rotation-magnetron-in-magnetron (RMIM) electrode
#305Physical vapor deposition chamber having a rotatable substrate pedestal
#306Physical vapor deposition chamber having an adjustable target
#307Methods and apparatus for sputtering
#308Magnetron having continuously variable radial position
#309Method for manufacturing magnetron coated substrates and magnetron sputter source
#310Method of producing a substrate with a surface treated by a vacuum treatment process, use of said method for the production of coated workpieces and plasma treatment chamber
#311Magnetron assembly
#312Sputtering magnetron control devices
#313Cylindrical target with oscillating magnet for magnetron sputtering
#314Highly ionized PVD with moving magnetic field envelope for uniform coverage of feature structure and wafer
#315MAGNETRON SPUTTERING APPARATUS
#316Controlled multi-step magnetron sputtering process
#317Coater with a large-area assembly of rotatable magnetrons
#318High deposition rate sputtering
#319Methods and apparatus for controlling rotating magnetic fields
#320Magnetron sputtering source and chamber therefor
#321Selectable dual position magnetron
#322Methods and apparatus for generating strongly-ionized plasmas with ionizational instabilities
#323High deposition rate sputtering
#324End point detection for sputtering and resputtering
#325Plasma-assisted sputter deposition system
#326Mechanism for varying the spacing between sputter magnetron and target
#327Compensation of spacing between magnetron and sputter target
#328Apparatus and process for physical vapor deposition
#329Magnet secured in a two part shell
#330PLASMA SOURCE WITH SEGMENTED MAGNETRON CATHODE
#331Linear sweeping magnetron sputtering cathode and scanning in-line system for arc-free reactive deposition and high target utilization
#332Multi-step magnetron sputtering process
#333Sputtering using an unbalanced magnetron
#334Cathodic sputtering apparatus
#335Magnetic control oscillation-scanning sputter
#336System for target arcing mapping and plasma diagnosis
#337Sputter system with magnet motion source