207303 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer; Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups - , e.g. sealing of a cap to a base of a container; Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process using plate connectors, e.g. layer, film
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
#2SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#3PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCTURES
#4SEMICONDUCTOR DEVICE AND A METHOD OF ASSEMBLING A SEMICONDUCTOR DEVICE
#5METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS SUCH SEMICONDUCTOR PACKAGE ASSEMBLY
#6SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
#7METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#8SEMICONDUCTOR DEVICE
#9Method for producing a metal-ceramic substrate
#10Wafer level stacked structures having integrated passive features
#11Method of fastening a semiconductor chip on a lead frame, and electronic component
#12Power module package and method of manufacturing the same
#13Wafer level stacked structures having integrated passive features
#14PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCTURES
#15Semiconductor device that uses bonding layer to join semiconductor substrates together
#16Semiconductor device and method of manufacturing semiconductor device
#17Method of fastening a semiconductor chip on a lead frame, and electronic component
#18Thermal capacity control for relative temperature-based thermal shutdown
#19Leads for leadframe and semiconductor package
#20Semiconductor device and method for manufacturing thereof
#21Process for fabricating circuit components in matrix batches
#22Method of manufacturing semiconductor device that uses bonding layer to join semiconductor substrates together
#23Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks
#24Thermal bonding sheet, thermal bonding sheet with dicing tape, bonded body production method, and power semiconductor device
#25Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks
#26Semiconductor package structure and method for forming the same
#27Solder transfer sheet, solder bump, and solder precoating method using solder transfer sheet
#28FAN-OUT BACK-TO-BACK CHIP STACKED PACKAGES AND THE METHOD FOR MANUFACTURING THE SAME
#29Method for producing a power semiconductor module
#30Semiconductor package structure and method for forming the same
#31ELECTRONIC MODULE HAVING AN OXIDE SURFACE FINISH AS A SOLDER MASK, AND METHOD OF MANUFACTURING ELECTRONIC MODULE USING ORGANIC SOLDERABILITY PRESERVATIVE AND OXIDE SURFACE FINISH PROCESSES
#32ELECTRONIC PACKAGE, PACKAGE CARRIER, AND METHODS OF MANUFACTURING ELECTRONIC PACKAGE AND PACKAGE CARRIER
#33Power module package
#34Method for manufacturing semiconductor device and semiconductor device