207302 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer; Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups - , e.g. sealing of a cap to a base of a container; Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
Sub-classes:PACKAGE STRUCTURE AND PACKAGE METHOD
#2METHOD OF USING PROCESSING OVEN
#3METHOD FOR MANUFACTURING ELECTRONIC COMPONENTS
#4RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS
#5LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
#6METHOD OF USING PROCESSING OVEN
#7RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETEROGENEOUS PACKAGING INTEGRATION
#8ELECTRONIC DEVICES INCLUDING VENT OPENINGS AND ASSOCIATED METHODS
#9METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION DEVICE, AND MOBILE BODY
#10SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#11PROCESS CHAMBER WITH UV IRRADIANCE
#12OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT
#13Package structure and fabrication methods
#14Method of using processing oven
#15Reconstituted substrate for radio frequency applications
#16High-power die heat sink with vertical heat path
#17High-power die heat sink
#18Method of forming a surface-mount integrated circuit package with solder enhanced leadframe terminals
#19Packaged memory device with flip chip and wire bond dies
#20Semiconductor device and a method of manufacturing a semiconductor device
#213D STACKED DIE PACKAGE WITH MOLDED INTEGRATED HEAT SPREADER
#22Single-shot encapsulation
#23SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF
#24Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
#25Package structure and fabrication methods
#26Land structure for semiconductor package and method therefor
#27Method for solder bridging elimination for bulk solder C2S interconnects
#28Manufacturing implantable tissue stimulators
#29Fanout integration for stacked silicon package assembly
#30Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
#31Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
#32Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
#33Solar cell edge interconnects
#34Reconstituted substrate for radio frequency applications
#35Package structure and fabrication methods
#36Single-shot encapsulation
#37Process of surface-mounting three-dimensional package structure electrically connected by prepackaged metal
#38Method for Solder Bridging Elimination for Bulk Solder C2S Interconnects
#39Weld joint with constant overlap area
#40Probe bonding device and probe bonding method using the same
#41Apparatus and method for contactless transfer and soldering of chips using a flash lamp
#42Land structure for semiconductor package and method therefor
#43Single-shot encapsulation
#44EXPOSED SIDE-WALL AND LGA ASSEMBLY
#45Method of manufacturing element chip and method of manufacturing electronic component-mounted structure using plasma etch to singulate element chip
#46Vertically integrated wafers with thermal dissipation
#47Mounting structure and method for producing mounting structure
#48Apparatus, system, and method for wireless connection in integrated circuit packages
#49Method of forming a glass interposer with thermal vias
#50Land structure for semiconductor package and method therefor
#51Multi-chip module with rework capability
#52Vertically integrated wafers with thermal dissipation
#53Apparatus, system, and method for wireless connection in integrated circuit packages
#54Apparatus, system, and method for wireless connection in integrated circuit packages
#55MICROELECTRONIC DIE INCLUDING SOLDER CAPS ON BUMPING SITES THEREOF AND METHOD OF MAKING SAME
#56Method of using processing oven
#57Solar cell edge interconnects
#58Solar cell edge interconnects