H01L2023/4056 - CPC Classification Index

ClassID:

207636 ⎘

H01L2023/4056 - CPC Classification

Classification description:

Details of semiconductor or other solid state devices; Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements; Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink

Recent Application in this class:

20250233050

2025-07-17

DUAL SIDE DIRECT COOLING SEMICONDUCTOR PACKAGE

20250210449

2025-06-26

THERMAL-ENHANCED POWER MODULE WITH SEPARATE HEAT SPREADERS

20230230895

2023-07-20

HEAT TRANSFER FOR POWER MODULES

20230063024

2023-03-02

Semiconductor device

20230019930

2023-01-19

Dual side direct cooling semiconductor package

20210343621

2021-11-04

Heat sink, heat dissipation apparatus, heat dissipation system, and communications device

20210288433

2021-09-16

Card-type connector having heat conductive members extending over terminals thereof

20210153336

2021-05-20

Electronic load device and heat-dissipating load module

20200335414

2020-10-22

Heat transfer for power modules

#10

20200251404

2020-08-06

Heatsink for information handling system

#11

20200194337

2020-06-18

DIELECTRIC HEAT PATH DEVICES, AND SYSTEMS AND METHODS USING THE SAME

#12

20190346215

2019-11-14

Adjustable heat sink fin spacing

#13

20190346214

2019-11-14

Adjustable heat sink fin spacing

#14

20190341327

2019-11-07

Heat transfer for power modules

#15

20190246520

2019-08-08

Cooling methods for electronic components

#16

20190206763

2019-07-04

Heat sink, heat dissipation apparatus, heat dissipation system, and communications device

#17

20180356628

2018-12-13

DMD assembly and DLP projection device

#18

20180261526

2018-09-13

Heat exchangers for dual-sided cooling

#19

20180199472

2018-07-12

Heat dissipating structure and electronic apparatus

#20

20180145008

2018-05-24

Dielectric heat path devices, and systems and methods using the same

#21

20180090417

2018-03-29

Fluid routing devices and methods for cooling integrated circuit packages

#22

20180090416

2018-03-29

Heat dissipation component and terminal device including heat dissipation component

#23

20180073818

2018-03-15

Adjustable heat sink fin spacing

#24

20180051940

2018-02-22

Adjustable heat sink fin spacing

#25

20180019186

2018-01-18

Semiconductor device and manufacturing method of semiconductor device

#26

20170299281

2017-10-19

Adjustable heat sink fin spacing

#27

20170278772

2017-09-28

Dielectric heat path devices, and systems and methods using the same

#28

20170255006

2017-09-07

DMD assembly, DLP optical engine and DLP projection device

#29

20170229374

2017-08-10

Heat sink with integrated threaded lid

#30

20170125323

2017-05-04

Phase-change cooler and phase-change cooling method

#31

20160374231

2016-12-22

Cooling methods for electronic components

#32

20160284623

2016-09-29

Cooling device and device

#33

20160242313

2016-08-18

Electronic assembly with one or more heat sinks

#34

20160242312

2016-08-18

Electronic assembly with one or more heat sinks

#35

20160227674

2016-08-04

Heat dissipation device

#36

20160190036

2016-06-30

Semiconductor device

#37

20160133602

2016-05-12

Packages with thermal management features for reduced thermal crosstalk and methods of forming same

#38

20160118315

2016-04-28

Heat sink coupling using flexible heat pipes for multi-surface components

#39

20160005670

2016-01-07

Semiconductor device

#40

20150325494

2015-11-12

Power semiconductor module with switching device and assembly

#41

20150214155

2015-07-30

Packages for three-dimensional die stacks

#42

20150162307

2015-06-11

Packages with thermal management features for reduced thermal crosstalk and methods of forming same

#43

20150115424

2015-04-30

Electronic system comprising stacked electronic devices provided with integrated-circuit chips

#44

20150075000

2015-03-19

Cooling system for electronics

#45

20140210072

2014-07-31

Semiconductor module having heat dissipating portion

#46

20140183717

2014-07-03

Semiconductor module package

#47

20140133093

2014-05-15

Cooling system for electronics

#48

20140110830

2014-04-24

Semiconductor package

#49

20140071647

2014-03-13

Integrated circuit retention mechanism with retractable cover

#50

20140036445

2014-02-06

Heat sink and electronic apparatus provided with heat sink

#51

20140030900

2014-01-30

Component cooling

#52

20130320548

2013-12-05

Integrated circuit die assembly with heat spreader

#53

20130308274

2013-11-21

THERMAL SPREADER HAVING GRADUATED THERMAL EXPANSION PARAMETERS

#54

20130221506

2013-08-29

Semiconductor packages with integrated heat spreaders

#55

20130153187

2013-06-20

Dual Heat Sinks For Distributing A Thermal Load

#56

20130112387

2013-05-09

HEAT DISSIPATION DEVICE

#57

20130083504

2013-04-04

ELECTRONIC DEVICE

#58

20120193076

2012-08-02

Cooling structure for an electronic component and electronic instrument

#59

20120122279

2012-05-17

System for clamping heat sink

#60

20120119351

2012-05-17

System for clamping heat sink

#61

20120085527

2012-04-12

HEAT SPREADER WITH MECHANICALLY SECURED HEAT COUPLING ELEMENT

#62

20120055650

2012-03-08

SYSTEM FOR CLAMPING HEAT SINK

#63

20110180809

2011-07-28

Semiconductor device module

#64

20110100600

2011-05-05

Heat dissipation device with pivotable fan

#65

20110096502

2011-04-28

Printed circuit board assembly

#66

20110096501

2011-04-28

Heat dissipation device and electronic device using the same

#67

20110094709

2011-04-28

HEAT DISSIPATION APPARATUS AND FRAME THEREOF

#68

20110061847

2011-03-17

HEAT DISSIPATION DEVICE

#69

20110057303

2011-03-10

Package for an integrated circuit

#70

20110012494

2011-01-20

HEAT DISSIPATING DEVICE HAVING LINEAR HEAT DISSIPATING UNIT AND FANLESS LED LAMP USING THE DEVICE

#71

20100307719

2010-12-09

HEAT DISSIPATION DEVICE AND METHOD OF MANUFACTURING THE SAME

#72

20100302725

2010-12-02

Vapor chamber heat sink with cross member and protruding boss

#73

20100243872

2010-09-30

SEMICONDUCTOR DEVICE

#74

20100236765

2010-09-23

FAN ASSEMBLY AND HEAT DISSIPATION DEVICE HAVING THE SAME

#75

20100188811

2010-07-29

Memory cooling device

#76

20100097766

2010-04-22

Fixing device for heat sink

#77

20100059209

2010-03-11

HEAT DISSIPATING DEVICE

#78

20100059202

2010-03-11

Heat dissipation device with heat pipe and elastic member

#79

20100038066

2010-02-18

Thermal conducting principle and device for prestressed clamping type multi-layered structure

#80

20100038065

2010-02-18

Thermal conducting principle and device for prestressed clamping type multi-layered structure

#81

20100019366

2010-01-28

Package for an integrated circuit

#82

20100008045

2010-01-14

HEAT SINK

#83

20090321901

2009-12-31

THERMALLY BALANCED HEAT SINKS

#84

20090223647

2009-09-10

Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members

#85

20090178788

2009-07-16

SEMICONDUCTOR COOLING STRUCTURE

#86

20090175005

2009-07-09

Support, in Particular for an Electronic Power Component, a Power Module Including the Support, an Assembly Including the Module, and an Electrical Member Controlled by the Module

#87