207637 ⎘
Details of semiconductor or other solid state devices; Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements; Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
SEMICONDUCTOR UNIT
#2SEMICONDUCTOR STORAGE DEVICE
#3ELECTRONIC DEVICE WITH WARPAGE MITIGATION AND METHOD THEREFOR
#4SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD
#5INTEGRATED CIRCUIT COOLING SYSTEMS AND METHODS
#6MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD
#7JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE
#8INTEGRATED CIRCUIT DEVICE WITH THERMAL DISSIPATING PACKAGE
#9HEAT SPREADER APPARATUS WITH MAGNETIC ATTACHMENTS ON PRINTED WIRING BOARD ASSEMBLIES, RELATED METHODS AND ELECTRONIC SYSTEMS
#10SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING A SEMICONDUCTOR MODULE
#11CHIP PACKAGE WITH PASS THROUGH HEAT SPREADER
#12Manufacturing method of semiconductor package using jig
#13Apparatus and method for holding a heat generating device
#14Circuit carrier arrangement and method for producing such a circuit carrier arrangement
#15SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#16METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL LOAD DISTRIBUTION OF INTEGRATED CIRCUIT PACKAGES
#17Manufacturing method of semiconductor package using jig
#18Heat sink
#19Circuit carrier arrangement and method for producing such a circuit carrier arrangement
#20Systems for providing thermal management to integrated circuits
#21Heat sink, heat dissipation apparatus, heat dissipation system, and communications device
#22Heterogeneous integration module comprising thermal management apparatus
#23Apparatus and method for holding a heat generating device
#24Methods of forming flexure based cooling solutions for package structures
#25Semiconductor device and semiconductor module with improved heat dissipation
#26Power conversion device
#27Electronic module for motherboard
#28Socket loading mechanism for passive or active socket and package cooling
#29Heat dissipation structure and heat dissipation method
#30Semiconductor device
#31Flexible base design for chipset heat sink
#32Mounting devices for semiconductor packages with a fixation mechanism
#33Heatsink for information handling system
#34COMPONENT-MOUNTING DEVICE AND ELECTRONIC APPARATUS
#35Electric working machine with semiconductor element that completes or interrupts current path to motor
#36Mounting an LED element on a flat carrier
#37Floating heat sink and elastic support thereof
#38Electronic device apparatus with multiple thermally conductive paths for heat dissipation
#39Fixing device for double sided heat sink and associated heat dissipating system
#40Mechanical part for fastening processor, assembly, and computer device
#41Heat sink hold down system for direct attachment to printed circuit board
#42Electrical assembly equipped with auxiliary retention for facilitating heat sink installation
#43Threaded cooling apparatus with integrated cooling channels and heat exchanger
#44HEAT SINK
#45Substrate
#46Adjustable heat sink fin spacing
#47Adjustable heat sink fin spacing
#48Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets
#49Power module and semiconductor apparatus
#50Bi-directional heatsink dampening force system
#51Positioning assembly for computer radiator
#52Electronic control unit
#53Solid-state storage device
#54Heat sink, heat dissipation apparatus, heat dissipation system, and communications device
#55Microelectronic components having integrated heat dissipation posts and systems including the same
#56Fixing device for double sided heat sink and associated heat dissipating system
#57Circuit assembly having a heat transfer member
#58Socket connector for an electronic package
#59Socket connector for an electronic package
#60Socket connector assembly for an electronic package
#61Cable socket connector assembly for an electronic
#62Screwless heat sink attachment
#63Heat sink fastening seat and securing device with gasket for use with electrical connector
#64Package-on-package semiconductor device assemblies including one or more windows and related methods and packages
#65Electronic control unit and electric power steering device using the same
#66Electronic device with integrated passive and active cooling
#67Semiconductor device
#68Power electronic arrangement and electric vehicle with such an arrangement
#69Electronic apparatus
#70Heat radiation apparatus using modular cooling apparatus
#71Bi-directional heatsink dampening force system
#72Semiconductor memory device and a chip stack package having the same
#73Local stress-relieving devices, systems, and methods for electronic assemblies
#74Heat dissipation component and terminal device including heat dissipation component
#75Adjustable heat sink fin spacing
#76SUPPLEMENTAL AIR COOLING
#77Adjustable heat sink fin spacing
#78Package-on-package semiconductor device assemblies including one or more windows and related methods and packages
#79Adjustable heat sink fin spacing
#80Vapor chamber amplifier module
#81Heat sink with integrated threaded lid
#82Apparatus for positioning heat sink
#83Phase-change cooler and phase-change cooling method
#84Semiconductor device
#85Screwless heat sink attachment
#86Semiconductor module having an embedded metal heat dissipation plate
#87Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded body, and power module substrate
#88Crimping power module
#89Packages with thermal management features for reduced thermal crosstalk and methods of forming same
#90Fan-out wafer level package
#91Electrical connector having a housing with a retaining device for securing a bracket
#92Semiconductor device
#93Heat-dissipating EMI/RFI shield
#94Packages with thermal management features for reduced thermal crosstalk and methods of forming same
#95Connecting structure of cooling device, cooling device, and method for connecting cooling device
#96Electronic system comprising stacked electronic devices provided with integrated-circuit chips
#97Electronic device
#98Semiconductor device and semiconductor device fabrication method
#99Electronic device
#100Heat radiation arrangement
#101Coupling assembly of power semiconductor device and PCB and method for manufacturing the same
#102Heat dissipation device with fastener
#103Heat dissipation methods and structures for semiconductor device
#104HIGH DENSITY 3D PACKAGE
#105GROUNDING MECHANISM FOR HEAT SINK ASSEMBLY
#106HEAT SINK
#107ELECTRONIC DEVICE
#108MULTICHIP MODULE, PRINTED WIRING BOARD, METHOD FOR MANUFACTURING MULTICHIP MODULE, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
#109Stacked semiconductor chip device with thermal management
#110Fixing mechanism for fixing a thermal module on a base and related electronic device
#111HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
#112Heat dissipation device with pivotable fan
#113Printed circuit board assembly
#114HEAT DISSIPATION APPARATUS AND FRAME THEREOF
#115Method for direct heat sink attachment
#116Low temperature co-fired ceramics assembling system and method thereof
#117HEAT DISSIPATION DEVICE
#118Fastener and electronic device having the same
#119Bracket for mounting heat sink
#120Power semiconductor module featuring resiliently supported substrates and method for fabricating a power semiconductor module
#121Power semiconductor module including substrates spaced from each other
#122Fastener and heat sink assembly having the same
#123Clamping part for pressing power components against a cooling surface
#124Heat dissipation device
#125Heat sink mount for providing non-rigid support of overhanging portions of heat sink
#126Heat-dissipated fastener and elastic frame thereof
#127Fixing device for heat sink
#128Transistor clamping device
#129Electronic device with circuit board support
#130Semiconductor module with two cooling surfaces and method
#131Method for direct heat sink attachment
#132Mounting structure with heat sink for electronic component and female securing member for same
#133Printed circuit board unit and semiconductor package
#134Back plate assembly
#135Strain reduction fixing structure
#136Thermal dissipation heat slug sandwich
#137Fastening device for thermal module
#138HEAT DISSIPATION DEVICE AND METHOD FOR MOUNTING THE SAME
#139SUPPORT DEVICE AND ELECTRONIC DEVICE USING SAME
#140Thermal conduction principle and device of the multi-layers structure with different thermal characteristics
#141Socket connector with flexible orientation heat pipe
#142Heat dissipation device with base having fasteners
#143Heat dissipation device
#144FLEXIBLE HEAT SINK INSTALLATION FOR EARLY BLADE BOARD MANUFACTURING
#145Backplate for heat radiator
#146Mounting device for mounting heat sink onto electronic component
#147Heat-dissipating module
#148Method of providing flexible heat sink installations for early blade board manufacturing
#149Cooling device
#150Clamp for electrical devices
#151Circuit module and manufacturing method thereof
#152Heat sink assembly having a fixing base thereof
#153Electrical connector assembly with heat dissipating device
#154Electrical connector assembly with fastening element
#155Heat dissipation device having a rotatable fastener
#156Fixing Structure and Heat Dissipation Device
#157APPARATUS AND METHOD FOR ATTACHING HEATSINKS
#158Fixing structure of fixing a thermal module
#159Thermal dissipating device
#160Method for direct heat sink attachment
#161HOLDING BASE FOR A RADIATOR ASSEMBLY
#162Ic Holder
#163Holding device for a heat sink
#164Cooling assembly
#165HEAT DISSIPATOR FASTENER KIT
#166Spring loaded heat sink retention mechanism
#167Customizable backer for achieving consistent loading and engagement of array package connections
#168Support device for heat dissipation module
#169Retention module for a heat sink
#170Mounting structure with heat sink for electronic component and female securing member for same
#171Heat plate construction and attachment for dismounting heat plate
#172Heat dissipation methods and structures for semiconductor device
#173Resilient fastener and thermal module incorporating the same
#174Semiconductor device and display apparatus
#175Lidless semiconductor cooling
#176Heatsink assembly structure
#177Heatsink assembly structure
#178Easily disassembling cooling apparatus
#179HEAT DISSIPATION ASSEMBLY
#180High-load even pressure heatsink loading for low-profile blade computer applications
#181System and method for cooling a module
#182THERMAL MODULE MOUNTED ON CARRIER BY USING MAGNETIC FORCE
#183Boost spring holder for securing a power device to a heatsink
#184Using the wave soldering process to attach motherboard chipset heat sinks
#185Heat sink fixing assembly
#186HEAT DISSIPATION DEVICE WITH A HEAT PIPE
#187Heat dissipation device
#188THERMAL MANAGEMENT MODULE AND ELECTRONIC ASSEMBLY USING THE SAME
#189Heatsink attachment mechanism
#190Heat sink fastening device and assembling process thereof
#191Fastening element for heat dissipating apparatus
#192Package unit
#193ELECTRONIC DEVICE HAVING HEAT SPREADER
#194Heat radiation device for memory module
#195Customizable backer for achieving consistent loading and engagement of array package connections
#196HEAT SINK BACK PLATE MODULE
#197CONTACT LOAD PROFILE MODIFICATION FOR A COMPRESSION SOCKETED CPU
#198Semiconductor circuit arrangement
#199Heat sink dissipating device for electrical connector
#200Heat-dissipating device having air-guiding structure
#201Non-influencing fastener for mounting a heat sink in contact with an electronic component
#202Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
#203System and method for cooling a module
#204Heatsink module of heat-generating electronic elements on circuit board
#205Heat dissipating structure
#206Fixing means for heat dissipater
#207Structure for air conduction in radiator device
#208Apparatus for supporting a heatsink
#209MOTHERBOARD ASSEMBLY
#210Modular heat-radiation structure and controller including the structure
#211Mounting apparatus for securing heat dissipation module to circuit board
#212Receptacle for a central processing unit
#213Fastening heat exchanger apparatus
#214Thermal management device attachment
#215Circuit board having heat dissipation through holes
#216Semiconductor package involving a rotary lock that connects a package substrate and a separate component
#217Heatsink assembly
#218HEAT DISSIPATION DEVICE
#219Electronic system
#220Single unit heat sink, voltage regulator, and package solution for an integrated circuit
#221Fixing device for a radiator
#222Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support
#223Modular heat sink assembly
#224Electronic device package heat sink assembly
#225Semiconductor module and semiconductor module heat radiation plate
#226Heat sink for memory
#227Package and method for attaching an integrated heat spreader
#228Heat dissipation device
#229Electronic device with improved cooling mechanism
#230Apparatus for attaching a cooling structure to an integrated circuit
#231Fastening device for heat sink
#232Radiator device and plug-in unit
#233Fixed pillar with heat loss
#234Method and structure to provide balanced mechanical loading of devices in compressively loaded environments
#235Electric range
#236Heat sink module for an electronic device
#237Circuit board assembly with a brace surrounding a ball-grid array device
#238Socket adapted for compressive loading
#239Power supply and fixing structure of heatsink and circuit board applicable to the same
#240Electronic component package including heat spreading member
#241Spring adapted to hold electronic device in a frame
#242Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
#243Electronic system and method
#244Thermal management apparatus
#245Heat dissipating device
#246Using the wave soldering process to attach motherboard chipset heat sinks
#247Auxiliary supporting structure of circuit board and assembling method for the same
#248Holding fixture, component mounting method, electronic circuit unit and electronic apparatus
#249Structure for controlled shock and vibration of electrical interconnects
#250Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support
#251Assemblies for mounting electronic devices and associated heat sinks to computer modules and other structures
#252Heat sink attachment
#253Retaining heat sinks on printed circuit boards
#254System and method for self-leveling heat sink for multiple height devices
#255Integrated heat sink assembly
#256Heat radiation device for memory module
#257Apparatus and method for coupling a thermal dissipation device to an electronic substrate
#258Electronic device and module structure thereof
#259Apparatus, system, and method for dynamic compensation of heatsink-clamping mechanisms
#260Apparatus, system, and method for increasing the cooling efficiency of cold plate devices
#261Apparatus, system, and method for increasing the cooling efficiency of cold plate devices
#262Heatsink backing plate
#263Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof