206987 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof; Preparing wafers; Preparing bulk and homogeneous wafers; Multistep processes; Specific process step Mirror polishing
EPITAXIAL WAFER AND A METHOD FOR MANUFACTURING AN EPITAXIAL WAFER
#2SLURRY SOLUTION, METHOD FOR FABRICATING THE SLURRY SOLUTION, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SLURRY SOLUTION
#3AUTOMATED SEMICONDUCTOR SUBSTRATE POLISHING AND CLEANING METHODS
#4METHOD FOR WAFER BACKSIDE POLISHING
#5POLISHING HEAD, POLISHING DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR WAFER
#6INFORMATION PROCESSING DEVICE AND INFORMATION PROCESSING METHOD
#7METHOD FOR EVALUATING WORK-MODIFIED LAYER, AND METHOD OF MANUFACTURING SEMICONDUCTOR SINGLE CRYSTAL SUBSTRATE
#8SILICON WAFER MANUFACTURING METHOD
#9CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
#10METHOD OF CLEANING SILICON WAFER, METHOD OF MANUFACTURING SILICON WAFER, AND SILICON WAFER
#11WAFER POLISHING METHOD AND WAFER PRODUCING METHOD
#12POLISHING COMPOSITION
#13INDIUM PHOSPHIDE SUBSTRATE, METHOD FOR MANUFACTURING INDIUM PHOSPHIDE SUBSTRATE, AND SEMICONDUCTOR EPITAXIAL WAFER
#14INDIUM PHOSPHIDE SUBSTRATE, METHOD FOR MANUFACTURING INDIUM PHOSPHIDE SUBSTRATE, AND SEMICONDUCTOR EPITAXIAL WAFER
#15SEMICONDUCTOR WAFER THERMAL REMOVAL CONTROL
#16METHODS FOR POLISHING SEMICONDUCTOR SUBSTRATES
#17MANUFACTURING METHOD FOR A SUBSTRATE WAFER
#18METHOD AND APPARATUS FOR POLISHING WAFER
#19POLISHING COMPOSITION
#20METHOD FOR MEASURING DIC DEFECT SHAPE ON SILICON WAFER AND POLISHING METHOD
#21INSPECTING APPARATUS, PEELING APPARATUS, AND LEARNED MODEL GENERATING METHOD
#22Method for wafer backside polishing
#23METHOD OF SiC WAFER PROCESSING
#24Method of transferring semiconductor wafer to polishing apparatus and method of producing semiconductor wafer
#25Group III nitride single crystal substrate and method for production thereof
#26FABRICATION METHOD OF SEMICONDUCTOR SUBSTRATE
#27Indium phosphide substrate, semiconductor epitaxial wafer, and method for producing indium phosphide substrate
#28Method of CMP integration for improved optical uniformity in advanced LCOS back-plane
#29Silicon carbide substrate
#30Silicon carbide substrate
#31Indium phosphide substrate
#32INDIUM PHOSPHIDE SUBSTRATE AND METHOD FOR PRODUCING INDIUM PHOSPHIDE SUBSTRATE
#33INDIUM PHOSPHIDE SUBSTRATE AND METHOD FOR PRODUCING INDIUM PHOSPHIDE SUBSTRATE
#34POLISHING COMPOSITION
#35Manufacture method of a high-resistivity silicon handle wafer for a hybrid substrate structure
#36Semiconductor wafer evaluation method and manufacturing method and semiconductor wafer manufacturing process management method
#37Wafer manufacturing method and wafer
#38Silicon epitaxial wafer production method and silicon epitaxial wafer
#39Automated semiconductor substrate polishing and cleaning
#40METHOD FOR MAKING SEMICONDUCTOR SUBSTRATE AND METHOD FOR MAKING SEMICONDUCTOR DEVICE
#41Optical adjustable filter sub-assembly
#42Method of producing laser-marked silicon wafer and laser-marked silicon wafer
#43Hard abrasive particle-free polishing of hard materials
#44SiC wafer and manufacturing method for SiC wafer
#45Apparatus and method for double-side polishing work
#46Semiconductor wafer thermal removal control
#47Semiconductor substrate polishing methods
#48Wafer production method
#49Laminate of aluminum nitride single-crystal substrate
#50Method and equipment for performing CMP process
#51WAFER POLISHING METHOD AND APPARATUS
#52Surface protectant for semiconductor wafer
#53Method of double-side polishing silicon wafer
#54Group III nitride composite substrate and method for manufacturing the same, and method for manufacturing group III nitride semiconductor device
#55Processing method for wafer
#56Method for polishing using polishing pad provided with adsorption layer
#57Method, control system and plant for processing a semiconductor wafer, and semiconductor wafer
#58HARD ABRASIVE PARTICLE-FREE POLISHING OF HARD MATERIALS METHOD
#59Wafer surface beveling method, method of manufacturing wafer, and wafer
#60Methods for polishing semiconductor substrates that adjust for pad-to-pad variance
#61Indium phosphide substrate, method of inspecting indium phosphide substrate, and method of producing indium phosphide substrate
#62Method of double-side polishing semiconductor wafer
#63Method for manufacturing wafer
#64Method of using a polishing system
#65WAFER MANUFACTURING METHOD AND WAFER
#66Method of manufacturing bonded wafer
#67Slurry cooling device and slurry supply system having the same
#68Method for polishing silicon wafer and surface treatment composition
#69Semiconductor wafer, and method for polishing semiconductor wafer
#70Method for evaluating surface defects of substrate to be bonded
#71Method and equipment for performing CMP process
#72Optical adjustable filter sub-assembly
#73Polishing method and polishing composition
#74Planarizing processing method and planarizing processing device
#75Silicon carbide wafer and method for production thereof
#76Polishing composition
#77Method for producing aluminum nitride single crystal substrate
#78Polishing composition, method for producing polishing composition and polishing composition preparation kit
#79Polishing composition and polishing method using same
#80Method for polishing silicon substrate and polishing composition set
#81Polishing slurries for polishing semiconductor wafers
#82Silicon wafer single-side polishing method
#83Method for polishing silicon substrate and polishing composition set
#84Polishing slurry and polishing material
#85Hard abrasive particle-free polishing of hard materials
#86Double-side polishing method and double-side polishing apparatus
#87Polishing composition, method for producing same, and polishing method
#88Monocrystalline semiconductor wafer and method for producing a semiconductor wafer
#89Oxidizing fluid for the chemical-mechanical polishing of ceramic materials
#90Polishing composition
#91Semiconductor substrate and manufacturing method of the same
#92Polishing composition
#93Methods and systems for polishing pad control
#94Methods and systems for polishing pad control
#95Silicon carbide substrate
#96Method for double-side polishing wafer
#97METHOD FOR PRODUCING SEMICONDUCTOR EPITAXIAL WAFER AND SEMICONDUCTOR EPITAXIAL WAFER
#98Method and apparatus for within-wafer profile localized tuning
#99Method for manufacturing semiconductor wafer
#100Surface machining method for single crystal SiC substrate, manufacturing method thereof, and grinding plate for surface machining single crystal SiC substrate
#101DIAMOND SUBSTRATE AND METHOD FOR PRODUCING THE SAME
#102Method of preparing diamond substrates for CVD nanometric delta doping
#103Sizing device, polishing apparatus, and polishing method
#104CVD reactor and method for nanometric delta doping of diamond
#105Polishing composition for silicon wafer and polishing method
#106Method for manufacturing group-III nitride semiconductor crystal substrate
#107Turntable cloth peeling jig
#108Indium phosphide substrate, method of inspecting indium phosphide substrate, and method of producing indium phosphide substrate
#109Wafer polishing apparatus and wafer polishing method using same
#110Method for manufacturing a bonded SOI wafer
#111Single crystal silicon-carbide substrate and polishing solution
#112Method of evaluating gettering property
#113Vacuum chuck, beveling/polishing device, and silicon wafer beveling/polishing method
#114Semiconductor treatment composition and treatment method
#115SEMICONDUCTOR TREATMENT COMPOSITION AND TREATMENT METHOD
#116Polishing composition
#117Polishing method and polishing composition
#118Polishing system
#119Method for processing semiconductor wafer, method for manufacturing bonded wafer, and method for manufacturing epitaxial wafer
#120Single-crystal silicon-carbide substrate and polishing solution
#121Cleaning method and laminate of aluminum nitride single-crystal substrate
#122Semiconductor substrate polishing methods and slurries and methods for manufacturing silicon on insulator structures
#123Silicon wafer polishing composition
#124Method of polishing group III-V materials
#125Polishing composition and polishing method
#126Surface machining method for single crystal SiC substrate, manufacturing method thereof, and grinding plate for surface machining single crystal SiC substrate
#127Semiconductor substrate polishing methods with dynamic control
#128Method for polishing semiconductor substrate
#129Polishing composition
#130Polishing composition
#131Polishing composition
#132Halite salts as silicon carbide etchants for enhancing CMP material removal rate for SiC wafer
#133Workpiece double-disc grinding method
#134Method for estimating depth of latent scratches in SiC substrates
#135Method for polishing GaN single crystal material
#136Planarizing processing method and planarizing processing device
#137Composition for polishing silicon wafers
#138POLISHING COMPOSITION
#139SOI wafer manufacturing process and SOI wafer
#140Semiconductor substrate polishing methods and slurries and methods for manufacturing silicon on insulator structures
#141Slurry composition and method for polishing substrate
#142Method for producing semiconductor epitaxial wafer and semiconductor epitaxial wafer
#143Polishing pad and process for producing same
#144Method for manufacturing semiconductor wafer
#145Methods and systems for polishing pad control
#146Silicon carbide substrate, semiconductor device, and methods for manufacturing them
#147Polishing apparatus for a work with mechanical polishing function and chemical polishing function
#148Polishing abrasive particle, production method therefore, polishing method, polishing device, and slurry
#149Silicon carbide semiconductor substrate used to form semiconductor epitaxial layer thereon
#150Polishing composition, method for producing polishing composition and polishing composition preparation kit
#151Abrasive material, method for producing same, and abrasive slurry containing same
#152Single-crystal silicon carbide substrate, method for producing single-crystal silicon carbide substrate, and method for inspecting single-crystal silicon carbide substrate
#153Method for producing mirror-polished wafer
#154Polishing composition and method for producing same
#155Polishing composition and method for producing same
#156Apparatus for dressing urethane foam pad for use in polishing
#157Method of polishing wafer and wafer polishing apparatus
#158Method and device for polishing semiconductor wafer
#159Method for producing polished object and polishing composition kit
#160Metallic abrasive pad and method for manufacturing same
#161Method of polishing SiC substrate
#162Use of a chemical-mechanical polishing (CMP) composition for polishing a substrate or layer containing at least one III-V material
#163Chemical-mechanical polishing compositions comprising polyethylene imine
#164Polishing of hard substrates with soft-core composite particles
#165Surface machining method for single crystal SiC substrate, manufacturing method thereof, and grinding plate for surface machining single crystal SiC substrate
#166Silicon carbide substrate, semiconductor device, and methods for manufacturing them
#167Polishing composition and method for producing polished article
#168Polishing apparatus and polishing method
#169Method for producing SiC substrate
#170Polishing composition
#171Method for polishing work and work polishing apparatus
#172Double-side polishing method
#173Semiconductor wafer evaluation method and semiconductor wafer manufacturing method
#174Polishing composition and method for producing substrate
#175Polishing composition, method for manufacturing polishing composition, and method for manufacturing polishing composition liquid concentrate
#176Double-side polishing method
#177Systems and methods for performing chemical mechanical planarization
#178Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing (CMP) of III-V material in the presence of a CMP composition comprising a specific non-ionic surfactant
#179Semiconductor wafer manufacturing method
#180Chemical mechanical planarization using nanodiamond
#181Method of double-side polishing wafer
#182III nitride semiconductor substrate, epitaxial substrate, and semiconductor device
#183Polishing liquid composition for wafers
#184Chemical mechanical polishing composition for polishing silicon wafers and related methods
#185SiC single crystal substrate
#186Polishing composition and polishing method using the same
#187Abrasive composition and method for producing semiconductor substrate
#188Polishing composition
#189Polishing composition, manufacturing process therefor, process for production of silicon substrate, and silicon substrate
#190Polishing composition and method using said polishing composition to manufacture compound semiconductor substrate
#191Silicon wafer processing solution and silicon wafer processing method
#192Double-side polishing apparatus
#193Composition and method for polishing bulk silicon
#194Polishing head and polishing apparatus
#195Method for treating group III nitride substrate and method for manufacturing epitaxial substrate
#196Polishing apparatus and polishing method
#197Composition for polishing purposes, polishing method using same, and method for producing substrate
#198Double-side polishing method
#199Polishing slurry and polishing method
#200Method for polishing a semiconductor wafer
#201SIC epitaxial wafer and method for manufacturing same
#202Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing of elemental germanium and/or SiGematerial in the presence of a CMP composition comprising a specific organic compound
#203Polishing system and polishing method
#204METHOD FOR POLISHING SILICON WAFER AND POLISHING AGENT
#205PROCESS FOR POLISHING A SEMICONDUCTOR WAFER, COMPRISING THE SIMULTANEOUS POLISHING OF A FRONT SIDE AND OF A REVERSE SIDE OF A SUBSTRATE WAFER
#206Flat SiC semiconductor substrate
#207Silicon wafer and method for producing the same
#208Polishing agent and polishing method
#209Polypyrrolidone polishing composition and method
#210Polishing method of non-oxide single-crystal substrate
#211Method of manufacturing a semiconductor device including a dielectric structure
#212Method for adjusting height position of polishing head and method for polishing workpiece
#213Semiconductor wafer and manufacturing method thereof
#214Polishing composition
#215Method for producing silicon wafer
#216Composition for polishing and method of polishing semiconductor substrate using same
#217Silicon carbide substrate, semiconductor device, and methods for manufacturing them
#218Smoothing method for semiconductor material and wafers produced by same
#219Polishing composition
#220Method of processing surface of high-performance materials which are difficult to process
#221Composition for polishing and composition for rinsing
#222Surface treatment composition and surface treatment method using same
#223METHOD OF MANUFACTURING SILICON CARBIDE SUBSTRATE AND SILICON CARBIDE SUBSTRATE
#224Group III nitride crystal substrate
#225SAW WIRE AND METHOD OF MANUFACTURING GROUP III NITRIDE CRYSTAL SUBSTRATE USING THE SAME
#226Polishing composition and polishing method
#227Method for polishing silicon wafer and polishing liquid therefor
#228Wafer polishing method
#229POLISHING SLURRY AND POLISHING METHOD THEREFOR
#230MANUFACTURING METHOD FOR SEMICONDUCTOR WAFER
#231METHOD FOR RECLAIMING SEMICONDUCTOR WAFER AND POLISHING COMPOSITION
#232Polishing head and polishing apparatus
#233Chemical mechanical polishing of group III-nitride surfaces
#234Semiconductor wafer and method of producing the same
#235Polishing method, polishing apparatus and polishing tool
#236POLISHING SLURRY FOR SILICON CARBIDE AND POLISHING METHOD THEREFOR
#237GROUP III NITRIDE CRYSTAL SUBSTRATE, EPILAYER-CONTAINING GROUP III NITRIDE CRYSTAL SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#238Additive for polishing composition
#239Silicon polishing compositions with improved PSD performance
#240Manufacturing method of SOI substrate
#241Polishing agent, compound semiconductor manufacturing method, and semiconductor device manufacturing method
#242Method for the simultaneous material-removing processing of both sides of at least three semiconductor wafers
#243Method for producing epitaxial silicon wafer
#244Method for cleaning a semiconductor wafer composed of silicon directly after a process of polishing of the semiconductor wafer
#245Method for producing a semiconductor wafer
#246POLISHING COMPOSITION AND POLISHING METHOD
#247SURFACE PROCESSING METHOD AND SURFACE PROCESSING APPARATUS
#248Polishing composition for silicon wafers
#249Group III nitride semiconductor substrate having a sulfide in a surface layer
#250Polishing pad, manufacturing method thereof and polishing method
#251GROUP III NITRIDE SUBSTRATE, EPITAXIAL LAYER-PROVIDED SUBSTRATE, METHODS OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#252Method of polishing a silicon wafer
#253Chemical mechanical polishing of silicon carbide comprising surfaces
#254Silicon polishing compositions with high rate and low defectivity
#255Method for producing silicon epitaxial wafer
#256Semiconductor wafer polishing method and polishing pad shaping jig
#257Smoothing method for semiconductor material and wafers produced by same
#258Method for polishing silicon wafer, method for producing silicon wafer, apparatus for polishing disk-shaped workpiece, and silicon wafer
#259Nitride semiconductor substrate, production method therefor and nitride semiconductor device
#260Method for the double-side polishing of a semiconductor wafer
#261Method for polishing a semiconductor wafer
#262CdTe semiconductor substrate for epitaxial growth and substrate container
#263Method for polishing a semiconductor wafer
#264Polishing Composition and Polishing Method Using The Same
#265Methods for reducing the width of the unbonded region in SOI structures
#266Semiconductor wafers with reduced roll-off and bonded and unbonded SOI structures produced from same
#267SILICON CARBIDE SINGLE CRYSTAL SUBSTRATE
#268SILICON CARBIDE MONOCRYSTAL SUBSTRATE AND MANUFACTURING METHOD THEREFOR
#269GROUP III NITRIDE CRYSTAL AND METHOD FOR SURFACE TREATMENT THEREOF, GROUP III NITRIDE STACK AND MANUFACTURING METHOD THEREOF, AND GROUP III NITRIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#270Composition and method for polishing polysilicon
#271METHOD FOR PRODUCING A SEMICONDUCTOR WAFER
#272Group III nitride substrate, epitaxial layer-provided substrate, methods of manufacturing the same, and method of manufacturing semiconductor device
#273Wafer polishing method and double-side polishing apparatus
#274Method and apparatus for conformable polishing
#275Polishing composition
#276METHOD FOR POLISHING HETEROSTRUCTURES
#277Method for polishing a semiconductor wafer
#278Semiconductor wafer re-use using chemical mechanical polishing
#279Method for producing a semiconductor wafer
#280METHOD FOR POLISHING A SEMICONDUCTOR WAFER
#281Reprocessing method of semiconductor substrate, manufacturing method of reprocessed semiconductor substrate, and manufacturing method of SOI substrate
#282METHOD FOR POLISHING SEMICONDUCTOR WAFERS
#283Method for reprocessing semiconductor substrate, method for manufacturing reprocessed semiconductor substrate, and method for manufacturing SOI substrate
#284Composition and method for polishing bulk silicon
#285Composition and method for polishing bulk silicon
#286Method for reprocessing semiconductor substrate, method for manufacturing reprocessed semiconductor substrate, and method for manufacturing SOI substrate
#287Method for producing a polished semiconductor wafer
#288METHOD FOR PRODUCING LASER-MARKED SEMICONDUCTOR WAFER
#289GaN CRYSTAL SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#290POLISHING OIL SLURRY FOR POLISHING HARD CRYSTAL SUBSTRATE
#291Method for the local polishing of a semiconductor wafer
#292Polishing pad and method for polishing a semiconductor wafer
#293Method for the double sided polishing of a semiconductor wafer
#294Method for producing a semiconductor wafer
#295Methods for producing and processing semiconductor wafers
#296Polishing composition and polishing method using the same
#297Polishing composition
#298Semiconductor wafer manufacturing method
#299Polishing silicon carbide
#300Nitride semiconductor wafer and method of processing nitride semiconductor wafer