207000 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof; Cleaning; Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION VIA ETCHING OPERATIONS
#2CONDUCTIVE STRUCTURES
#3CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
#4SEMICONDUCTOR DEVICE WITH LOW-GALVANIC CORROSION STRUCTURES, AND METHOD OF MAKING SAME
#5INCREASING Q-TIME
#6SCHOTTKY BARRIER DIODE WITH REDUCED LEAKAGE CURRENT AND METHOD OF FORMING THE SAME
#7SELECTIVE TUNGSTEN NAND DEEP CONTACT GAP BOTTOM FILL
#8Contact with a Silicide Region
#9SEMICONDUCTOR PROCESSING FOR FORMING ISOLATION STRUCTURE IN SEMICONDUCTOR SUBSTRATE
#10PROCESSING SOLUTION, METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR
#11PROCESSING SOLUTION, METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR
#12MULTI-LAYER LINE STRUCTURE
#13PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE
#14SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
#15SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#16METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTURING PROCESSED SEMICONDUCTOR SUBSTRATE, AND RELEASING AND DISSOLVING COMPOSITION
#17Contact Feature Through Heterogeneous Stacked Film and Methods of Making Same
#18Ramped Spin-Dry on Semiconductor Wafer
#19SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
#20CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
#21DEPOSITION WINDOW ENLARGEMENT
#22METHOD OF FORMING A MEOL CONTACT STRUCTURE
#23SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
#24INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICES
#25VIA-FIRST PROCESS FOR CONNECTING A CONTACT AND A GATE ELECTRODE
#26SEMICONDUCTOR DEVICE
#27METHOD OF DETECTING PHOTORESIST SCUM, METHOD OF FORMING SEMICONDUCTOR PACKAGE AND PHOTORESIST SCUM DETECTION APPARATUS
#28HYBRID MOLYBDENUM FILL SCHEME FOR LOW RESISTIVITY SEMICONDUCTOR APPLICATIONS
#29TRANSISTOR STRUCTURE WITH AIR GAP AND METHOD OF FABRICATING THE SAME
#30SOFT ASHING PROCESS FOR FORMING PROTECTIVE LAYER ON CONDUCTIVE CAP LAYER OF SEMICONDUCTOR DEVICE
#31SOURCE/DRAIN CONTACT HAVING A PROTRUDING SEGMENT
#32SCHOTTKY BARRIER DIODE WITH REDUCED LEAKAGE CURRENT AND METHOD OF FORMING THE SAME
#33METHODS OF FORMING INTERCONNECT STRUCTURES
#34SELF-ALIGNED BARRIER FOR METAL VIAS
#35TREATMENT LIQUID, METHOD FOR WASHING SUBSTRATE, AND METHOD FOR REMOVING RESIST
#36ENHANCED DRY DESMEAR EQUIPMENT WITH PROTECTIVE FILM PEELING CAPABILITY FOR INTEGRATED CIRCUITS
#37Semiconductor Wafer Cleaning Solution and Cleaning Method Thereof
#38METHOD FOR FORMING CONDUCTIVE VIA, CONDUCTIVE VIA AND PASSIVE DEVICE
#39TREATMENT LIQUID, METHOD FOR WASHING SUBSTRATE, AND METHOD FOR REMOVING RESIST
#40Semiconductor device and method for manufacturing semiconductor device
#41Multi-layer line structure
#42DC bias in plasma process
#43CONTACT FORMATION PROCESS FOR CMOS DEVICES
#44Selective etch of a substrate
#45WASHING SOLUTION AND WASHING METHOD FOR SEMICONDUCTOR SUBSTRATE
#46CONDUCTIVE STRUCTURES
#47SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
#48Interconnect structure for semiconductor devices
#49CONTACT FORMATION PROCESS FOR CMOS DEVICES
#50Deposition window enlargement
#51METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE
#52METHOD OF MANUFACTURING DISPLAY APPARATUS
#53SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
#54INTERCONNECT STRUCTURE
#55SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
#56INTERCONNECT STRUCTURE WITH HYBRID BARRIER LAYER
#57SEMICONDUCTOR DEVICE WITH LOW-GALVANIC CORROSION STRUCTURES, AND METHOD OF MAKING SAME
#58Via-first process for connecting a contact and a gate electrode
#59ETCHING METHOD AND PLASMA PROCESSING APPARATUS
#60Use of a Composition Consisting of Ammonia and an Alkanol for Avoiding Pattern Collapse When Treating Patterned Materials with Line-Space Dimensions of 50 NM or Below
#61Contact features of semiconductor device and method of forming same
#62VIA IN SEMICONDUCTOR DEVICE STRUCTURE
#63SELF-ASSEMBLED MONOLAYER FOR SELECTIVE DEPOSITION
#64Semiconductor structure and manufacturing method thereof
#65Abatement and strip process chamber in a load lock configuration
#66Cleaning formulation for removing residues on surfaces
#67Methods for minimizing feature-to-feature gap fill height variations
#68Method for fabricating semiconductor device with stacked dies
#69Semiconductor structure and manufacturing method thereof
#70Cleaning formulation for removing residues on surfaces
#71METHOD FOR RESOLVING DEFECT OF SURFACE STRUCTURE OF TRENCH AND METHOD FOR PREPARING SEMICONDUCTOR STRUCTURE
#72Semiconductor device and method for manufacturing the same
#73SEMICONDUCTOR STRUCTURE HAVING METAL CONTACT FEATURES
#74Soft ashing process for forming protective layer on conductive cap layer of semiconductor device
#75Method for manufacturing semiconductor device and semiconductor device
#76Methods for copper doped hybrid metallization for line and via
#77Interconnect structure with hybrid barrier layer
#78Contact with a Silicide Region
#79Semiconductor device with stacked dies and method for fabricating the same
#80Substrate processing method and substrate processing apparatus
#81Method for metal gate surface clean
#82DC bias in plasma process
#83Methods for forming recesses in source/drain regions and devices formed thereof
#84CLEANING COMPOSITION
#85Method for fabricating semiconductor structure having alignment mark feature
#86Schottky barrier diode with reduced leakage current and method of forming the same
#87Semiconductor Device and Method of Manufacture
#88CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES
#89Multi-step pre-clean for selective metal gap fill
#90Transistor structure with air gap and method of fabricating the same
#91Treatment liquid, method for washing substrate, and method for removing resist
#92Method of forming a barrier layer in an interconnect structure of semiconductor device
#93Semiconductor device and cleaning system
#94Semiconductor device with low-galvanic corrosion structures, and method of making same
#95Semiconductor structure
#96Semiconductor device with thermal release layer and method for fabricating the same
#97Radiation of Substrates During Processing and Systems Thereof
#98Source/drain contact having a protruding segment
#99Forming contact holes with controlled local critical dimension uniformity
#100Semiconductor device with thermal release layer and method for fabricating the same
#101Semiconductor device and method for manufacturing semiconductor device
#102Cleaning formulation for removing residues on surfaces
#103Self-aligned barrier for metal vias
#104Transistor structure with air gap and method of fabricating the same
#105Semiconductor device and method of manufacture
#106Method for fabricating semiconductor device with stress relief structure
#107Interconnect structure for semiconductor devices
#108METHOD OF FABRICATING A SEMICONDUCTOR DEVICE HAVING REDUCED CONTACT RESISTANCE
#109Via-first process for connecting a contact and a gate electrode
#110Methods and apparatus for cleaning substrates
#111Deposition window enlargement
#112Radiation of substrates during processing and systems thereof
#113Low-temperature plasma pre-clean for selective gap fill
#114Semiconductor device
#115Method for manufacturing semiconductor structure
#116Semiconductor ICF target processing
#117Multi-step pre-clean for selective metal gap fill
#118Semiconductor device and fabrication method thereof
#119Semiconductor device having contact plug
#120Methods and apparatus for forming dual metal interconnects
#121Multi-layer line structure and method for manufacturing thereof
#122Cleaning composition for post-etch or post ash residue removal from a semiconductor substrate and corresponding manufacturing process
#123METHODS FOR RELIABLY FORMING MICROELECTRONIC DEVICES WITH CONDUCTIVE CONTACTS TO SILICIDE REGIONS, AND RELATED SYSTEMS
#124Semiconductor cleaning equipment and method for cleaning through vias using the same
#125Methods of forming contact features in semiconductor devices
#126Method of manufacturing semiconductor device
#127Via-first process for connecting a contact and a gate electrode
#128Metal-containing passivation for high aspect ratio etch
#129Freezing a sacrificial material in forming a semiconductor
#130Method of manufacturing semiconductor device
#131Schottky barrier diode with reduced leakage current and method of forming the same
#132Semiconductor device and manufacturing method thereof
#133Method for making self-aligned barrier for metal vias In-Situ during a metal halide pre-clean and associated interconnect structure
#134Methods for manufacturing a MOSFET
#135Substrate processing method and substrate processing apparatus
#136SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#137Method of detecting photoresist scum, method of forming semiconductor package and photoresist scum detection apparatus
#1383D NAND etch
#139Method for manufacturing semiconductor device
#140Source/drain contact having a protruding segment
#141Method for metal gate surface clean
#142Methods and apparatus for hybrid feature metallization
#143Semiconductor structure and fabricating method thereof
#144Methods and apparatus for forming dual metal interconnects
#145Via in semiconductor device structure
#146Process integration approach for selective metal via fill
#147Surface modified dielectric refill structure
#148Cleaning formulation for removing residues on surfaces
#149Method for forming semiconductor device
#150Interconnect structure
#151FinFET device and method of manufacture
#152Methods for forming recesses in source/drain regions and devices formed thereof
#153Pre-Clean for Contacts
#154Semiconductor device and method of manufacture
#155Cleaning chemical composition for the removal of an amorphous passivation layer at the surface of crystalline materials
#156Substrate processing apparatus and substrate processing method
#157Semiconductor device and method for manufacturing semiconductor device
#158DISPLAY DEVICE WITH TOUCH PANEL
#159Semiconductor device and method of manufacture
#160Semiconductor device and method for manufacturing the same
#161Semiconductor structure having metal contact features and method for forming the same
#162Direct growth methods for preparing diamond-assisted heat-dissipation silicon carbide substrates of GaN-HEMTs
#163Substrate processing method and substrate processing device
#164DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
#165Multi-etching process for forming via opening in semiconductor device structure
#166Semiconductor structure with barrier layer and method for forming the same
#167Method of fabricating a semiconductor device having reduced contact resistance
#168Integration of materials removal and surface treatment in semiconductor device fabrication
#169Interconnect structure of semiconductor device including barrier layer located entirely in via
#170Semiconductor structure and manufacturing method of the same
#171Contact with a silicide region
#172Semiconductor device and method of manufacture
#173Line structure and a method for producing the same
#174Line structure and a method for producing the same
#175Preclean and dielectric deposition methodology for superconductor interconnect fabrication
#176ABATEMENT AND STRIP PROCESS CHAMBER IN A LOAD LOCK CONFIGURATION
#177Three-dimensional semiconductor memory devices
#178Low resistant contact method and structure
#179Wet clean solutions to prevent pattern collapse
#180Pre-clean for contacts
#181METHOD OF FORMING A CONTACT PLUG OF A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#182SEMICONDUCTOR DEVICES
#183INDIUM GALLIUM ARSENIDE METAL OXIDE SEMICONDUCTOR FIELD EFFECT TRANSISTOR HAVING A LOW CONTACT RESISTANCE TO METAL ELECTRODE
#184Method for source/drain contact formation in semiconductor devices using common doping and common etching to n-type and p-type source/drains
#185Method for source/drain contact formation in semiconductor devices
#186Method for forming contact plug
#187Methods of forming contact features in semiconductor devices
#188Semiconductor device with an interconnect structure and method for forming the same
#189Via cleaning to reduce resistance
#190Shared contact trench comprising dual silicide layers and dual epitaxial layers for source/drain layers of NFET and PFET devices
#191Shared contact trench comprising dual silicide layers and dual epitaxial layers for source/drain layers of NFET and PFET devices
#192Abatement and strip process chamber in a load lock configuration
#193Cleaning formulation for removing residues on surfaces
#194Methods for forming recesses in source/drain regions and devices formed thereof
#1953D NAND etch
#196Method for cleaning contact hole
#197METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND CLEANING APPARATUS
#198Methods for forming recesses in source/drain regions and devices formed thereof
#199INTEGRATED CIRCUIT CHIP PACKAGE HAVING REDUCED CONTACT PAD SIZE
#200Methods for minimizing sidewall damage during low k etch processes
#201Etching solution for tungsten word line recess
#202Methods and apparatus for cleaning substrates
#203Method of forming a contact with a silicide region
#204DC bias in plasma process
#205Semiconductor device and fabrication method thereof
#206Cleaning formulation for removing residues on surfaces
#207Cleaning formulation for removing residues on surfaces
#208DEGASSING METHOD, DEGASSING CHAMBER, AND SEMICONDUCTOR PROCESSING APPARATUS
#209Method of fabricating a metal layer
#210Apparatus for processing a substrate and display device by using the same
#211Freezing a sacrificial material in forming a semiconductor
#212Method for manufacturing semiconductor device and pre-clean apparatus for semiconductor device
#213Semiconductor structure with barrier layer and method for forming the same
#214Semiconductor structures provided within a cavity and related design structures
#215Treatment liquid and method for washing substrate
#216FinFET device and method of manufacture
#217Copper plasma etching method and manufacturing method of display panel
#218Semiconductor device and method for manufacturing semiconductor device
#219Semiconductor Device, Tool, and Method of Manufacturing
#220Manufacturing method of touch panel
#221Methods for manufacturing a MOSFET
#222Method of forming semiconductor memory device with bit line contact structure
#223Treatment liquid, method for washing substrate, and method for removing resist
#224Treatment liquid, method for washing substrate, and method for removing resist
#225Method for source/drain contact formation in semiconductor devices
#226Double barrier layer sets for contacts in semiconductor device
#227Semiconductor device and method of manufacture
#228Process for producing connections to an electronic chip
#229Manufacturing system and method for forming a clean interface between a functional layer and a two-dimensional layeyed semiconductor
#230Line structure and a method for producing the same
#231SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING SYSTEM AND MEMORY MEDIUM
#232Method of Using a Barrier-Seed Tool for Forming Fine Pitched Metal Interconnects
#233Interconnect structure
#234Method of removing silicon oxide film
#235Device and method for a thin film resistor using a via retardation layer
#236Cleaning composition
#237Etching method and residue removal method
#238Etching method
#239Substrate processing apparatus and substrate loading mechanism
#240Deposition methodology for superconductor interconnects
#241METHOD AND APPARATUS FOR REMOTE PLASMA TREATMENT FOR REDUCING METAL OXIDES ON A METAL SEED LAYER
#242Chemical clean of semiconductor device
#243METHOD OF FORMING SEMICONDUCTOR DEVICE
#244Semiconductor device, tool, and method of manufacturing
#245Preclean and deposition methodology for superconductor interconnects
#246Post-etch treatment of an electrically conductive feature
#247Halogen abatement for high aspect ratio channel device damage layer removal for EPI growth
#248SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM AND RECORDING MEDIUM
#249Selective removal of carbon-containing and nitrogen-containing silicon residues
#250Back-contact thin film semiconductor device structures and methods for their production
#251SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
#252Substrate processing method
#253OXIDE FILM REMOVING METHOD, OXIDE FILM REMOVING APPARATUS, CONTACT FORMING METHOD, AND CONTACT FORMING SYSTEM
#254SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#255Post chemical mechanical polishing formulations and method of use
#256Substrate processing method and substrate processing apparatus
#257Semiconductor manufacturing method and plasma processing apparatus
#258Semiconductor memory device with bit line contact structure and method of forming the same
#259Methods of minimizing plasma-induced sidewall damage during low K etch processes
#260Post-etch residue removal for advanced node beol processing
#261Semiconductor device with an interconnect structure and method for forming the same
#262Method for forming semiconductor device contact
#263Semiconductor device with contact plug
#264Method and system for fabrication semiconductor device
#265Low resistance contact method and structure
#266Interlevel conductor pre-fill utilizing selective barrier deposition
#267Method of forming superconductor structures
#268Fan-out semiconductor package
#269Cobalt deposition selectivity on copper and dielectrics
#270Semiconductor devices and FinFETs
#271Contact module for optimizing emitter and contact resistance
#272Manufacturing method of semiconductor device
#273Method of manufacturing semiconductor package
#274Cleaning formulations for removing residues on semiconductor substrates
#275Self-aligned trench metal-alloying for III-V nFETs
#276Method of treating semiconductor substrate
#277Manufacturing methods to protect ULK materials from damage during etch processing to obtain desired features
#278Post chemical mechanical polishing formulations and method of use
#279Manufacturing method of semiconductor device
#280Substrate processing method and substrate processing device
#281Electronic device
#282Method of manufacturing electronic device
#283Apparatus for processing a substrate and display device by using the same
#284Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits
#285Method of making three-dimensional semiconductor memory device having laterally undulating memory films
#286Via cleaning to reduce resistance
#287Interconnect structure and semiconductor structures for assembly of cryogenic electronic packages
#288Semiconductor device and fabrication method thereof
#289Semiconductor device and method for manufacturing semiconductor device
#290Alkaline earth metal-containing cleaning solution for cleaning semiconductor element, and method for cleaning semiconductor element using same
#291Semiconductor device and method of manufacture
#292Coating formation method and semiconductor device manufacturing method using the coating formation method
#293Substrate production method, substrate processing apparatus, and substrate production system
#294Compositions and methods for selectively etching titanium nitride
#295Interconnect structure and method of forming
#296Semiconductor element cleaning solution that suppresses damage to cobalt, and method for cleaning semiconductor element using same
#297Substrate processing apparatus and substrate processing method
#298Semiconductor element cleaning solution that suppresses damage to tantalum-containing materials, and cleaning method using same
#299Method for forming semiconductor device structure
#300APPARATUS AND METHOD FOR FORMING METAL BY HOT-WIRE ASSISTED CLEANING AND ATOMIC LAYER DEPOSITION