207000 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof; Cleaning; Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
Method for metal gate surface clean
#302Opening fill process and structures formed thereby
#303Anti-reflective coating cleaning and post-etch residue removal composition having metal, dielectric and nitride compatibility
#304Aqueous and semi-aqueous cleaners for the removal of post-etch residues with tungsten and cobalt compatibility
#305Fully silicided linerless middle-of-line (MOL) contact
#306Liquid composition for cleaning semiconductor device, and method for cleaning semiconductor device
#307Method for manufacturing dual damascene structure
#308Cleaning method
#309Method for manufacturing active-matrix display panel, and active-matrix display panel
#310Interlevel conductor pre-fill utilizing selective barrier deposition
#311Through substrate via liner densification
#312Methods and apparatus for cleaning semiconductor wafers
#313Interconnect structures and methods for fabricating interconnect structures
#314Method of manufacturing a semiconductor device
#315METHODS FOR MINIMIZING SIDEWALL DAMAGE DURING LOW K ETCH PROCESSES
#316Cleaning formulation for removing residues on surfaces
#317Drying process for high aspect ratio features
#318Methods for pre-cleaning conductive materials on a substrate
#319Surface treatment agent and surface treatment method
#320TiN pull-back and cleaning composition
#321Substrate processing apparatus and substrate processing method
#322Semiconductor device structure and method for forming the same
#323Semiconductor device with an interconnect structure and method for forming the same
#324STABLE HIGH MOBILITY MOTFT AND FABRICATION AT LOW TEMPERATURE
#325Method for cleaning via of interconnect structure of semiconductor device structure
#326Semiconductor element cleaning liquid and cleaning method
#327Sidewall protection scheme for contact formation
#328Substrate processing method and substrate processing apparatus
#329Method of using a barrier-seed tool for forming fine pitched metal interconnects
#330POST CHEMICAL MECHANICAL POLISHING FORMULATIONS AND METHOD OF USE
#331Method for manufacturing liquid ejection head
#332Cleaning high aspect ratio vias
#333Removal composition for selectively removing hard mask and methods thereof
#334Plating method, recording medium and plating system
#335Polishing of small composite semiconductor materials
#336Semiconductor device and method for manufacturing the same
#337Liquid composition for removing titanium nitride, semiconductor-element cleaning method using same, and semiconductor-element manufacturing method
#338Removal composition for selectively removing hard mask and methods thereof
#339Microelectronic devices with through-silicon vias and associated methods of manufacturing
#340Non-volatile memory device and method for manufacturing the same
#341Cleaning liquid for lithography and method for forming wiring
#342Metal etchant compositions and methods of fabricating a semiconductor device using the same
#343Manufacturing method of semiconductor device
#344Stripping compositions having high WN/W etching selectivity
#345Aqueous formulations for removing metal hard mask and post-etch residue with Cu/W compatibility
#346Method for metal gate surface clean
#347Semiconductor device and method for forming the same
#348Opening fill process and structure formed thereby
#349Contact module for optimizing emitter and contact resistance
#350Semiconductor devices and FinFETS
#351Compositions and methods for selectively etching titanium nitride
#352Dimension-controlled via formation processing
#353Method of processing a semiconductor device and chip package
#354Semiconductor structure with contact plug
#355METHOD FOR TREATING INNER WALL SURFACE OF MICRO-VACANCY
#356Contact clean in high-aspect ratio structures
#357Semiconductor device and method of fabricating the same
#358Spacer passivation for high-aspect ratio opening film removal and cleaning
#359Method of forming contact openings for a transistor
#360Liquid composition and etching method for etching silicon substrate
#361Neutral beam etching of Cu-containing layers in an organic compound gas environment
#362Dimension-controlled via formation processing
#363Semiconductor structure and manufacturing method thereof
#364Methods for forming interconnect structure utilizing selective protection process for hardmask removal process
#365Hard mask removal scheme
#366AQUEOUS CLEANING COMPOSITION CONTAINING COPPER-SPECIFIC CORROSION INHIBITOR FOR CLEANING INORGANIC RESIDUES ON SEMICONDUCTOR SUBSTRATE
#367Method for repairing damages to sidewalls of an ultra-low dielectric constant film
#368Enhancement mode III-nitride transistor
#369Substrate for display device and method for manufacturing display device
#370Methods and apparatus for cleaning semiconductor wafers
#371METHOD OF RINSING AND DRYING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
#372Hardmask removal for copper interconnects with tungsten contacts by chemical mechanical polishing
#373Method for forming a metal gate including de-oxidation of an oxidized surface of the metal gate utilizing a reducing agent
#374Methods of forming semiconductor devices and FinFETs
#375Etching method of semiconductor substrate, and method of producing semiconductor device
#376Cleaning composition, cleaning process, and process for producing semiconductor device
#377METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND DEVICE MANUFACTURED USING THE SAME
#378Method for improving chemical resistance of polymerized film, polymerized film forming method, film forming apparatus, and electronic product manufacturing method
#379Semiconductor device having structure capable of suppressing oxygen diffusion and method of manufacturing the same
#380Methods for etching a dielectric barrier layer in a dual damascene structure
#381Cleaning liquid for semiconductor elements and cleaning method using same
#382Method for cleaning metal gate surface
#383SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#384Semiconductor device, method for manufacturing the same, and rinsing liquid
#385Prevention of metal loss in wafer processing
#386Methods and systems for chemical mechanical polish and clean
#387Composition for titanium nitride hard mask and etch residue removal
#388Cleaning formulation for removing residues on surfaces
#389Cleaning liquid composition, method for cleaning semiconductor element, and method for manufacturing semiconductor element
#390Method of manufacturing display apparatus using etching buffer layer
#391Methods for barrier layer removal
#392SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#393Method and hardware for enhanced removal of post etch polymer and hardmask removal
#394Etching method, and method of producing semiconductor substrate product and semiconductor device using the same
#395Semiconductor device and method for producing same having multilayer wiring structure with contact hole having hydrophobic film formed on side surface of the contact hole
#396Cleaning formulations for removing residues on surfaces
#397Aqueous cleaning techniques and compositions for use in semiconductor device manufacture
#398Interface treatment of semiconductor surfaces with high density low energy plasma
#399Pre-cleaning a semiconductor structure
#400SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS AND STORAGE MEDIUM
#401Semiconductor structures and fabrication method thereof
#402Array substrate, method for manufacturing the same and display device
#403Wiring structure having interlayer insulating film and wiring line without a barrier layer between
#404Methods and apparatuses for atomic layer cleaning of contacts and vias
#405Semiconductor structures and fabrication methods for improving undercut between porous film and hardmask film
#406Compositions and methods for selectively etching titanium nitride
#407Substrate cleaning method, substrate cleaning device, and vacuum processing device
#408Methods for coating a substrate with an amphiphilic compound
#409Oxidizing aqueous cleaner for the removal of post-etch residues
#410Ultrashallow emitter formation using ALD and high temperature short time annealing
#411Method for removing native oxide and associated residue from a substrate
#412Microelectronic devices with through-silicon vias and associated methods of manufacturing
#413Wet cleaning method for cleaning small pitch features
#414Methods for forming semiconductor materials in STI trenches
#415Method and equipment for removing photoresist residue after dry etch
#416Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer
#417Semiconductor process
#418In situ chamber clean with inert hydrogen helium mixture during wafer process
#419Method of etching a porous dielectric material
#420Method for forming copper wiring
#421System for making and cleaning semiconductor device
#422Cleaning composition, cleaning process, and process for producing semiconductor device
#423Organic light-emitting display device and manufacturing method of the same
#424Substrate cleaning method and system using atmospheric pressure atomic oxygen
#425Nanowire LED structure and method for manufacturing the same
#426Al bond pad clean method
#427Method for forming a vertical electrical connection in a layered semiconductor structure
#428Deposit removal method
#429Semiconductor hole structure
#430Semiconductor structures provided within a cavity and related design structures
#431Method of dielectric film treatment
#432Etching method, and etching liquid to be used therein and method of producing a semiconductor substrate product using the same
#433PROCESSES FOR FORMING INTEGRATED CIRCUITS WITH POST-PATTERNING TREAMENT
#434Methods for coating a substrate with an amphiphilic compound
#435Raised silicide contact
#436METHOD AND APPARATUS FOR SUBSTRATE PRECLEAN WITH HYDROGEN CONTAINING HIGH FREQUENCY RF PLASMA
#437Method for removing oxide
#438Composition for and method of suppressing titanium nitride corrosion
#439Aqueous cleaner for the removal of post-etch residues
#440Methods of forming hydrophobic surfaces on semiconductor device structures, methods of forming semiconductor device structures, and semiconductor device structures
#441Aqueous cleaning techniques and compositions for use in semiconductor device manufacturing
#442Substrate treatment apparatus
#443Method for cleaning semiconductor substrate
#444Oxidation-free copper metallization process using in-situ baking
#445Manufacturing method of a semiconductor device
#446Formation of SiOCl-containing layer on exposed low-k surfaces to reduce low-k damage
#447Sidewall and chamfer protection during hard mask removal for interconnect patterning
#448Abatement and strip process chamber in a load lock configuration
#449Substrate cleaning method
#450Cleaning solution and damascene process using the same
#451Metal line and via formation using hard masks
#452Semiconductor device manufacturing method
#453METHOD FOR CLEANING A SEMICONDUCTOR DEVICE
#454Thin film transistor and method of manufacturing trench, metal wire, and thin film transistor array panel
#455Method of processing a contact pad
#456Titanium-nitride removal
#457Semiconductor device production method and rinse
#458Method of manufacturing semiconductor memory device
#459GRADED DENSITY LAYER FOR FORMATION OF INTERCONNECT STRUCTURES
#460Methods for stripping photoresist and/or cleaning metal regions
#461Method of modifying a low k dielectric layer having etched features and the resulting product
#462Process for removing material from substrates
#463Post etch treatment (PET) of a low-K dielectric film
#464Methods of forming conductive structures in dielectric layers on an integrated circuit device
#465Post-etch treating method
#466Method of BARC removal in semiconductor device manufacturing
#467Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
#468Method for removing material from semiconductor wafer and apparatus for performing the same
#469SUBSTRATE CLEANING METHOD AND SEMICONDUCTOR MANUFACTURING APPARATUS
#470Semiconductor device and method for forming the same
#471METHOD AND COMPOSITION FOR REMOVING RESIST, ETCH RESIDUE, AND COPPER OXIDE FROM SUBSTRATES HAVING COPPER, METAL HARDMASK AND LOW-K DIELECTRIC MATERIAL
#472Substrate wiring method and semiconductor manufacturing device
#473Nitrile and amidoxime compounds and methods of preparation for semiconductor processing
#474Method of fabricating semiconductor device
#475Plasma treatment method, plasma treatment apparatus, and semiconductor device manufacturing method
#476Cleaning method of semiconductor manufacturing process
#477Methods to mitigate plasma damage in organosilicate dielectrics
#478Method of forming an interconnection structure
#479Copper interconnect with metal hardmask removal
#480Composition for Removing Photoresist and/or Etching Residue From a Substrate and Use Thereof
#481Methods of removing a material layer from a substrate using water vapor treatment
#482BENIGN, LIQUID CHEMICAL SYSTEM-BASED BACK END OF LINE (BEOL) CLEANING
#483Post-etching treatment process for copper interconnecting wires
#484Processes and Systems for Engineering a Barrier Surface for Copper Deposition
#485Microelectronic devices with through-silicon vias and associated methods of manufacturing
#486Process for forming cobalt-containing materials
#487Semiconductor device and method of manufacturing the same
#488Method to alter silicide properties using GCIB treatment
#489Methods for contact clean
#490Method for clearing native oxide
#491Method for fabricating semiconductor device
#492Process for forming cobalt and cobalt silicide materials in tungsten contact applications
#493Method for forming semiconductor device
#494Solutions for cleaning semiconductor structures and related methods
#495Substrate processing method
#496Methods of fabricating semiconductor devices
#497Methods of forming metal patterns in openings in semiconductor devices
#498Method for manufacturing a semiconductor device having a silicide region comprised of a silicide of a nickel alloy
#499Process for inhibiting oxide formation on copper surfaces
#500VACUUM PROCESSING APPARATUS AND VACUUM PROCESSING METHOD
#501METHOD AND SYSTEM FOR PROCESSING SEMICONDUCTOR WAFER
#502Method for etching organic hardmasks
#503Metal containing sacrifice material and method of damascene wiring formation
#504Method of Post Etch Polymer Residue Removal
#505Semiconductor device with inverted trapezoidal cross sectional profile in surface areas of substrate
#506Method to improve reliability (EM and TDDB) with post silylation plasma treatment process for copper damascene structures
#507Methods and apparatus for cleaning semiconductor wafers
#508Method of forming contacts for a semiconductor device
#509CLEANING METHOD FOR SEMICONDUCTOR WAFER AND CLEANING DEVICE FOR SEMICONDUCTOR WAFER
#510Resist stripping compositions and methods for manufacturing electrical devices
#511Substrate processing method and system
#512Damascene process using cleaning solution
#513CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES
#514Ru cap metal post cleaning method and cleaning chemical
#515Method to fabricate thin metal via interconnects on copper wires in MRAM devices
#516Resist stripping compositions and methods for manufacturing electrical devices
#517APPARATUS FOR MANUFACTURING A SEMICONDUCTOR DEVICE
#518Memory device
#519Cleaning solution, cleaning method and damascene process using the same
#520SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#521Composition for stripping and cleaning and use thereof
#522Multipurpose acidic, organic solvent based microelectronic cleaning composition
#523Cleaning apparatus of semiconductor substrate and method of manufacturing semiconductor device
#524Method for fabricating interconnection structure with dry-cleaning process
#525Method and apparatus for silicon oxide residue removal
#526Method for recovering damaged components in lower region of low dielectric insulating film
#527Methods and apparatus for cleaning semiconductor wafers
#528Semiconductor device manufacturing method and target substrate processing system
#529Method for fabricating low-k dielectric and Cu interconnect
#530Residue removing liquid composition and method for cleaning semiconductor element using same
#531Method for filling metal
#532Semiconductor process
#533METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS
#534Substrate treatment apparatus and substrate treatment method
#535Vacuum processing method and vacuum processing apparatus
#536Cleaning composition, cleaning process, and process for producing semiconductor device
#537Copper wiring surface protective liquid and method for manufacturing semiconductor circuit
#538Method of manufacturing semiconductor device, semiconductor manufacturing apparatus, and storage medium
#539Method for Forming Contact Opening
#540METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#541CLEANING SOLUTION FOR SIDEWALL POLYMER OF DAMASCENE PROCESSES
#542Noble metal activation layer
#543Plasma ashing method
#544Substrate processing method
#545Aqueous acidic formulations for copper oxide etch residue removal and prevention of copper electrodeposition
#546Cleaning liquid for lithography and method for forming wiring
#547Semiconductor process
#548Oxidizing aqueous cleaner for the removal of post-etch residues
#549Method of manufacturing a semiconductor device
#550Film forming method and processing system
#551Method and device for cleaning a substrate and storage medium
#552Solution for removal of residue after semiconductor dry process and residue removal method using same
#553Method to remove capping layer of insulation dielectric in interconnect structures
#554Etching and cleaning methods and etching and cleaning apparatuses used therefor
#555Cleaning liquid for lithography and method for forming wiring
#556PROCESS FOR FORMING COBALT-CONTAINING MATERIALS
#557Enhancement mode III-nitride transistors with single gate Dielectric structure
#558NON-SELECTIVE OXIDE ETCH WET CLEAN COMPOSITION AND METHOD OF USE
#559Method to alter silicide properties using GCIB treatment
#560BARRIER INTEGRATION SCHEME FOR HIGH-RELIABILITY VIAS
#561UV and reducing treatment for K recovery and surface clean in semiconductor processing
#562Contact clean by remote plasma and repair of silicide surface
#563Process for forming cobalt and cobalt silicide materials in tungsten contact applications
#564PLASMA-BASED ORGANIC MASK REMOVAL WITH SILICON FLUORIDE
#565Cleaning composition, cleaning process, and process for producing semiconductor device
#566Method of manufacturing semiconductor device
#567METHOD FOR CLEANING WITH FLUORINE COMPOUND
#568Ultrashallow emitter formation using ALD and high temperature short time annealing
#569Method for processing amorphous carbon film, and semiconductor device manufacturing method using the method
#570Semiconductor process
#571Semiconductor device and method for manufacturing the same
#572Method of manufacturing a semiconductor device
#573Methods for fabricating semiconductor devices including azeotropic drying processes
#574Post-dry etching cleaning liquid composition and process for fabricating semiconductor device
#575METHOD FOR CLEANING A SEMICONDUCTOR DEVICE
#576High yield and high throughput method for the manufacture of integrated circuit devices of improved integrity, performance and reliability
#577Etching method and recording medium
#578Use of oxidants for the processing of semiconductor wafers, use of a composition and composition therefore
#579Method for low-K dielectric etch with reduced damage
#580Manufacturing method of semiconductor device
#581Solution for removing residue after semiconductor dry process and method of removing the residue using the same
#582Selective deposition of metal-containing cap layers for semiconductor devices
#583Semiconductor device and manufacturing method thereof
#584PROCESS FOR STRIPPING PHOTORESIST AND REMOVING DIELECTRIC LINER
#585Substrate etching method and system
#586Methods of forming metal patterns in openings in semiconductor devices
#587Method of manufacturing semiconductor integrated circuit device
#588Manufacturing method of semiconductor integrated circuit device
#589Method for manufacturing a semiconductor device and semiconductor device obtainable with such a method
#590Methods of etching oxide, reducing roughness, and forming capacitor constructions
#591Method of manufacturing a semiconductor device
#592Providing superior electromigration performance and reducing deterioration of sensitive low-k dielectrics in metallization systems of semiconductor devices
#593Contact structure of a semiconductor device
#594METHOD FOR FORMING TI FILM AND TIN FILM, CONTACT STRUCTURE, COMPUTER READABLE STORAGE MEDIUM AND COMPUTER PROGRAM
#595PROCESS FOR INHIBITING OXIDE FORMATION ON COPPER SURFACES
#596SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#597Solution for removing residue after semiconductor dry process and method of removing the residue using the same
#598COUPLING LAYER COMPOSITION FOR A SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, METHOD OF FORMING THE COUPLING LAYER, AND APPARATUS FOR THE MANUFACTURE OF A SEMICONDUCTOR DEVICE
#599Method for manufacturing a semiconductor device having a silicide region comprised of a silicide of a nickel alloy
#600Composition for cleaning and rust prevention and process for producing semiconductor element or display element