207020 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof; Forming layers; Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
Selective deposition of etch-stop layer for enhanced patterning
#302Hard-mask forming composition and method for manufacturing electronic component
#303Deposition of organic films
#304Methods to deposit flowable (gap-fill) carbon containing films using various plasma sources
#305Method for etching organic region
#306Film-forming apparatus and film-forming method
#307Semiconductor structures including liners comprising alucone and related methods
#308Method for transferring thin layers
#309Surface treatment of silicon or silicon germanium surfaces using organic radicals
#310Etching method
#311Nitride-based electronic device and method for manufacturing same
#312Substrate processing tool with integrated metrology and method of using
#313Resist underlayer film forming composition
#314Vapor phase deposition of organic films
#315Display device with passivation layer that directly contacts the substrate and manufacturing method thereof
#316Method for forming a functionalised assembly guide
#317Using sacrificial polymer materials in semiconductor processing
#318SEMICONDUCTOR SUBSTRATE TREATMENT AGENT AND SUBSTRATE-TREATING METHOD
#319DEVICE COMPRISING INTEGRATION OF DIE TO DIE WITH POLYMER PLANARIZATION LAYER
#320High temperature ultra-fast annealed soft mask for semiconductor devices
#321Method for forming a cross-linked layer
#322Conductive line system and process
#323Spacer-damage-free etching
#324WAFER MANUFACTURING METHOD AND WAFER
#325Fabrication of transistors having stressed channels
#326Use of silicon structure former with organic substituted hardening additive compounds for dense OSG films
#327MOLECULAR ENGINEERED CONJUGATED POLYMER WITH HIGH THERMAL CONDUCTIVITY
#328Polymer, organic layer composition, and method of forming patterns
#329Conductive polymers within drilled holes of printed circuit boards
#330Method for processing substrate
#331Method and apparatus for forming a thin layer
#332Selectively deposited parylene masks and methods related thereto
#333Surface treatment of carbon containing films using organic radicals
#334BACK-END-OF-LINE STRUCTURES WITH AIR GAPS
#335Method of processing substrate
#336Etching method and etching apparatus
#337Method and composition for selectively modifying base material surface
#338Method and composition for selectively modifying base material surface
#339Method for forming a chemical guiding structure on a substrate and chemoepitaxy method
#340Contact element structure of a semiconductor device
#341Photosensitive polyimide compositions
#342Semiconductor structure and manufacturing method thereof
#343Method for manufacturing a semiconductor device and a coating material
#344Fully-printed stretchable thin-film transistors and integrated logic circuits
#345Hybrid composite film, method of fabricating the same, and integrated circuit device including hybrid composite film
#346Manufacturing process of element chip
#347Semiconductor process for improving loading effect in planarization
#348Semiconductor device and method for manufacturing the same
#349Substrate processing apparatus, method of manufacturing semiconductor device, and storage medium
#350Vapor-deposited nanoscale ionic liquid gels as gate insulators for low-voltage high-speed thin film transistors
#351Method of forming a passivation layer
#352Method of manufacturing semiconductor device and substrate processing apparatus
#353Integrated circuit devices and methods of fabricating the same
#354Method of manufacturing semiconductor device
#355Methods for plasma depositing polymers comprising cyclic siloxanes and related compositions and articles
#356Method of manufacturing semiconductor device
#357Anti-reflective gap filling materials and methods
#358Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same
#359Surface treatment of silicon and carbon containing films by remote plasma with organic precursors
#360Direct formation of hexagonal boron nitride on silicon based dielectrics
#361Semiconductor structure and fabrication method thereof
#362Direct-bonded LED arrays and applications
#363Fill material to mitigate pattern collapse
#364Wiring substrate for electronic component inspection apparatus
#365Dielectric film forming composition
#366Semiconductor device and method for manufacturing the same
#367Via formation using directed self-assembly of a block copolymer
#368Dielectric film forming composition
#369Thin film transistor, method of manufacturing the same, and display apparatus including the thin film transistor
#370Negative-type photosensitive resin composition, cured film, display device provided with cured film, and production method therefor
#371Photosensitive resin composition, polyimide production method, and semiconductor device
#372Semiconductor constructions comprising dielectric material, and methods of forming dielectric fill within openings extending into semiconductor constructions
#373Polymer and composition for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, and patterning process
#374Semiconductor device and fabrication method thereof
#375METHOD OF INCREASING EMBEDDED 3D METAL-INSULATOR-METAL (MIM) CAPACITOR CAPACITANCE DENSITY FOR WAFER LEVEL PACKAGING
#376Methods of Transferring a Graphene Monolayer via a Stacked Structure and Devices Fabricated Thereby
#377Chemoepitaxy etch trim using a self aligned hard mask for metal line to via
#378Resist multilayer film-attached substrate and patterning process
#379Field Effect Transistor and Method for Manufacturing Same
#380Semiconductor device and method
#381Method for integrated circuit manufacturing with directed self-assembly (DSA)
#382Method for manufacturing electronic device
#383Method of removing silicon oxide film
#384Conductive polymers within drilled holes of printed circuit boards
#385Conductive polymers within drilled holes of printed circuit boards
#386Conductive polymers within drilled holes of printed circuit boards
#387Liquid composition for imparting alcohol-repellency to semiconductor substrate material, and method for treating surface of semiconductor substrate using said liquid composition
#388In situ vapor deposition polymerization to form polymers as precursors to viscoelastic fluids for particle removal from substrates
#389Low-temperature passivation of ferroelectric integrated circuits for enhanced polarization performance
#390Wafer level package (WLP) and method for forming the same
#391Selective deposition process utilizing polymer structure deactivation process
#392Phase changing on-chip thermal heat sink
#393Method for reducing reactive ion etch lag in low K dielectric etching
#394Directed self-assembly of block copolymers
#395Composition, laminate, method of manufacturing laminate, transistor, and method of manufacturing transistor
#396Process for fabricating silicon nanostructures
#397Method of forming a contact element of a semiconductor device and contact element structure
#398Selective Molecular Layer Deposition Of Organic And Hybrid Organic-Inorganic Layers
#399Photosensitive resin composition, photosensitive, sheet, semiconductor device and method for manufacturing semiconductor device
#400Organic polymer gate dielectric material for transistor devices
#401Method of fabricating electrodes, method of fabricating thin film transistor, method of fabricating array substrate, thin film transistor, array substrate, and display apparatus
#402Semiconductor constructions comprising dielectric material
#403Bottom-up material formation for planarization
#404Self-assembled nanostructures including metal oxides and semiconductor structures comprised thereof
#405Semiconductor film composition, method for manufacturing semiconductor film composition, method for manufacturing semiconductor member, method for manufacturing semiconductor processing material, and semiconductor device
#406Semiconductor film composition, method of manufacturing semiconductor film composition, method of manufacturing semiconductor member, method of manufacturing semiconductor processing material, and semiconductor device
#407Self-Aligned Triple Patterning Process Utilizing Organic Spacers
#408Semiconductor device
#409Semiconductor device and method for manufacturing the same
#410Lithography patterning with a gas phase resist
#411Methods and apparatus for semiconductor package processing
#412Package structure
#413Sensor packaging using a low-temperature through-silicon via (TSV) technology and method for manufacturing the same
#4143-dimensional printing process for integrated magnetics
#415Method of manufacturing semiconductor device
#416Adhesion of polymers on silicon substrates
#417Capacitor, method for manufacturing same, and wireless communication device using same
#418Fluid dispense methodology and apparatus for imprint lithography
#419Method of Surface Localized Pore Sealing of Porous Dielectric Material
#420Surface treatment methods and compositions therefor
#421Composition for adhesion, stacked structure using the same, and electronic device using the same
#422Method of manufacturing semiconductor device and vacuum processing apparatus
#423Film forming apparatus, film forming method, and storage medium
#424Barrier film constructions
#425Semiconductor device and method for manufacturing same
#426Film deposition method and plasma processing apparatus
#427Package structure
#428Variable frequency microwave (VFM) processes and applications in semiconductor thin film fabrications
#429Selective passivation and selective deposition
#430Method for forming patterns of semiconductor device
#431Laser assisted SiC growth on silicon
#432Design-aware pattern density control in directed self-assembly graphoepitaxy process
#433Selective dry etch for directed self assembly of block copolymers
#434Display substrate having an organic layer and fabricating method thereof
#435Removable temporary protective layers for use in semiconductor manufacturing
#436Semiconductor device and method of manufacturing semiconductor device
#437Thin film transistor, array substrate and their manufacturing methods, and display apparatus
#438Phase changing on-chip thermal heat sink
#439SEMICONDUCTOR DEVICE PACKAGE WITH STRESS RELIEF LAYER
#440Crack prevent and stop for thin glass substrates
#441Technique to deposit sidewall passivation for high aspect ratio cylinder etch
#442METHOD AND DEVICE FOR COATING SUBSTRATES
#443Coatings
#444POLYARYLENE RESINS
#445Fluid droplet methodology and apparatus for imprint lithography
#446Methods for depositing polymer layer for sensor applications via hot wire chemical vapor deposition
#447Fluid droplet methodology and apparatus for imprint lithography
#448Redistribution layer structure and fabrication method therefor
#449Method of forming patterns for semiconductor device
#450Formation of silicon-containing thin films
#451METHODS FOR DEPOSITING FLOWABLE CARBON FILMS USING HOT WIRE CHEMICAL VAPOR DEPOSITION
#452Orientation layer for directed self-assembly patterning process
#453Method for fully self-aligned via formation using a directed self assembly (DSA) process
#454Substrates support apparatus, substrate treating system including the same, and substrate treating method
#455Method of forming topcoat for patterning
#456Precursor composition, photosensitive resin composition, method for producing precursor composition, cured film, method for producing cured film, and semiconductor device
#457Conductive line system and process
#458Mark forming method and device manufacturing method
#459Method of using chemically patterned guide layers in chemoepitaxy directing of block co-polymers
#460PROCESS FOR FABRICATING SILICON NANOSTRUCTURES
#461Manufacturing method of semiconductor device
#462Wafer level integration including design/co-design, structure process, equipment stress management and thermal management
#463Selective fin cut
#464Etching device, substrate processing apparatus, etching method and substrate processing method
#465Method for manufacturing filling planarization film and method for manufacturing electronic device
#466Pattern forming method, self-organization material, and method of manufacturing semiconductor apparatus
#467On-chip integrated temperature protection device based on gel electrolyte
#468Method of quasi atomic layer etching
#469Photosensitive resin composition
#470Semiconductor lithography alignment feature with epitaxy blocker
#471Silicon-based deposition for semiconductor processing
#472Methods of forming nanostructures using self-assembled nucleic acids, and nanostructures thereof
#473Thermal processing device, substrate processing apparatus, thermal processing method and substrate processing method
#474Single-shot encapsulation
#475High-precision dispense system with meniscus control
#476High-purity dispense system
#477Lithography method with surface modification layer
#478Resist underlayer film-forming composition, resist underlayer film, resist underlayer film-forming process, and production method of patterned substrate
#479Separation method, display device, display module, and electronic device
#480Method and structure for gap filling improvement
#481Method for wet etching of block copolymer self-assembly pattern
#482Compositions and Methods Using Same for Carbon Doped Silicon Containing Films
#483Filling Method and Filling Apparatus
#484Method of fabricating semiconductor device, vacuum processing apparatus and substrate processing apparatus
#485Pattern forming method and heating apparatus
#486Passivation structure and method of making the same
#487Design-aware pattern density control in directed self-assembly graphoepitaxy process
#488Polymer resin comprising gap filling materials and methods
#489Articles including ultra low dielectric layers
#490METHODS FOR PLASMA DEPOSITING POLYMERS COMPRISING CYCLIC SILOXANES AND RELATED COMPOSITIONS AND ARTICLES
#491CARBOSILANE POLYMERS
#492Deposition of organic films
#493Deposition of organic films
#494Hard-mask composition
#495Surface modifying material for semiconductor device fabrication
#496WAFER PROCESSING LAMINATE, METHOD FOR MANUFACTURING THEREOF, AND METHOD FOR CHECKING COVERAGE OF ORGANIC FILM ON WAFER
#497PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING CIRCUIT SUBSTRATE
#498Method for depositing a planarization layer using polymerization chemical vapor deposition
#499Selective deposition through formation of self-assembled monolayers
#500THERMALLY CONDUCTIVE SHEET AND ELECTRONIC APPARATUS
#501Hybrid topographical and chemical pre-patterns for directed self-assembly of block copolymers
#502Method for manufacturing flexible OLED display component
#503Method for forming organic film and method for manufacturing substrate for semiconductor apparatus
#504INTEGRATED CIRCUIT SURFACE LAYER WITH ADHESION-FUNCTIONAL GROUP
#505Coating liquid for resist pattern coating
#506Composition for forming interlayer insulating film, interlayer insulating film, method for forming interlayer insulating film pattern, and device
#507Composition for forming interlayer insulating film, interlayer insulating film, method for forming interlayer insulating film pattern, and device
#508Conformal strippable carbon film for line-edge-roughness reduction for advanced patterning
#509Composition for forming coat-type insulating film
#510Method of manufacturing 3-dimensional memories including high aspect ratio memory hole patterns
#511Polymer and thermosetting composition containing same
#512Lithography patterning with a gas phase resist
#513Self-assembled monolayer blocking with intermittent air-water exposure
#514Grafting agent for forming spacer layer
#515Orthogonal patterning method
#516Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
#517Package structure and method for forming the same
#518Photopatternable compositions and methods of fabricating transistor devices using same
#519Organic surface treatments for display glasses to reduce ESD
#520Semiconductor device and method of producing semiconductor device
#521Methods of forming fine patterns
#522Method of manufacturing semiconductor device
#523Method of manufacturing porous body, porous body, method of manufacturing device, device, method of manufacturing wiring structure, and wiring structure
#524Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
#525Chemoepitaxy etch trim using a self aligned hard mask for metal line to via
#526Doping of a substrate via a dopant containing polymer film
#527Method of production of semiconductor device
#528Spacer-damage-free etching
#529Spacers with rectangular profile and methods of forming the same
#530Method of forming semiconductor device using metal-containing hardmask to pattern photoresist having protected polymer
#531Compound for forming organic film, composition for forming organic film, method for forming organic film, and patterning process
#532Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same
#533Integrated circuit surface layer with adhesion-functional group
#534Pattern forming method
#535Compositions and use thereof for modification of substrate surfaces
#536Process for the production of polyimide and polyamic ester polymers
#537Fan-out wafer-level packaging using metal foil lamination
#538NAND flash memory and fabrication methods thereof
#539Phase changing on-chip thermal heat sink
#540Sealing composition and method of manufacturing semiconductor device
#541Resin composition for underlayer film formation, layered product, method for forming pattern, imprint forming kit, and process for producing device
#542Graphene transistor and related methods
#543Permanent dielectric compositions containing photoacid generator and base
#544Method for processing target object
#545Polymer on graphene
#546Organic thin film passivation of metal interconnections
#547Protective film forming method for forming a protective film on a wafer
#548Additions of organic species to facilitate crosslinker removal during PSPI cure
#549Method of fabricating a semiconductor device
#550Methods of forming patterns of semiconductor devices
#551Method of forming pattern of semiconductor device
#552METHOD FOR FORMING A SEMICONDUCTOR DEVICE
#553Variable frequency microwave (VFM) processes and applications in semiconductor thin film fabrications
#554Nanowire channel structures of continuously stacked nanowires for complementary metal oxide semiconductor (CMOS) devices
#555Orientation layer for directed self-assembly patterning process
#556Fan-out wafer-level packaging using metal foil lamination
#557Vapor phase deposition of organic films
#558Semiconductor device and method of fabricating the same
#559Wafer level package (WLP) and method for forming the same
#560Structure and method for interconnection
#561Method of manufacturing an ultra low dielectric layer
#562Method for microwave processing of photosensitive polyimides
#563Method for fabricating a semiconductor integrated chip
#564Method of processing target object
#565Dry etching method and dry etching agent
#566Method of forming a thin film that eliminates air bubbles
#567Method for orienting elongated objects arranged on a surface of a substrate
#568Pattern forming method
#569Self-organization material and pattern formation method
#570Directed self-assembly using trench assisted chemoepitaxy
#571Patterning scheme to minimize dry/wets strip induced device degradation
#572Electronic device and method for manufacturing the same
#573Substrate processing apparatus and substrate processing system
#574Radiation curable polymer formulation and methods for the preparation thereof
#575Laser assisted SiC growth on silicon
#576DRY-REMOVABLE PROTECTIVE COATINGS
#577Equipment and method to automatically transfer a graphene monolayer to a substrate
#578Self-destructing chip
#579Two-dimensional material hard mask, method of manufacturing the same, and method of forming material layer pattern using the hard mask
#580Semiconductor substrates and methods for processing semiconductor substrates
#581Method for protecting layer by forming hydrocarbon-based extremely thin film
#582Method for bonding and interconnecting integrated circuit devices
#583Directed self-assembly
#584Method for fabrication of crack-free ceramic dielectric films
#585Superplanarizing spin-on carbon materials
#586Semiconductor structures including liners comprising alucone and related methods
#587Chemoepitaxy etch trim using a self aligned hard mask for metal line to via
#588Conformal strippable carbon film for line-edge-roughness reduction for advanced patterning
#589Polymer with a good heat resistance and storage stability, underlayer film composition containing the polymer and process for forming underlayer film using the composition
#590Integrated circuits including organic interlayer dielectric layers and methods for fabricating the same
#591Thru-silicon-via structures
#592Methods of forming different sized patterns
#593Non-lithographically patterned directed self assembly alignment promotion layers
#594Template and pattern formation method
#595Non-volatile memory device including charge trapping layer
#596Method of forming pattern and method of manufacturing integrated circuit device by using the same
#597Method of forming pattern and method of manufacturing integrated circuit device by using the same
#598Phase changing on-chip thermal heat sink
#599Cut first alternative for 2D self-aligned via
#600Through electrode, manufacturing method thereof, and semiconductor device and manufacturing method thereof