207161 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising cuprous oxide or cuprous iodide; Preparation of the foundation plate, preliminary treatment oxidation of the foundation plate, reduction treatment Reduction of the copper oxide, treatment of the oxide layer
Field-effect transistor with a total control of the electrical conductivity on its channel
#2METHOD FOR PLANARIZING WAFER SURFACE
#3Fin field effect transistor including a strained epitaxial semiconductor shell
#4Fin field effect transistor including a strained epitaxial semiconductor shell
#5Method of forming copper sulfide film for reducing copper oxidization and loss
#6Methods for forming a self-aligned maskless junction butting for integrated circuits