207197 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AB compounds with or without impurities, e.g. doping materials Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
Sub-classes:SPUTTER TARGETS AND SOURCES FOR SELF-DOPED SOURCE AND DRAIN CONTACTS
#2METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#3SILICON GERMANIUM-ON-INSULATOR FORMATION BY THERMAL MIXING
#4Spectrometer utilizing surface plasmon
#5Semiconductor device having a source region with chalcogen atoms
#6Shallow angle, multi-wavelength, multi-receiver, adjustable sensitivity aligner sensor for semiconductor manufacturing equipment
#7STACKED SEMICONDUCTOR STRUCTURE
#8SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE
#9Signal relay board for power semiconductor modules
#10Method of epitaxial growth shape control for CMOS applications
#11Semiconductor device and a method for forming a semiconductor device
#12Method for producing a pillar-shaped semiconductor device
#13Method of producing differently doped zones in a silicon substrate, in particular for a solar cell
#14Silicon germanium-on-insulator formation by thermal mixing
#15Silicon germanium-on-insulator formation by thermal mixing
#16Ni:NiGe:Ge selective etch formulations and method of using same
#17Method for forming a semiconductor device with implanted chalcogen atoms
#18Method for separating substrates and semiconductor chip
#19Method for forming an electrical contact
#20Pillar-shaped semiconductor device and method for producing the same
#21SiC semiconductor device and method for manufacturing the same
#22Hot-electron transistor having multiple MSM sequences
#23LOCAL INTERCONNECTS BY METAL-III-V ALLOY WIRING IN SEMI-INSULATING III-V SUBSTRATES
#24Active layer ion implantation method and active layer ion implantation method for thin-film transistor
#25Localized implant into active region for enhanced stress
#26Localized implant into active region for enhanced stress
#27Ohmic metal contact protection using an encapsulation layer
#28Ohmic metal contact and channel protection in GaN devices using an encapsulation layer
#29Localized tunneling enhancement for semiconductor devices