ClassID:

207199

H01L21/244 - CPC Classification

Classification description:

Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AB compounds with or without impurities, e.g. doping materials; Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body Alloying of electrode materials

Sub-classes:
Recent Application in this class:
#1
20240332402
2024-10-03

METHOD FOR MANUFACTURING SUPERJUNCTION TRENCH GATE MOSFET

#2
20230253211
2023-08-10

PATTERNING PLATINUM BY ALLOYING AND ETCHING PLATINUM ALLOY

#3
20230131163
2023-04-27

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

#4
20230127783
2023-04-27

FIELD EFFECT TRANSISTOR WITH REDUCED SOURCE/DRAIN RESISTANCE

#5
20210242029
2021-08-05

Patterning platinum by alloying and etching platinum alloy

#6
20210082869
2021-03-18

Wafer-level package structure

#7
20200075536
2020-03-05

Wafer-level packaging method and package structure thereof

#8
20200035500
2020-01-30

Patterning platinum by alloying and etching platinum alloy

#9
20190148377
2019-05-16

Contact formation through low-temperature epitaxial deposition in semiconductor devices

#10
20190115347
2019-04-18

Contact formation through low-tempearature epitaxial deposition in semiconductor devices

#11
20180350930
2018-12-06

Memory devices including gettering agents in memory charge storage structures

#12
20180083114
2018-03-22

MASKLESS METHOD TO REDUCE SOURCE-DRAIN CONTACT RESISTANCE IN CMOS DEVICES

#13
20180061956
2018-03-01

Maskless method to reduce source-drain contact resistance in CMOS devices

#14
20180061642
2018-03-01

Method of manufacturing a semiconductor device including a ternary alloy layer formed by a microwafe anneal process

#15
20170062577
2017-03-02

Apparatus including gettering agents in memory charge storage structures

#16
20170040219
2017-02-09

III-V, SiGe, or Ge base lateral bipolar transistor and CMOS hybrid technology

#17
20160163648
2016-06-09

Method for forming an electrical contact

#18
20150364557
2015-12-17

Gettering agents in memory charge storage structures

#19
20150325666
2015-11-12

SiC semiconductor device and method for manufacturing the same

#20
20150287650
2015-10-08

III-V, Ge, or SiGe fin base lateral bipolar transistor structure and method

#21
20150287642
2015-10-08

III-V, SiGe, or Ge base lateral bipolar transistor and CMOS hybrid technology

#22
20150155366
2015-06-04

Techniques to form uniform and stable silicide

#23
20140353832
2014-12-04

Semiconductor device and manufacturing method thereof

#24
20140295213
2014-10-02

Method for functionalizing a solid substrate, other than a substrate made of gold, via specific chemical compounds

#25
20140264526
2014-09-18

Gettering agents in memory charge storage structures

#26
20130249099
2013-09-26

Techniques to form uniform and stable silicide

#27
20120098047
2012-04-26

Gettering agents in memory charge storage structures

#28
20070138487
2007-06-21

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME