207202 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AB compounds with or without impurities, e.g. doping materials Bombardment with radiation
Sub-classes:METHODS OF FORMING TRANSITION METAL DICHALCOGENIDE FILMS
#2WAFER AND DIE SHAPE CONTROL
#3SYSTEM AND METHOD FOR PLASMA PROCESS
#4ADJUSTABLE SUPPORT FOR ARC CHAMBER OF ION SOURCE
#5CARBON REPLENISHMENT OF SILICON-CONTAINING MATERIALS TO REDUCE THICKNESS LOSS
#6Wafer Bonding Apparatus and Method
#7APPARATUS AND METHOD FOR DETECTING TENSION ABNORMALITY IN DICING TAPE
#8SUBSTRATE SCANNING APPARATUS WITH PENDULUM AND ROTATABLE SUBSTRATE HOLDER
#9ADJUSTABLE SUPPORT FOR ARC CHAMBER OF ION SOURCE
#10Semiconductor structure and manufacturing method thereof
#11METHODS AND APPARATUS FOR MINIMIZING SUBSTRATE BACKSIDE DAMAGE
#12METHODS, APPARATUS, AND SYSTEMS FOR MAINTAINING FILM MODULUS WITHIN A PREDETERMINED MODULUS RANGE
#13SUBSTRATE SCANNING APPARATUS WITH PENDULUM AND ROTATABLE SUBSTRATE HOLDER
#14Wafer bonding apparatus and method
#15Adjustable support for arc chamber of ion source
#16Semiconductor chip, processed wafer, and method for manufacturing semiconductor chip
#17Bulk wafer switch isolation
#18Apparatus and method fabricating semiconductor device
#19Bulk wafer switch isolation
#20Enhanced etch resistance for insulator layers implanted with low energy ions
#21Optical heating device
#22Testing device
#23Methods and apparatus for minimizing substrate backside damage
#24Wafer bonding method and structure thereof
#25METHOD AND SYSTEM FOR IMPROVING WAFER BONDING STRENGTH
#26Substrate processing apparatus and manufacturing method of semiconductor device
#27Radiation-hard precision voltage reference
#28Method for reducing defects of electronic components by a supercritical fluid
#29Hybrid high-voltage low-voltage FinFET device
#30Memory device with dielectric blocking layer for improving interpoly dielectric breakdown
#31Wafer bonding method and structure thereof
#32Method and apparatuses for reducing porogen accumulation from a UV-cure chamber
#33Method for manufacturing silicon wafer
#34High power low pressure UV bulb with plasma resistant coating
#35Universal non-invasive chamber impedance measurement system and associated methods
#36Apparatus and methods to remove unbonded areas within bonded substrates using localized electromagnetic wave annealing
#37Substrate processing apparatus and substrate processing method
#38Generalization of shot definitions for mask and wafer writing tools
#39Modification processing device, modification monitoring device and modification processing method
#40Laser annealing device including tunable mask and method of using the same
#41Ionizer and substrate transfer system having the same, and method of manufacturing a semiconductor device using the same
#42Composition for forming adhesive layer of dicing film, and dicing film
#43Composition for forming adhesive layer of dicing film, and dicing film
#44Warp correction device and warp correction method for semiconductor element substrate
#45Method for reducing porogen accumulation from a UV-cure chamber
#46Method for producing an oxide film using a low temperature process, an oxide film and an electronic device thereof
#47Etching method, etching apparatus, and storage medium
#48Method for manufacturing a semiconductor device and semiconductor device manufactured thereby
#49Super junction MOSFET, method of manufacturing the same, and complex semiconductor device
#50Method of focus measurement, exposure apparatus, and method of manufacturing semiconductor device
#51Method of making a semiconductor chip including identifying marks
#52System and method for forming a semiconductor device
#53Heat treatment apparatus heating substrate by irradiation with light
#54Laser annealing device and method
#55Method and system for manufacturing semiconductor device
#56Lithography masks, systems, and manufacturing methods
#57DIFFRACTION GRATING MANUFACTURING METHOD, SPECTROPHOTOMETER, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#58Heat treatment method and heat treatment apparatus for heating substrate by irradiating substrate with light
#59System and method for rejuvenating an imaging sensor degraded by exposure to extreme ultraviolet or deep ultraviolet light
#60Heat treatment apparatus heating substrate by irradiation with light
#61Heat treatment apparatus for heating substrate by irradiation with flashes of light, and heat treatment method
#62METHOD FOR PRODUCING SILICON WAFER AND SILICON WAFER
#63Generalization of shot definitions for mask and wafer writing tools
#64Method for manufacturing semiconductor device, and semiconductor device
#65Lithography masks, systems, and manufacturing methods
#66Method for depositing a thin film, and resulting material
#67Heat treatment apparatus heating substrate by irradiation with light
#68Lithography masks, systems, and manufacturing methods
#69Semiconductor chip including identifying marks
#70Heat treatment apparatus heating substrate by irradiation with light
#71Semiconductor wafer with low-K dielectric layer and process for fabrication thereof
#72Apparatus for packaging electronic components including a reel entrained with desiccating material
#73Patterned atomic layer etching and deposition using miniature-column charged particle beam arrays
#74Precision substrate material removal using miniature-column charged particle beam arrays
#75Tensile dielectric films using UV curing