207206 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AB compounds with or without impurities, e.g. doping materials; Bombardment with radiation with high-energy radiation for etching, e.g. sputteretching
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#2ETCHING BY ELECTRON ENHANCED PROCESSES WITH POSITIVE SUBSTRATE VOLTAGE
#3SAMPLE PREPARATION FOR CHARGED PARTICLE BEAM IMAGING
#4SITU PROTECTIVE POLYMER VIA MILLING-EXCITATION
#5SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#6DYNAMIC LASER-ASSISTED ETCHING
#7Ion Beam Etching Apparatus And Method
#8ETCHING PLATINUM-CONTAINING THIN FILM USING PROTECTIVE CAP LAYER
#9ARTIFICIAL INTELLIGENCE-ENABLED PREPARATION END-POINTING
#10OPTICAL IMAGE CAPTURING SYSTEM, IMAGE CAPTURING DEVICE AND ELECTRONIC DEVICE
#11Method of forming a semiconductor device
#12Dynamic laser-assisted etching
#13COMBINING FOCUSED ION BEAM MILLING AND SCANNING ELECTRON MICROSCOPE IMAGING
#14Optical image capturing system, image capturing device and electronic device
#15Ion beam etching apparatus and method
#16Method of manufacturing semiconductor structure
#17Method of manufacturing semiconductor device and ion beam irradiation apparatus
#18Method of forming a semiconductor device
#19METHOD AND APPARATUS TO ELIMINATE CONTAMINANT PARTICLES FROM AN ACCELERATED NEUTRAL ATOM BEAM AND THEREBY PROTECT A BEAM TARGET
#20Depositive shielding for fiducial protection from redeposition
#21Artificial intelligence-enabled preparation end-pointing
#22Plasma processing apparatus and plasma processing method
#23Phosphorus fugitive emission control
#24Pattern decomposition lithography techniques
#25Metal line structure and method
#26Etching platinum-containing thin film using protective cap layer
#27Method for extreme ultraviolet lithography mask treatment
#28Controlled hardmask shaping to create tapered slanted fins
#29Method for removing re-sputtered material from patterned sidewalls
#30Apparatus including laser heating for etching thin layer
#31Method of forming a semiconductor device
#32Preserving underlying dielectric layer during MRAM device formation
#33Apparatus with doped surfaces, and related methods with in situ doping
#34Phosphorus fugitive emission control
#35Optical image capturing system, image capturing device and electronic device
#36Method and system for ion beam delayering of a sample and control thereof
#37RF capacitive coupled dual frequency etch reactor
#38Artificial intelligence-enabled preparation end-pointing
#39ETCHING METHOD AND SUBSTRATE PROCESSING APPARATUS
#40Controlled hardmask shaping to create tapered slanted fins
#41ETCHING METHOD AND PLASMA PROCESSING APPARATUS
#42Face-on, gas-assisted etching for plan-view lamellae preparation
#43Low resistant contact method and structure
#44Wafer processing method
#45Method of forming a semiconductor device
#46Pattern decomposition lithography techniques
#47Method for manufacturing a semiconductor device and semiconductor device
#48X-ray topographic apparatus and substrate processing system using the apparatus
#49Etching platinum-containing thin film using protective cap layer
#50Method and apparatus to eliminate contaminant particles from an accelerated neutral atom beam and thereby protect a beam target
#51Metal line structure and method
#52Techniques, system and apparatus for selective deposition of a layer using angled ions
#53Optical image capturing system, image capturing device and electronic device
#54Vacuum plasma workpiece treatment apparatus
#55RF capacitive coupled etch reactor
#56Method for extreme ultraviolet lithography mask treatment
#57Epitaxy-free nanowire cell process for the manufacture of photovoltaics
#58Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process
#59Die singulation and stacked device structures
#60Method of inspecting semiconductor device
#61SUBSTRATE JOINING METHOD
#62Laser processing method, substrate dicing method and substrate processing system for performing the same
#63Method for removal of matter
#64Nanostructured layer for graded index freeform optics
#65Face-on, gas-assisted etching for plan-view lamellae preparation
#66Optical image capturing system, image capturing device and electronic device
#67Etching platinum-containing thin film using protective cap layer
#68Crack prevent and stop for thin glass substrates
#69Sputter etch material selectivity
#70Low resistance contact method and structure
#71Techniques for processing a polycrystalline layer using an angled ion beam
#72Techniques for forming patterned features using directional ions
#73Forming electrode trenches by using a directed ion beam and semiconductor device with trench electrode structures
#74Method of fabricating semiconductor device
#75Material removal process for self-aligned contacts
#76Material removal process for self-aligned contacts
#77Method for manufacturing memory device and method for manufacturing shallow trench isolation
#78Method of forming openings in a material layer
#79Laminate film and electrode substrate film, and method of manufacturing the same
#80MULTIFREQUENCY CAPACITIVELY COUPLED PLASMA ETCH CHAMBER
#81Pattern decomposition lithography techniques
#82Non-uniform gate oxide thickness for DRAM device
#83Material removal process for self-aligned contacts
#84Metal line structure and method
#85Methods of fabricating semiconductor devices including performing an atomic layer etching process
#86Contact structure of gate structure
#87Method and system for ion beam delayering of a sample and control thereof
#88Method and system for ion beam delayering of a sample and control thereof
#89Chip package and manufacturing method thereof
#90CHUCK ASSEMBLY WITH TILTABLE CHUCK AND SEMICONDUCTOR FABRICATION SYSTEM INCLUDING THE SAME
#91Method of forming metal gate to mitigate antenna defect
#92Method of material processing by laser filamentation
#93Workpiece Processing Technique
#94Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLP
#95SLOTTED SUBSTRATE FOR DIE ATTACH INTERCONNECTS
#96Angled ion beam processing of heterogeneous structure
#97Integrated circuit barrierless microfluidic channel
#98Integrated etch/clean for dielectric etch applications
#99WAFER MATERIAL REMOVAL
#100Substrate holding device, lithography apparatus, and article production method
#101Patterning of Nanostructures
#102Metal line structure and method
#103Method of forming contact structure of gate structure
#104COMMAND DATA GENERATION METHOD, POSITIONING APPARATUS, LITHOGRAPHY APPARATUS, AND ARTICLE MANUFACTURING METHOD
#105Method and apparatus for beam deflection in a gas cluster ion beam system
#106Wafer processing method to remove crystal strains
#107Lithography apparatus, and method of manufacturing an article
#108Recess and epitaxial layer to improve transistor performance
#109Semiconductor structure having a metal gate with side wall spacers
#110Solar cell module including transparent conductive film with uniform thickness
#111Etching method to form spacers having multiple film layers
#112Method of forming contact structure of gate structure
#113Pattern formation method, stamper manufacturing method, and magnetic recording medium manufacturing method
#114Integrated circuits having crack-stop structures and methods for fabricating the same
#115Method for integrated circuit fabrication
#116Method for integrated circuit fabrication
#117Method to reduce K value of dielectric layer for advanced FinFET formation
#118Noble gas bombardment to reduce scallops in bosch etching
#119Multi charged particle beam writing apparatus and multi charged particle beam writing method
#120DEVICE FOR DRILLING A SUBSTRATE AND A METHOD FOR DRILLING A SUBSTRATE
#121Manufacturing method for a micromechanical component and a corresponding micromechanical component
#122Method and system for manufacturing semiconductor device
#123Pattern decomposition lithography techniques
#124Method of preventing charge accumulation in manufacture of semiconductor device
#125METHODS AND SYSTEMS FOR USING SUBSURFACE LASER ENGRAVING (SSLE) TO CREATE ONE OR MORE WAFERS FROM A MATERIAL
#126SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#127Method of cutting semiconductor substrate
#128Method of formation of coherent wavy nanostructures (variants)
#129Method of forming through-silicon via using laser ablation
#130LASER ABLATION WITH EXTRACTION OF THE ABLATED MATERIAL
#131Method of material processing by laser filamentation
#132Multi charged particle beam writing apparatus and multi charged particle beam writing method
#133Method of cutting semiconductor substrate
#134Asymmetric FinFET devices
#135Patterning of nanostructures
#136Asymmetric FinFET devices
#137Method of cutting semiconductor substrate via modified region formation and subsequent sheet expansion
#138Method of formation of coherent wavy nanostructures (variants)
#139Multibeam System
#140Semiconductor structure having a metal gate with side wall spacers
#141MULTIFREQUENCY CAPACITIVELY COUPLED PLASMA ETCH CHAMBER
#142Method for enhancing a substrate using gas cluster ion beam processing
#143Methods for modifying features of a workpiece using a gas cluster ion beam
#144Method of formation of coherent wavy nanostructures (variants)
#145Method for fabricating a semiconductor device
#146Method for cutting semiconductor substrate
#147Method of manufacturing a microstructure
#148Wafer structure and packaging method
#149Crack prevent and stop for thin glass substrates
#150Method of manufacturing a semiconductor wafer having an SOI configuration
#151Selective sputtering with light mass ions to sharpen sidewall of subtractively patterned conductive metal layer
#152MOL contact metallization scheme for improved yield and device reliability