207275 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer; Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups -; Conductive parts; Flat leads, e.g. lead frames with or without insulating supports Assembly of a flat lead with an insulating support, e.g. for TAB
PACKAGE MANUFACTURABLE USING THERMOPLASTIC STRUCTURE COVERING A COMPONENT ASSEMBLY SECTION WITHOUT COVERING A LEAD SECTION
#2SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MANUFACTURING THE SAME
#3METAL EDGE FEATURES ON DOUBLE-SIDED PACKAGES
#4ELECTRONIC PACKAGE WITH A BATTERY SECURED BY A BENT LEADFRAME
#5MANUFACTURING METHOD OF HEAT DISSIPATION DEVICE-INTEGRATED HEAT DISSIPATION SUBSTRATE FOR SEMICONDUCTOR
#6Semiconductor Chip Package and Manufacturing Method Thereof
#7SEMICONDUCTOR PACKAGE FILM AND MANUFACTURING METHOD THEREOF
#8METHOD FOR PRODUCING A PACKAGE FOR A SEMICONDUCTOR CHIP, PACKAGE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
#9SEMICONDUCTOR DEVICE WITH LEADFRAME SPACER AND METHOD THEREFOR
#10ISOLATED 3D SEMICONDUCTOR DEVICE PACKAGE WITH TRANSISTORS ATTACHED TO OPPOSING SIDES OF LEADFRAME SHARING LEADS
#11SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBSTRATE AND METHOD
#12METAL-CERAMIC BONDED SUBSTRATE AND MANUFACTURING METHOD THEREOF
#13SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
#14SEMICONDUCTOR DEVICE PACKAGE WITH ISOLATION
#15Semiconductor device package assemblies with direct leadframe attachment
#16MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD
#17Semiconductor Package with Insert
#18POWER MODULE AND MANUFACTURING METHOD THEREOF
#19Extendable inner lead for leaded package
#20ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE
#21POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES
#22MOLDED PACKAGE WITH PRESS-FIT CONDUCTIVE PINS
#23ELECTRONIC DEVICE PACKAGE INCLUDING A GEL
#24SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THEREOF
#25SEMICONDUCTOR DEVICE WITH LEAD-ON-CHIP INTERCONNECT AND METHOD THEREFOR
#26SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
#27INTEGRATED CIRCUIT HAVING A ROUTABLE LEADFRAME
#28POWER MODULE INTEGRATED CIRCUIT PACKAGE
#29POWER MODULE AND METHOD FOR MANUFACTURING SAME
#30SUBSTRATE FOR POWER MODULE AND METHOD OF PRODUCING SUBSTRATE FOR POWER MODULE
#31Leadless semiconductor package with internal gull wing lead structures
#32LEADED SEMICONDUCTOR PACKAGE FORMATION USING LEAD FRAME WITH STRUCTURED CENTRAL PAD
#33SEMICONDUCTOR DEVICE
#34Semiconductor device package with thermal pad
#35Semiconductor device and method for manufacturing the same
#36SEMICONDUCTOR MODULE, METHOD FOR FABRICATING A SEMICONDUCTOR MODULE, AND SYSTEM
#37SEMICONDUCTOR PACKAGES AND METHODS FOR MANUFACTURING THEREOF
#38SEMICONDUCTOR DEVICE QFN PACKAGE AND METHOD OF MAKING THEREOF
#39Semiconductor Packages and Methods for Manufacturing Thereof
#40Semiconductor package having routable encapsulated conductive substrate and method
#41METHOD OF MANUFACTURING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTRATE AND SEMICONDUCTOR DEVICE
#42Semiconductor device packaging extendable lead and method therefor
#43Semiconductor package and packaging process for side-wall plating with a conductive film
#44Flip chip packaged devices with thermal pad
#45METHOD OF MANUFACTURING LEADFRAMES FOR SEMICONDUCTOR DEVICES, CORRESPONDING LEADFRAME AND SEMICONDUCTOR DEVICE
#46Method for Fabricating an Electrical Device Package Comprising Plateable Encapsulating Layers
#47ELECTRONIC PACKAGE WITH CONCAVE LEAD END FACES
#48Method of forming a surface-mount integrated circuit package with solder enhanced leadframe terminals
#49Package assembly for plating with selective molding
#50Semiconductor manufacturing apparatus and method of manufacturing semiconductor device using the same, and semiconductor device
#51SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
#52Semiconductor device and method of manufacturing semiconductor device
#53Method for fabricating semiconductor package and semiconductor package using the same
#54QFN semiconductor package, semiconductor package and lead frame
#55Semiconductor devices and methods of manufacturing semiconductor devices
#56Isolated 3D semiconductor device package with transistors attached to opposing sides of leadframe sharing leads
#57Lead frame, package structure comprising the same and method for manufacturing the package structure
#58Packaging process for plating with selective molding
#59Packaging process for side-wall plating with a conductive film
#60Multi-die-package and method
#61Method of manufacturing circuit board
#62Semiconductor device and corresponding method
#63Integrated circuit package for isolation dies
#64Semiconductor device package assemblies with direct leadframe attachment
#65Exposed heat-generating devices
#66Lead frame and method for manufacturing the same
#67Semiconductor Device
#68Flat lead package formation method
#69Method for glob top encapsulation using molding tape with elevated sidewall
#70Package with selective corrosion protection of electric connection structure
#71Semiconductor device having component mounted on connection bar and lead on top side of lead frame and method of manufacturing semiconductor device thereof
#72Method of manufacturing power amplifier package embedded with input-output circuit
#73Method of manufacturing leadframes for semiconductor devices, corresponding leadframe and semiconductor device
#74Method for fabricating semiconductor package and semiconductor package using the same
#75Busbar assembly
#76Semiconductor package having routable encapsulated conductive substrate and method
#77Preformed lead frame and lead frame package made from the same
#78Multi-purpose non-linear semiconductor package assembly line
#79Hybrid package
#80Glob top encapsulation using molding tape
#81MODULE
#82HYBRID PACKAGE
#83Multi-stacked die package with flexible interconnect
#84Process of surface-mounting three-dimensional package structure electrically connected by prepackaged metal
#85Manufacturing of a power semiconductor module
#86Multi-die integrated circuit packages and methods of manufacturing the same
#87Pre-molded leadframe device
#88Multi-die-package and method
#89Semiconductor device manufacturing method comprising bonding an electrode terminal to a conductive pattern on an insulating substrate using ultrasonic bonding
#90Molded air cavity packages and methods for the production thereof
#91Substrate with multi-layer resin structure and semiconductor device including the substrate
#92Method of assembling QFP type semiconductor device
#93Surface mount semiconductor device and method of manufacture
#94Molded air cavity packages and methods for the production thereof
#95Molded air cavity packages and methods for the production thereof
#96Molded air cavity packages and methods for the production thereof
#97Lead package and method for minimizing deflection in microelectronic packaging
#98Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#99Method and fixture for chip attachment to physical objects
#100Semiconductor package having routable encapsulated conductive substrate and method
#101Chip module with spatially limited thermally conductive mounting body
#102Display device
#103Multi-stacked electronic device with defect-free solder connection
#104ELECTRONIC DEVICE
#105Multi-stacked electronic device with defect-free solder connection
#106Method for fabricating semiconductor package and semiconductor package using the same
#107Multi-purpose non-linear semiconductor package assembly line
#108Molded lead frame device
#109Method of machining a lead frame, and lead frame
#110Method and apparatus for making integrated circuit packages
#111Packing method for semiconductor device
#112Power module package having patterned insulation metal substrate
#113Bumpless wafer level fan-out package
#114Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#115Integrated circuit package having an IC die between top and bottom leadframes
#116SEMICONDUCTOR DEVICE
#117Semiconductor packages and methods of packaging semiconductor devices
#118Cavity package with die attach pad
#119Display device
#120Power module and fabrication method for the same
#121Semiconductor package having routable encapsulated conductive substrate and method
#122Semiconductor device
#123Multi-stacked electronic device with defect-free solder connection
#124Semiconductor device and manufacturing method of the same
#125SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#126METHOD OF MAKING A QFN PACKAGE
#127Multi-stacked electronic device with defect-free solder connection
#128Substrate interposer on a leadframe
#129Thin semiconductor device packages
#130SEMICONDUCTOR ASSEMBLY AND METHOD TO FORM THE SAME
#131Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#132Semiconductor package with multi-section conductive carrier
#133Method of manufacturing semiconductor device
#134Semiconductor package structure having a heat sink frame connected to a lead frame
#135QFN PACKAGE WITH IMPROVED CONTACT PINS
#136FLAT NO-LEADS PACKAGE WITH IMPROVED CONTACT PINS
#137Double-sided chip on film packaging structure and manufacturing method thereof
#138Method for making semiconductor device with lead frame made from top and bottom components and related devices
#139Power semiconductor package with multi-section conductive carrier
#140Housing for an electronic component, an electronic assembly, method of producing a housing for an electronic component and method of producing an electronic assembly
#141Method of manufacturing semiconductor device
#142Electronic package, package carrier, and method of manufacturing package carrier
#143System and method for manufacturing a fabricated carrier
#144Cavity package with pre-molded substrate
#145Electronic device and manufacturing method of electronic device
#146Semiconductor power converter and method of manufacturing the same
#147Method of manufacturing semiconductor device
#148Semiconductor packages and methods of packaging semiconductor devices
#149Semiconductor element for package miniaturization
#150Method of manufacturing semiconductor element
#151Semiconductor device carrier for fine pitch packaging miniaturization and manufacturing method thereof
#152SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCIATED SYSTEMS AND METHODS
#153Manufacturing method of tape carrier for TAB
#154Leadframe Array with Riveted Heat Sinks
#155Semiconductor package for fine pitch miniaturization and manufacturing method thereof
#156Semiconductor chip and TAB package having the same
#157Methods for fabricating stiffeners for flexible substrates
#158Embedded heat spreader
#159Embedded heat spreader
#160Methods for fabricating stiffeners for flexible substrates
#161Semiconductor chip and tab package having the same
#162METHOD OF FABRICATING FILM CARRIER
#163Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same
#164Semiconductor chip package including lead frame and manufacturing method thereof
#165Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the same
#166Method for fabricating semiconductor package and semiconductor package using the same