207296 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer; Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups - , e.g. sealing of a cap to a base of a container; Encapsulations, e.g. encapsulation layers, coatings Batch processing
Electronic package and fabrication method thereof
#3002PACKAGE AND METHOD OF MANUFACTURING PACKAGE THEREOF
#30033D semiconductor package interposer with die cavity
#3004Semiconductor device package and method of manufacturing the same
#3005Method of manufacturing semiconductor device
#3006Packaging module of power converting circuit and method for manufacturing the same
#3007Package module of power conversion circuit and manufacturing method thereof
#3008Integrated circuit package and method of making the same
#3009Method of manufacturing semiconductor device and semiconductor device
#3010Wafer dividing method
#3011Packages with stacked dies and methods of forming the same
#3012Method and apparatus for interconnecting stacked dies using metal posts
#3013Package-on-package structure having polymer-based material for warpage control
#3014Method of manufacturing a semiconductor package having an integrated microwave component
#3015Semiconductor package and manufacturing method thereof
#3016Method for Manufacturing Semiconductor Device, Sheet-Shaped Resin Composition, and Dicing Tape-Integrated Sheet-Shaped Resin Composition
#3017Semiconductor device
#3018Semiconductor package with multi-section conductive carrier
#3019Singulation method for semiconductor package with plating on side of connectors
#3020Method of manufacturing a semiconductor device having scribe lines
#3021Method for moulding and surface processing electronic components and electronic component produced with this method
#3022Underfill process and processing machine thereof
#3023DUAL SIDED EMBEDDED DIE AND FABRICATION OF SAME BACKGROUND
#3024Package structures and method of forming the same
#3025Filling material for three-dimensional mounting of semiconductor element
#3026Method of manufacturing semiconductor device
#3027Semiconductor packages and methods of forming the same
#3028Semiconductor device and manufacturing method thereof
#3029Semiconductor die assemblies with heat sink and associated systems and methods
#3030Chip Scale Package
#3031Semiconductor package structure with preferred heat dissipating efficacy without formation of short circuit
#3032Semiconductor package and method of fabricating the same
#3033Method and nozzle for hermetically sealed packaged devices
#30343D package with through substrate vias
#3035Method of manufacturing fan out wafer level package
#3036Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package
#3037Sheet for sealing and method for manufacturing semiconductor device using said sheet for sealing
#3038Manufacturing method of semiconductor device and semiconductor device
#3039Leadless chip carrier having improved mountability
#3040Manufacturing method of semiconductor device
#3041Adhesive film and method for manufacturing semiconductor device
#3042Method of manufacturing semiconductor device
#3043IC package
#3044Packaged semiconductor device having leadframe features preventing delamination
#3045Method for manufacturing semiconductor structure
#3046Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die
#3047Method of fabricating semiconductor package having semiconductor element
#3048Devices and methods of packaging semiconductor devices
#3049Semiconductor device, semiconductor package, and method for manufacturing semiconductor device
#3050Packaged semiconductor devices and methods of packaging semiconductor devices
#3051Semiconductor packages and related methods
#3052Process for manufacturing a package for a surface-mount semiconductor device and semiconductor device
#3053Chip package and a wafer level package
#3054METHOD AND STRUCTURE FOR FAN-OUT WAFER LEVEL PACKAGING
#3055Leadframe package with pre-applied filler material
#3056Method of manufacturing a semiconductor component and semiconductor component
#3057Making a flat no-lead package with exposed electroplated side lead surfaces
#3058Pre-applying supporting materials between bonded package components
#3059Interconnect structures for wafer level package and methods of forming same
#3060EMI/RFI shielding for semiconductor device packages
#3061Package structure and fabrication method thereof
#3062Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
#3063Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form
#3064Method of packaging integrated circuits
#3065Radio frequency isolation structure with racetrack
#3066Semiconductor device
#3067Racetrack layout for radio frequency shielding
#3068Method of multi-chip wafer level packaging
#3069Method for fabricating a semiconductor package with conductive carrier integrated heat spreader
#3070Semiconductor packages having through electrodes and methods of fabricating the same
#30713D integration of fanout wafer level packages
#3072Integrated circuit packages and methods of forming same
#3073Device package with reduced thickness and method for forming same
#3074Semiconductor device and manufacturing method thereof
#3075Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield
#3076Semicondutor device and method of manufacture
#3077Package substrate dividing method
#3078Image processing-based lithography system and method of coating target object
#3079Semiconductor chip stack with identification section on chip side-surfaces for stacking alignment
#3080METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS
#3081Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP)
#3082FIRST-PACKAGED AND LATER-ETCHED NORMAL CHIP THREE DIMENSION SYSTEM-IN-PACKAGE METAL CIRCUIT BOARD STRUCTURE AND PROCESSING METHOD THEREOF
#3083Circuit module and manufacturing method thereof
#3084ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
#3085Forming a panel of triple stack semiconductor packages
#3086Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication
#3087Wafer-level stack chip package and method of manufacturing the same
#3088Electronic package and fabrication method thereof
#3089Semiconductor device and manufacturing method for the same
#3090Chip using triple pad configuration and packaging method thereof
#3091Electromagnetic wave shielding support base-attached encapsulant, encapsulated substrate having semicondutor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, and semiconductor apparatus
#3092Semiconductor package and fabrication method thereof
#3093Method for manufacturing semiconductor device, and semiconductor device
#3094Chip package having a dual through hole redistribution layer structure
#3095Heat spreader with wiring substrate for reduced thickness
#3096Packaged semiconductor devices and methods of packaging semiconductor devices
#3097Method of manufacturing a semiconductor device
#3098Fan-out wafer level chip package structure and manufacturing method thereof
#3099SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED ANTENNA FOR WIRELESS APPLICATIONS
#3100Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module
#3101Flip-chip on leadframe semiconductor packaging structure and fabrication method thereof
#3102Lead frame strip with molding compound channels
#3103Package with multiple I/O side-solderable terminals
#3104Silicone resin, resin composition, resin film, semiconductor device, and making method
#3105Package frame and method of manufacturing semiconductor package using the same
#3106Mechanisms for forming package structure
#3107Die attachment for packaged semiconductor device
#3108Semiconductor device and method of fabricating 3D package with short cycle time and high yield
#3109Semiconductor device and method of fabricating 3D package with short cycle time and high yield
#3110Method of fabricating semiconductor device
#3111Interconnect structure for wafer level package
#3112Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
#3113Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof
#3114Package on package structure and method for forming the same
#3115Electronic device with first and second contact pads and related methods
#3116Packaged semiconductor devices
#3117Packaged semiconductor devices and packaging methods thereof
#3118Bonding process for a chip bonding to a thin film substrate
#3119Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die
#3120Electronic device and method for manufacturing same
#3121Semiconductor package and method of manufacturing the same
#3122Through package circuit in fan-out wafer level package
#3123Wafer level packaging of electronic device
#3124Semiconductor device having markings and package on package including the same
#3125Electronic devices with semiconductor die coupled to a thermally conductive substrate
#3126Semiconductor device and method comprising redistribution layers
#3127Semiconductor package having metal layer
#3128Substrate for alternative semiconductor die configurations
#3129Inclined photonic chip package for integrated optical transceivers and optical touchscreen assemblies
#3130Method of forming an interference shield on a substrate
#3131Stackable molded microelectronic packages with area array unit connectors
#3132Three dimensional integrated circuits stacking approach
#3133Semiconductor devices and methods of manufacture thereof
#3134Method for manufacturing semiconductor device and semiconductor device
#3135Systems and methods for controlling release of transferable semiconductor structures
#3136Method for manufacturing a resin-encapsulated semiconductor device
#3137Semiconductor device and method of adaptive patterning for panelized packaging
#3138Semiconductor device and manufacturing method of semiconductor device
#3139Batch process fabrication of package-on-package microelectronic assemblies
#3140Semiconductor device and method for making the device
#3141Manufacturing method for semiconductor device
#3142Wafer process for molded chip scale package (MCSP) with thick backside metallization
#3143SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, AND MOUNTING METHOD OF SEMICONDUCTOR DEVICE
#3144Graphene based filler material of superior thermal conductivity for chip attachment in microstructure devices
#3145Semiconductor packages and other circuit modules with porous and non-porous stabilizing layers
#3146Fan-out wafer level packages having preformed embedded ground plane connections and methods for the fabrication thereof
#3147Packages and methods of forming packages
#3148Three-dimensional chip-to-wafer integration
#3149Method of producing a semiconductor device and a semiconductor device
#3150Substrateless integrated circuit packages and methods of forming same
#3151Semiconductor package having conductive pillars
#3152Semiconductor device and manufacturing method thereof
#3153Electronic module and fabrication method thereof
#3154Integrating multi-output power converters having vertically stacked semiconductor chips
#3155Semiconductor device including semiconductor chips stacked over substrate
#3156Integrating multi-output devices having vertically stacked semiconductor chips
#3157Intramodule radio frequency isolation
#3158Front side package-level serialization for packages comprising unique identifiers
#3159Integrating multi-output power converters having vertically stacked semiconductor chips
#3160Method and structure for wafer level packaging with large contact area
#3161Temporary bonding scheme
#3162Method of manufacturing a package-on-package type semiconductor package
#3163Interconnect structures for wafer level package and methods of forming same
#3164Manufacturing method of semiconductor device and semiconductor device thereof
#3165Semiconductor device
#3166Method for fabricating package structure
#3167Radio frequency module including segmented conductive ground plane
#3168Semiconductor border protection sealant
#3169Wafer level overmold for three dimensional surfaces
#3170Radio frequency module including segmented conductive top layer
#3171Semiconductor modules and semiconductor packages
#3172Via density in radio frequency shielding applications
#3173Semiconductor package for a lateral device and related methods
#3174Semiconductor device and method of forming double-sided fan-out wafer level package
#3175Semiconductor device
#3176FIBER-CONTAINING RESIN SUBSTRATE, DEVICE-MOUNTING SUBSTRATE AND DEVICE-FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS
#3177Method of processing a substrate and a method of processing a wafer
#3178Reinforcing sheet and method for producing secondary mounted semiconductor device
#3179Power semiconductor package having vertically stacked driver IC
#3180Miniaturized SMD diode package and process for producing the same
#3181Method for forming package structure
#3182Method of manufacturing electronic device
#3183Semiconductor package with conformal EM shielding structure and manufacturing method of same
#3184Package and method of manufacturing the same
#3185Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices
#3186Semiconductor package system and method
#3187Support member, wiring substrate, method for manufacturing wiring substrate, and method for manufacturing semiconductor package
#3188Semiconductor package having etched foil capacitor integrated into leadframe
#3189Leadless semiconductor package and method
#3190Support base-attached encapsulant, encapsulated substrate having semiconductor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus
#3191Semiconductor device
#3192Fan-out PoP stacking process
#3193Solder layer of a semiconductor chip arranged within recesses
#3194Semiconductor device
#3195Semiconductor device having single layer substrate and method
#3196Semiconductor packages having EMI shielding layers, methods of fabricating the same, electronic systems including the same, and memory cards including the same
#3197Package structure and method for fabricating the same
#3198Semiconductor die connection system and method
#3199Wafer level flat no-lead semiconductor packages and methods of manufacture
#3200SMD, IPD, and/or wire mount in a package
#3201Semiconductor package structure and method for manufacturing the same
#3202Semiconductor package and method of manufacturing the same
#3203Method for reducing cross contamination in integrated circuit manufacturing
#3204Package-on-package structure and methods for forming the same
#3205Semiconductor package and method of fabricating the same
#3206RDL-first packaging process
#3207Semiconductor devices comprising protected side surfaces and related methods
#3208Methods of packaging semiconductor devices and packaged semiconductor devices
#3209Integrated fan-out package structures with recesses in molding compound
#3210Electronic device
#3211Semiconductor device and method of forming wafer-level interconnect structures with advanced dielectric characteristics
#3212Device with pillar-shaped components
#3213Method of manufacturing semiconductor device with a metal layer along a step portion
#3214Semiconductor device packages, packaging methods, and packaged semiconductor devices
#3215Mould, carrier with encapsulated electronic components, separated encapsulated electronic component and method for encapsulating electronic components
#3216THREE DIMENSIONAL PACKAGE ASSEMBLIES AND METHODS FOR THE PRODUCTION THEREOF
#3217Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion
#3218Removal of selected portions of protective coatings from substrates
#3219Semiconductor device
#3220Semiconductor device with face-to-face chips on interposer and method of manufacturing the same
#3221STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LEAD QFN LEADFRAMES
#3222Semiconductor device and method for making semiconductor device
#3223Structure and Method of Batch-Packaging Low Pin Count Embedded Semiconductor Chips
#3224Processing techniques for silicon-based transient devices
#3225Semiconductor device and method for manufacturing same
#3226Matrix lid heatspreader for flip chip package
#3227EXPOSED DIE QUAD FLAT NO-LEADS (QFN) PACKAGE
#3228Method of fabricating semiconductor package, semiconductor chip supporting carrier and chip mounting device
#3229Packaging structural member
#3230Wafer level packaging method
#3231Substrate and method for manufacturing semiconductor package
#3232Flip-chip assembly process comprising pre-coating interconnect elements
#3233Microelectronic packages having embedded sidewall substrates and methods for the producing thereof
#3234Semiconductor package
#3235Semiconductor packages and methods of packaging semiconductor devices
#3236Methods of packaging semiconductor devices and packaged semiconductor devices
#3237Advanced structure for info wafer warpage reduction
#3238Interposer test structures and methods
#3239METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
#3240Method of manufacturing semiconductor package including forming a recessed region in a substrate
#3241Materials for masking substrates and associated methods
#3242High density film for IC package
#3243Semiconductor package
#3244Semiconductor die encapsulation or carrier-mounting method, and corresponding semiconductor die encapsulation or carrier-mounting apparatus
#3245Systems and methods for controlling release of transferable semiconductor structures
#3246Wafer-level molding chase design
#3247PACKAGE STRUCTURE
#3248Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping
#3249Method of manufacturing semiconductor package
#3250Direct die solder of gallium arsenide integrated circuit dies and methods of manufacturing gallium arsenide wafers
#3251Method for building up a fan-out RDL structure with fine pitch line-width and line-spacing
#3252Quad flat no lead package and method of making
#3253Integrated circuit packages and methods of forming same
#3254Extremely thin package
#3255Package-on-package semiconductor device
#3256Methods of packaging semiconductor devices and packaged semiconductor devices
#3257Package structure and methods of forming the same
#3258Methods, circuits and systems for a package structure having wireless lateral connections
#3259MEMORY CARD AND METHOD FOR MANUFACTURING THE SAME
#3260Packaged semiconductor devices and packaging devices and methods
#3261Power semiconductor device with small contact footprint and the preparation method
#3262Semiconductor device assembled using two lead frames
#3263Semiconductor packages and methods of packaging semiconductor devices
#32643D packages and methods for forming the same
#3265Method for manufacturing semiconductor device
#3266Semiconductor device
#3267Structure and method for integrated circuits packaging with increased density
#3268Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits
#3269Package in package (PiP) electronic device and manufacturing method thereof
#3270Semiconductor structure and manufacturing method thereof
#3271Alignment mark design for packages
#3272Interposer fabricating process and wafer packaging structure
#3273Power semiconductor package with multi-section conductive carrier
#3274Semiconductor package having heat dissipating member
#3275Molded chip package and method of manufacturing the same
#3276Fabrication method of package having ESD and EMI preventing functions
#3277Semiconductor device including filling material provided in space defined by three semiconductor chips
#3278Method for manufacturing semiconductor device
#3279Semiconductor chip covered with sealing resin having a filler material
#3280Underfill composition and semiconductor device and manufacturing method thereof
#3281Electronic device package including metal blocks
#3282Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#3283Devices and methods for processing singulated radio-frequency units
#3284Semiconductor device
#3285Electronic device module and manufacturing method thereof
#3286Substrate block for PoP package
#3287Semiconductor package and fabrication method thereof and carrier structure
#3288Semiconductor device and a manufacturing method thereof
#3289Ultra-thin semiconductor device and preparation method thereof
#3290Semiconductor package with coated side walls and method of manufacture
#3291Flexible microelectronic systems and methods of fabricating the same
#3292Method of Packaging Semiconductor Devices and Apparatus for Performing the Same
#3293Method of forming wafer-level molded structure for package assembly
#3294Method of fabricating semiconductor package, semiconductor package formed thereby, and semiconductor device including the same
#3295Wafer level package without sidewall cracking
#3296Methods of fabrication and testing of three-dimensional stacked integrated circuit system-in-package
#3297Wafer, package structure and method of manufacturing the same
#3298Semiconductor device including semiconductor construct installed on base plate, and manufacturing method of the same
#3299Method of Packaging Semiconductor Devices and Apparatus for Performing the Same
#3300Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member