SINGULATED UNIT SUBSTRATE FOR A SEMICONDCUTOR DEVICE

Semiconductor apparatus including a heat dissipating member

Method of fabricating a semiconductor package

Method of fabricating a packaging substrate including a carrier having two carrying portions

Connection using conductive vias

Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Optoelectronic component with integrated protection diode and method of producing same

Semiconductor device and method for manufacturing semiconductor device

Water soluble mask formation by dry film lamination

Method for making a sensor device using a graphene layer

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

LAMINATING SYSTEM, IC SHEET, SCROLL OF IC SHEET, AND METHOD FOR MANUFACTURING IC CHIP

Method of packaging stacked dies on wafer using flip-chip bonding

Semiconductor devices having hybrid stacking structures and methods of fabricating the same

Semiconductor device including semiconductor chips mounted over both surfaces of substrate

PREVENTION OF WARPING DURING HANDLING OF CHIP-ON-WAFER

Method and materials for warpage thermal and interconnect solutions

Semiconductor device with thick bottom metal and preparation method thereof

Semiconductor packages and methods of forming the same

Semiconductor device and method of manufacturing the same

Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers

Semiconductor packages and methods of forming the same

Pressure sensor device with through silicon via

Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure

Integrated circuit assemblies with reinforcement frames, and methods of manufacture

Methods for high precision microelectronic die integration

Lead built-in type circuit package and method for producing same

Packages with through-vias having tapered ends

Isolation rings for packages and the method of forming the same

Method for manufacturing semiconductor device and semiconductor device

Methods for controlling warpage in packaging

Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

Interconnect structure for package-on-package devices and a method of fabricating

SEMICONDUCTOR DEVICE WITH REDUCED WARPAGE

Enhanced board level reliability for wafer level packages

Ultra-thin semiconductor device and preparation method thereof

Semiconductor device

Chip package having extended depression for electrical connection and method of manufacturing the same

Methods and structure for carrier-less thin wafer handling

Method for producing a multiplicity of optoelectronic semiconductor components

Method of fabricating semiconductor package

Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof

Embedded die ball grid array package

Methods for improving thermal performance of flip chip packages

Electronic devices with improved thermal performance

Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP)

Wafer level chip scale package and method of manufacturing the same

Method for manufacturing semiconductor device

Semiconductor device having wires connecting connection pads

Semiconductor device and manufacturing method thereof

Package apparatus and manufacturing method thereof

Substrate design for semiconductor packages and method of forming same

Method for manufacturing semiconductor structure

Wafer-level packaged optical subassembly and transceiver module having same

Packaged semiconductor devices and methods of packaging semiconductor devices

Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation

Chip support substrate, chip support method, three-dimensional integrated circuit, assembly device, and fabrication method of three-dimensional integrated circuit

Electronic component package and method for manufacturing same

Semiconductor modules with semiconductor dies bonded to a metal foil

Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die

Integrated circuit package fabrication

Micro-assembly with planarized embedded microelectronic dies

Methods for packaging integrated circuits

Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof

Device and method of manufacturing the same

Selective planishing method for making a semiconductor device

Multi-dimensional integrated circuit structures and methods of forming the same

Method of manufacturing semiconductor device

Stacked semiconductor system having interposer of half-etched and molded sheet metal

Packages with stacked dies and methods of forming the same

Methods and structures for packaging semiconductor dies

Electronic component package and method for manufacturing the same

System and method for bonding package lid

Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing

Structure and approach to prevent thin wafer crack

Methods of packaging and dicing semiconductor devices and structures thereof

Integrated circuit package and methods of forming same

Method Of Manufacturing Semiconductor Device And The Semiconductor Device

Chip package and method of manufacturing the same

Fine pitch BVA using reconstituted wafer with area array accessible for testing

Semiconductor device and manufacturing method thereof

Semiconductor package, semiconductor device and method of forming the same

Semiconductor device and manufacturing method thereof

Miniaturized SMD diode package and process for producing the same

Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices

Method for forming crack stop structure

Chip arrangement and method of manufacturing the same

Method for manufacturing semiconductor device, and semiconductor device

Structure and method for 3D IC package

Producing method of encapsulating layer-covered semiconductor element and producing method of semiconductor device

Package on package bonding structure and method for forming the same

Semiconductor device and method comprising thickened redistribution layers

Two step molding grinding for packaging applications

Semiconductor device and a manufacturing method thereof

Method of packaging a semiconductor device

Inclined photonic chip package for integrated optical transceivers and optical touchscreen assemblies

Electrical contact structure with a redistribution layer connected to a stud

Semiconductor device and method of forming fine pitch RDL over semiconductor die in fan-out package

Forming functionalized carrier structures with coreless packages

Semiconductor device and method of wafer thinning involving edge trimming and CMP

Semiconductor device and method of making embedded wafer level chip scale packages

PACKAGED IC DEVICES AND ASSOCIATED IC DEVICE PACKAGING METHODS

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Formation of connectors without UBM

Semiconductor package with integrated microwave component

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor device and method of reducing warpage using a silicon to encapsulant ratio

Conductive shield for semiconductor package

Method of manufacturing semiconductor device and semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Method of manufacturing a semiconductor device

Semiconductor devices and methods for manufacturing semiconductor devices

Molding structure for wafer level package

Packaged semiconductor devices and methods of packaging semiconductor devices

Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication

ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING

Protective layer for contact pads in fan-out interconnect structure and method of forming same

Electronic package, package carrier, and method of manufacturing package carrier

Method and structure for wafer level packaging with large contact area

Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production

Stacked die sensor package

Etched trenches in bond materials for die singulation, and associated systems and methods

Temporary bonding scheme

Method for fabricating EMI shielding package structure

Leadless semiconductor package with optical inspection feature

Electronic device with first and second contact pads and related methods

Method for manufacturing semiconductor package

Resin-encapsulated semiconductor device and method of manufacturing the same

Packages with molding material forming steps

Semiconductor device packaging

IC embedded substrate and method of manufacturing the same

Mechanisms for forming package structure

Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die

Thermally enhanced package with lid heat spreader

Leadless surface mount assembly package and method of manufacturing the same

Semiconductor chip with electrically conducting layer

Thin substrate and mold compound handling using an electrostatic-chucking carrier

Optically-masked microelectronic packages and methods for the fabrication thereof

Semiconductor device assembly with package interconnect extending into overlying spacer material, and associated systems, devices, and methods

Stacked microelectronic devices

Semiconductor assembly and method of manufacturing the same

Method of forming a microelectronic device package

Fabrication method of semiconductor package

Methods of fabricating semiconductor die assemblies

Configurable routing for packaging applications

Semiconductor package and manufacturing method thereof

Semiconductor device and method of manufacturing semiconductor device

Method of electrically isolating shared leads of a lead frame strip

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Via placement in radio frequency shielding applications

Method for singulating packaged integrated circuits and resulting structures

Semiconductor package including a plurality of chips

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

Method for singulating packaged integrated circuits and resulting structures

Semiconductor device with face-to-face chips on interposer and method of manufacturing the same

Method for manufacturing semiconductor device

Semiconductor die laminating device with independent drives

Chip on package structure and method

Semiconductor device and method for manufacturing a semiconductor device

Die up fully molded fan-out wafer level packaging

Method for processing wafer

SENSOR DIE GRID ARRAY PACKAGE

High voltage semiconductor power switching device

Manufacturing method of forming an etch-back type semiconductor package with locking anchorages

Active chip package substrate and method for preparing the same

Thinning in package using separation structure as stop

3-D package having plurality of substrates

Semiconductor device and manufacturing method thereof

Semiconductor device including two or more chips mounted over wiring substrate

Submount, encapsulated semiconductor element, and methods of manufacturing the same

Apparatus and method for self-aligning chip placement and leveling

Method of manufacturing a semiconductor package including a surface profile modifier

Integrated fan-out structure with openings in buffer layer

Semiconductor device, semiconductor device mounting structure and power semiconductor device

Chip-stacked semiconductor package and method of manufacturing the same

Packaged semiconductor device having multilevel leadframes configured as modules

Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

3D device packaging using through-substrate posts

Die assembly on thin dielectric sheet

Metal redistribution layer for molded substrates

Semiconductor device

3D device packaging using through-substrate posts

Semiconductor device and method of making an embedded wafer level ball grid array (EWLB) package on package (POP) device with a slotted metal carrier interposer

Semiconductor device and method of controlling warpage in reconstituted wafer

Multi-chip package and method of formation

Multi-chip package structure and method of forming same

Integrated fan-out package structures with recesses in molding compound

Semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device

Current sensor device

Electronic component package and method of manufacturing same

Sealed semiconductor light emitting device

Circuit module and method of producing the same

Circuit module and method of producing circuit module

CHIP PACKAGE, CHIP PACKAGE MODULE BASED ON THE CHIP PACKAGE, AND METHOD OF MANUFACTURING THE CHIP PACKAGE

Integrated fan-out structure with guiding trenches in buffer layer

Reliable surface mount integrated power module

Apparatus and method for a component package

Radiation hardened microelectronic chip packaging technology

Lead frame strips with electrical isolation of die paddles

Method for fabricating a plurality of semiconductor devices

High yield semiconductor device

Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement

Semiconductor devices and methods of manufacture thereof

Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation

Stack packages including diffusion barriers over sidewalls of through via electrodes and methods of manufacturing the same

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement

Wafer level dicing method

Encapsulated semiconductor device

Substrateless power device packages

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED SUBSTRATE

Electronic device package structure and method of fabricating the same

Packages with interposers and methods for forming the same

Semiconductor package and method of manufacturing the same

Method for manufacturing a fan-out WLP with package

Method of fabricating low CTE interposer without TSV structure

Semiconductor device, and method of manufacturing semiconductor device

METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, AND A CHIP ARRANGEMENT

Semiconductor device and method of making wafer level chip scale package

Semiconductor package and fabrication method thereof

Electronic device

Manufacturing method of molded article

Semiconductor device and method of manufacturing the same

Semiconductor package with grounding and shielding layers

Method and apparatus for stacked semiconductor chips

Encapsulant with base for use in semiconductor encapsulation, semiconductor apparatus, and method for manufacturing semiconductor apparatus

Technique for wafer-level processing of QFN packages

Chip to package interface

Semiconductor chip bonding apparatus and method of forming semiconductor device using the same

Packaging structure of a semiconductor device

Semiconductor device with plated pillars and leads

Method of forming a semiconductor package

Coreless package structure and method for manufacturing same

Die-on-interposer assembly with dam structure and method of manufacturing the same

Microelectronic packages having frontside thermal contacts and methods for the fabrication thereof

Semiconductor device and method of assembling same

Semiconductor device with pre-molding chip bonding

Method and structure of packaging semiconductor devices

Stacked package and method for manufacturing the same

Method of Manufacturing a Semiconductor Device

Methods of forming conductive jumper traces

Method of forming molded panel embedded die structure

Wire tail connector for a semiconductor device

Semiconductor device and method of forming trench and disposing semiconductor die over substrate to control outward flow of underfill material

Semiconductor device and method of stacking semiconductor die on a fan-out WLCSP

Semiconductor device

Wafer level chip scale package with exposed thick bottom metal

Semiconductor packages having through electrodes and methods of fabricating the same

Power semiconductor package with non-contiguous, multi-section conductive carrier

Leadless semiconductor package and method of manufacture

Semiconductor packages having through electrodes and methods for fabricating the same

Method of manufacturing semiconductor device including grinding semiconductor wafer

SEMICONDUCTOR DEVICE WITH HEAT SPREADER AND THERMAL SHEET

Warp compensated electronic assemblies

Semiconductor package structure and semiconductor process

Bumpless build-up layer package warpage reduction

Semiconductor device with overlapped lead terminals

Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures

Semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device package with cap element

Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant

3D packages and methods for forming the same

Semiconductor die assemblies and semiconductor devices including same

Semiconductor device and method of manufacturing the same

Wafer-level packaging of integrated devices, and manufacturing method thereof

Wiring board unit, manufacturing method thereof, and manufacturing method of wiring board with lead

Semiconductor package including a substrate with a stepped sidewall structure

Semiconductor device, electronic apparatus, and method of manufacturing semiconductor device

Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages

Fabrication method of semiconductor package

PACKAGE STACKS AND METHODS OF MANUFACTURING THE SAME

Connection using conductive vias

Semiconductor device comprising mold for top side and sidewall protection

Interconnect structure for wafer level package

Semiconductor device and method of forming insulating layer around semiconductor die

Methods of fabricating semiconductor stack packages

Method and apparatus for semiconductor device fabrication using a reconstituted wafer

Semiconductor device and method of forming adhesive material to secure semiconductor die to carrier in WLCSP

Chip package and method for forming the same

Chip package

Barrel-plating quad flat no-lead (QFN) packaging structures and method for manufacturing the same

System, method and apparatus for leadless surface mounted semiconductor package

Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips

Chip package and method for forming the same

Packaging process tools and packaging methods for semiconductor devices

Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus

Chip package and method for forming the same

Semiconductor package structure and fabrication method thereof

Method for manufacturing chip package structure

Package for three dimensional integrated circuit

Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulant

Stackable package by using internal stacking modules

Packaged semiconductor devices and packaging devices and methods

Quad flat no-lead (QFN) packaging structure and method for manufacturing the same