207296 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer; Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups - , e.g. sealing of a cap to a base of a container; Encapsulations, e.g. encapsulation layers, coatings Batch processing
SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND CONNECTING THROUGH-HOLE AND METHOD OF THE SAME
#5102Integrated package circuit with stiffener
#5103Semiconductor device package with multi-chips and method of the same
#5104SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#5105Encapsulated chip scale package having flip-chip on lead frame structure
#5106Method of manufacturing semiconductor devices encapsulated in chip size packages
#5107Method for mounting electronic components
#5108Block-molded semiconductor device singulation methods and systems
#5109Semiconductor device and method of manufacturing the same
#5110Multi-chip package system with multiple substrates
#5111METHOD FOR FORMING A MICROELECTRONIC ASSEMBLY INCLUDING ENCAPSULATING A DIE USING A SACRIFICIAL LAYER
#5112Wafer level CSP packaging concept
#5113SUBSTRATE AND SEMICONDUCTOR DEVICE USING THE SAME
#5114SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
#5115Semiconductor device manufacturing method, semiconductor device, and wiring board
#5116Stack type semiconductor chip package having different type of chips and fabrication method thereof
#5117Semiconductor device and method of fabricating the same
#5118MOSFET package
#5119Semiconductor package, manufacturing method thereof and IC chip
#5120Method of packaging semiconductor devices
#5121Method for fabricating semiconductor package
#5122Assembly of thin die coreless package
#5123Mold structure for packaging LED chips and method thereof
#5124Component Moulding Process
#5125Dual molded multi-chip package system
#5126Method of making a multi-layered semiconductor device
#5127Lead frame and method of manufacturing the same, and semiconductor device
#5128Method for integrating pre-fabricated chip structures into functional electronic systems
#5129Semiconductor Package Block Mold and Method
#5130FLIP CHIP IN PACKAGE USING FLEXIBLE AND REMOVABLE LEADFRAME
#5131Semiconductor device and electronic device
#5132Semiconductor package, manufacturing method thereof and IC chip
#5133Manufacturing method for micro-SD flash memory card
#5134Circuit device with at least partial packaging and method for forming
#5135Die positioning for packaged integrated circuits
#5136Chip scale package structure with metal pads exposed from an encapsulant
#5137Semiconductor device with hollow structure
#5138Amplifier chip mounted on a lead frame
#5139Method for Preparing an Intergrated Circuits Device Having a Reinforcement Structure
#5140Semiconductor device including microstrip line and coplanar line
#5141Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#5142MULTI-COMPONENT ELECTRONIC PACKAGE WITH PLANARIZED EMBEDDED-COMPONENTS SUBSTRATE
#5143Mold array process for chip encapsulation and substrate strip utilized
#5144METHOD OF PACKAGING A DEVICE HAVING A KEYPAD SWITCH POINT
#5145Semiconductor package and fabrication method thereof
#5146Packaged semiconductor chips
#5147Method for fabricating semiconductor package free of substrate
#5148STACKABLE MOLDED PACKAGES AND METHODS OF MAKING THE SAME
#5149Structure of image sensor module and method for manufacturing of wafer level package
#5150Fan out type wafer level package structure and method of the same
#5151Integrated Circuit Package and Method for Manufacturing an Integrated Circuit Package
#5152Non-pull back pad package with an additional solder standoff
#5153Array quad flat no-lead package and method of forming same
#5154Sawn power package and method of fabricating same
#5155Semiconductor package and fabrication process thereof
#5156Processes and packaging for high voltage integrated circuits, electronic devices, and circuits
#5157Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same
#5158Manufacturing method of a semiconductor device having a package dicing
#5159Manufacturing method of semiconductor device
#5160Semiconductor device and manufacturing method thereof
#5161Semiconductor device having sealing film and manufacturing method thereof
#5162ELECTRONIC DEVICE AND PRODUCTION METHOD
#5163Semiconductor apparatus and method of producing the same
#5164Semiconductor device and method for fabricating the same
#5165Semiconductor package and fabrication method thereof
#5166Semiconductor device package and manufacturing method
#5167Map type semiconductor package
#5168Flip-Chip Ball Grid Array Strip and Package
#5169Structure of wafer level package with area bump
#5170Chip package and method for fabricating the same
#5171Stackable packages for three-dimensional packaging of semiconductor dice
#5172Semiconductor die package using leadframe and clip and method of manufacturing
#5173Semiconductor device package and manufacturing method
#5174Physical quantity sensor, lead frame, and manufacturing method therefor
#5175Apparatus for manufacturing semiconductor device
#5176Method for producing a component and device having a component
#5177Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device
#5178Method of fabricating microelectronic devices
#5179Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same
#5180Integrated circuit package system with molding vents
#5181Integrated circuit package system employing wafer level chip scale packaging
#5182Stress-free lead frame
#5183Method Of Transferring At Least One Object Of Micrometric Or Millimetric Size By Means Of A Polymer Handle
#5184Electronic component of VQFN design and method for producing the same
#5185Chip package structure and manufacturing method thereof
#5186Semiconductor device and manufacturing method for the same
#5187Packaging structure with protective layers and packaging method thereof
#5188Method for producing chip packages, and chip package produced in this way
#5189Semiconductor package and method of fabricating the same and semiconductor module and method of fabricating the same
#5190Quad flat no-lead (QFN) chip package assembly apparatus and method
#5191Semiconductor constructions and assemblies, and electronic systems
#5192Singulation Process for Block-Molded Packages
#5193Die configurations and methods of manufacture
#5194Fabrication method of semiconductor integrated circuit device
#5195Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device
#5196Method of forming semiconductor packaged device
#5197METHOD OF FORMING A TRACE EMBEDDED PACKAGE
#5198Semiconductor device encapsulated with resin composition
#5199Semiconductor package and method for fabricating the same
#5200Semiconductor package substrate and semiconductor package having the same
#5201Producing thin integrated semiconductor devices
#5202Interconnect structure and formation for package stacking of molded plastic area array package
#5203Semiconductor component with connecting elements and method for producing the same
#5204Semiconductor package, chip carrier structure thereof, and method for fabricating the chip carrier
#5205Semiconductor device having low dielectric insulating film and manufacturing method of the same
#5206Semiconductor device and method of manufacturing the same
#5207No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement
#5208Manufacturing method of resin-molding type semiconductor device, and wiring board therefor
#5209Method of fabricating microelectronic devices
#5210METHOD FOR MANUFACTURING WAFER-LEVEL PACKAGES FOR FLIP CHIPS CAPABLE OF PREVENTING ADHESIVES FROM ABSORBING WATER
#5211Package structure to reduce warpage
#5212Substrate structure for semiconductor package and package method thereof
#5213Method for fabricating semiconductor package free of substrate
#5214Leadframe enhancement and method of producing a multi-row semiconductor package
#5215Semiconductor package, array arranged substrate structure for the semiconductor package and fabrication method of the semiconductor package
#5216Semiconductor device having adhesion increasing film to prevent peeling
#5217Semiconductor device manufacturing method
#5218Method for fabricating chip package structure
#5219Separation method for cutting semiconductor package assemblage for separation into semiconductor packages
#5220Manufacturing method of a package structure
#5221Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same
#5222Method for producing semiconductor package
#5223Method for producing semiconductor components
#5224Multichip package system
#5225Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same
#5226Semiconductor package containing multi-layered semiconductor chips
#5227Method for manufacturing semiconductor device
#5228Warp compensated package and method
#5229Composite board with semiconductor chips and plastic housing composition and method
#5230Semiconductor packaging method
#5231Method for manufacturing semiconductor device
#5232Semiconductor device and method of manufacturing semiconductor device
#5233Stackable integrated circuit package system with multiple interconnect interface
#5234Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages
#5235No lead package with heat spreader
#5236Flip chip in package using flexible and removable leadframe
#5237SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#5238Semiconductor device and method for manufacturing the semiconductor device
#5239Integrated circuit package system with exposed interconnects
#5240Method for producing a surface-mountable semiconductor component
#5241Method for fabricating semiconductor package
#5242SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS
#5243Plurality of devices attached by solder bumps
#5244Semiconductor device package and methods for producing same
#5245Stacked semiconductor structure and fabrication method thereof
#5246Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#5247Interconnect substrate, semiconductor device, and method of manufacturing the same
#5248Method for manufacturing a surface mount device
#5249Aluminum leadframes for semiconductor QFN/SON devices
#5250Mold flash removal process for electronic devices
#5251Circuit board and package structure thereof
#5252Semiconductor wafer scale package system
#5253Semiconductor package structure and fabrication method thereof
#5254Strip for integrated circuit packages having a maximized usable area
#5255Method for fabricating a flip chip system in package
#5256Integrated circuit package system including stacked die
#5257Circuit module
#5258Semiconductor device and a method of manufacturing the same
#5259Integrated circuit package system including honeycomb molding
#5260Methods for packaging and encapsulating semiconductor device assemblies that include tape substrates
#5261Semiconductor device
#5262Method for Manufacturing Chip Package Structures
#5263Wafer-level processing of chip-packaging compositions including bis-maleimides
#5264Package method for flash memory card and structure thereof
#5265Method for fabricating a chip scale package using wafer level processing
#5266Electronic package with integral electromagnetic radiation shield and methods related thereto
#5267Stackable molded packages and methods of making the same
#5268Method of producing a semiconductor device, and wafer-processing tape
#5269Semiconductor device and method for fabricating the same
#5270Semiconductor component having plate, stacked dice and conductive vias
#5271Thermal enhanced upper and dual heat sink exposed molded leadless package
#5272Structure and method for thin single or multichip semiconductor QFN packages
#5273DEVICE AND METHOD FOR ASSEMBLING A TOP AND BOTTOM EXPOSED PACKAGED SEMICONDUCTOR
#5274Wafer street buffer layer
#5275Leadless semiconductor package and method of manufacture
#5276Method for packaging a semiconductor device
#5277Stackable semiconductor package and method for its fabrication
#5278Ultra-thin quad flat no-lead (QFN) package
#5279Semiconductor die package using leadframe and clip and method of manufacturing
#5280Integrated circuit package system with heat sink
#5281Method of forming a leaded molded array package
#5282Reversible leadless package and methods of making and using same
#5283FLIP-CHIP INTEGRATED CIRCUIT PACKAGING METHOD
#5284Method for fabricating semiconductor package
#5285Semiconductor wafer, panel and electronic component with stacked semiconductor chips, and also method for producing same
#5286Solvent Assisted Burnishing of Pre-Underfilled Solder-Bumped Wafers for Flipchip Bonding
#5287Electrode package for semiconductor device
#5288Method of manufacturing flash memory cards
#5289Semiconductor device and manufacturing method thereof
#5290Heat treatment for a panel and apparatus for carrying out the heat treatment method
#5291METHOD OF MAKING SEMICONDUCTOR PACKAGE WITH REDUCED MOISTURE SENSITIVITY
#5292Method for manufacturing a semiconductor device
#5293Semiconductor mount substrate, semiconductor device and method of manufacturing semiconductor package
#5294Semiconductor component of semiconductor chip size with flip-chip-like external contacts
#5295Method and apparatus for providing double-sided cooling of leadframe-based wire-bonded electronic packages
#5296Integrated circuit package system
#5297Semiconductor packaging process and carrier for semiconductor package
#5298Semiconductor device and a manufacturing method of the same
#5299Method of forming a molded array package device having an exposed tab and structure
#5300Semiconductor device and method for manufacturing the same
#5301CLOCK DISTRIBUTION NETWORKS AND CONDUCTIVE LINES IN SEMICONDUCTOR INTEGRATED CIRCUITS
#5302THERMAL ENHANCED PACKAGE FOR BLOCK MOLD ASSEMBLY
#5303Integrated circuit protruding pad package system
#5304Method for manufacturing electronic modules
#5305Fan out type wafer level package structure and method of the same
#5306Semiconductor package with a support structure and fabrication method thereof
#5307Method of manufacturing a semiconductor device
#5308Carrier-free semiconductor package with stand-off member and fabrication method thereof
#5309MATRIX PACKAGE SUBSTRATE STRUCTURE, CHIP PACKAGE STRUCTURE AND MOLDING PROCESS THEREOF
#5310Partially patterned lead frames and methods of making and using the same in semiconductor packaging
#5311Die pad for semiconductor packages and methods of making and using same
#5312Wafer-level package and IC module assembly method for the wafer-level package
#5313Stacked microelectronic devices and methods for manufacturing microelectronic devices
#5314Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#5315Semiconductor device and manufacturing method thereof
#5316Encapsulated chip scale package having flip-chip on lead frame structure and method
#5317Semiconductor die package
#5318Semiconductor device
#5319MOSFET package
#5320MOSFET package
#5321Multichip packages with exposed dice
#5322Chip-sized flip-chip semiconductor package and method for making the same
#5323Semiconductor device
#5324Methods of bonding two semiconductor devices
#5325Semiconductor device and method of manufacturing the same
#5326Wafer-level-chip-scale package and method of fabrication
#5327Substrate for manufacturing semiconductor device, semiconductor device manufacturing method
#5328Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom
#5329Anti-warp heat spreader for semiconductor devices
#5330Semiconductor die package and method for making the same
#5331Method of manufacturing a semiconductor device
#5332Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer
#5333Standoffs for centralizing internals in packaging process
#5334Heat-dissipating semiconductor package and fabrication method thereof
#5335Package structure of chip and the package method thereof
#5336Chip-package structure and fabrication process thereof
#5337Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof
#5338Physical quantity sensor, lead frame, and manufacturing method therefor
#5339Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors
#5340Electronic circuit protection device
#5341Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film
#5342Semiconductor package and fabrication method thereof
#5343Semiconductor device and the manufacturing method for the same
#5344Semiconductor device
#5345Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts
#5346Method for efficiently producing removable peripheral cards
#5347Lead frame, semiconductor device, method for producing semiconductor device, and injection mold
#5348Method of manufacturing shielded electronic circuit units
#5349Panel and semiconductor device having a composite plate with semiconductor chips
#5350Wafer level pre-packaged flip chip systems
#5351Wafer level pre-packaged flip chip
#5352Wafer level pre-packaged flip chip
#5353Wafer level pre-packaged flip chip system
#5354Circuit device and method of manufacturing thereof
#5355Method of fabricating wafer level package
#5356Method for fabricating a semiconductor device having a heat radiation layer
#5357Semiconductor device production method and semiconductor device
#5358Method of manufacturing a semiconductor apparatus
#5359Semiconductor device and method of manufacturing the same
#5360Semiconductor device with terminals, and method of manufacturing the same
#5361Standoffs for centralizing internals in packaging process
#5362Semiconductor device and electronic device
#5363Semiconductor device with electrically isolated ground structures
#5364Thermal enhanced low profile package structure
#5365Method of forming a substrateless semiconductor package
#5366Semiconductor device
#5367Thin multiple semiconductor die package
#5368Ball grid array package and process for manufacturing same
#5369Method for manufacturing surface acoustic wave device
#5370Semiconductor device and a manufacturing method of the same
#5371Method of manufacturing a semiconductor device
#5372Semiconductor device having a functional surface
#5373Semiconductor device and manufacturing method for the same
#5374Lead frame panel and method of packaging semiconductor devices using the lead frame panel
#5375Integrated circuit card and a method for manufacturing the same
#5376Process for manufacturing sawing type leadless semiconductor packages
#5377MOSFET package
#5378MOSFET package
#5379Microfeature devices and methods for manufacturing microfeature devices
#5380Encapsulation method for semiconductor device having center pad
#5381Semiconductor package having double layer leadframe
#5382Microfeature devices and methods for manufacturing microfeature devices
#5383Semiconductor device and manufacturing method thereof
#5384Semiconductor packages and methods for making and using same
#5385Semiconductor component sealed on five sides by polymer sealing layer
#5386Smart card, smart card module, and a method for production of a smart card module
#5387Semiconductor manufacturing method for die bonding
#5388Thermal enhanced package for block mold assembly
#5389Semiconductor device and method for manufacturing semiconductor device
#5390Semiconductor chip electrical connection structure
#5391Thin array plastic package without die attach pad and process for fabricating the same
#5392Method of manufacturing a cavity package
#5393Semiconductor package and fabrication method of the same
#5394Semiconductor device package and manufacturing method thereof
#5395Circuit device and portable device with symmetrical arrangement
#5396Method of manufacturing a semiconductor device
#5397Method of marking a low profile packaged semiconductor device
#5398Circuit device with circuit board and semiconductor chip mounted thereon
#5399Electrical or electronic component and method of producing same
#5400Electronic component with a housing package