207503 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof; Manufacture of specific parts of devices defined in group; Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
Method for fabrication of an integrated circuit rendering a reverse engineering of the integrated circuit more difficult and corresponding integrated circuit
#302Semiconductor device with graphene encapsulated metal and method therefor
#303Method for manufacturing a contact bump by thermal expansion of a patterned sacrificial layer underneath a galvanic layer
#304Parallel plate waveguide for power circuits
#305Chemoepitaxy etch trim using a self aligned hard mask for metal line to via
#306Increased contact alignment tolerance for direct bonding
#307Stretchable conductor, method for manufacturing same, and paste for forming stretchable conductor
#308Nanowires for pillar interconnects
#309Manufacturing method of display panel
#310Hybrid subtractive etch/metal fill process for fabricating interconnects
#311Interior material for thin film deposition device and method for manufacturing same
#312Secondary electron generating composition
#313SRAM cell word line structure with reduced RC effects
#314Methods for pre-deposition treatment of a work-function metal layer
#315Fan-out wafer-level packaging using metal foil lamination
#316Seam healing of metal interconnects
#317Metal on both sides with clock gated-power and signal routing underneath
#318Apparatus and method for placing stressors within an integrated circuit device to manage electromigration failures
#319Method of manufacturing semiconductor device
#320Semiconductor device packages, packaging methods, and packaged semiconductor devices
#321Methods of forming semiconductor device structures including stair step structures
#322Semiconductor devices including conductive lines and methods of forming the semiconductor devices
#323Methods for producing semiconductor devices
#324Self-aligned back end of line cut
#325Capacitor in post-passivation structures and methods of forming the same
#326Magnetic trap for cylindrical diamagnetic materials
#327Printed interconnects for semiconductor packages
#328Semiconductor device and manufacturing method thereof
#329Apparatuses including stair-step structures and methods of forming the same
#330Semiconductor device and manufacturing method thereof
#331Apparatus for depositing a layer on a substrate in a processing gas
#332Ultrasonic transducers in complementary metal oxide semiconductor (CMOS) wafers and related apparatus and methods
#333PVD deposition and anneal of multi-layer metal-dielectric film
#334Systems and methods involving data bus inversion memory circuitry, configuration(s) and/or operation
#335Interconnection for memory electrodes
#336Thin film transistor and manufacturing method thereof
#337Package and method for integration of heterogeneous integrated circuits
#338Techniques for forming interconnects in porous dielectric materials
#339Connecting techniques for stacked CMOS devices
#340Substrate conductor structure and method
#341Power semiconductor device and method therefor
#342Method and apparatus for aerosol-based three-dimensional (3D) printing of flexible graphene electronic devices
#343Multiheight contact via structures for a multilevel interconnect structure
#344Semiconductor device contact structure having stacked nickel, copper, and tin layers
#345Three dimensional memory and methods of forming the same
#346Low temperature thin wafer backside vacuum process with backgrinding tape
#347Systems and methods involving data bus inversion memory circuitry, configuration and/or operation including data signals grouped into 10 bits and/or other features
#348Graphene wiring structure and manufacturing method thereof
#349Magnetic trap for cylindrical diamagnetic materials
#350Selective formation of metallic films on metallic surfaces
#351Polymer member based interconnect
#352Fully molded peripheral package on package device
#353Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#354Three-dimensional (3D) semiconductor device
#355Semiconductor device packages and method of making the same
#356Methods of forming patterns using photomask layout
#357Methods of forming nanotube films and articles
#358Interconnect wires including relatively low resistivity cores
#359Flexible display and method of manufacturing the same
#360Integrated metal spacer and air gap interconnect
#361Techniques to avoid or limit implant punch through in split gate flash memory devices
#362Split-gate flash memory having mirror structure and method for forming the same
#363Devices, systems and methods for manufacturing through-substrate vias and front-side structures
#364Semiconductor device with multi-layer metallization
#365Semiconductor device and method for manufacturing the same
#366Semiconductor device
#367Method of packaging integrated circuits
#368COATED FULLERENES, COMPOSITES AND DIELECTRICS MADE THEREFROM
#369Providing a chip die with electrically conductive elements
#370Through silicon vias and thermocompression bonding using inkjet-printed nanoparticles
#371Set of stepped surfaces formation for a multilevel interconnect structure
#372Interlayer dielectric layer with two tensile dielectric layers
#373Semiconductor package with reduced via hole width and reduced pad patch and manufacturing method thereof
#374Electroless plating process and tin-silver plating solution therein
#375Multi-layer dielectric stack for plasma damage protection
#376Semiconductor structure and manufacturing method of the same
#377Metal wiring and method of manufacturing the same, and metal wiring substrate and method of manufacturing the same
#378Line layout and method of spacer self-aligned quadruple patterning for the same
#379Semiconductor device and method comprising redistribution layers
#380Printed interconnects for semiconductor packages
#381Graphene wiring and method for manufacturing the same
#382Wiring and method for manufacturing the same
#383Selective area deposition of metal films by atomic layer deposition (ALD) and chemical vapor deposition (CVD)
#384Nonvolatile semiconductor memory device and method of manufacturing the same
#385Polymer member based interconnect
#386Template and pattern forming method
#387Intramodule radio frequency isolation
#388THIN FILM TRANSISTOR AND FABRICATING METHOD THEREOF
#3893D NAND nonvolatile memory with staggered vertical gates
#390TSV formation
#391POWER SEMICONDUCTOR DEVICE AND METHOD THEREFOR
#392Multilayered contact structure having nickel, copper, and nickel-iron layers
#393Semiconductor device and method for manufacturing the same
#394Radio frequency module including segmented conductive ground plane
#395Semiconductor device and method
#396Radio frequency module including segmented conductive top layer
#397EMI shield for high frequency layer transferred devices
#398Electronic interconnects and devices with topological surface states and methods for fabricating same
#399Interconnect structures for integrated circuits and their formation
#400Methods and apparatus for chemical vapor deposition of a cobalt layer
#401Method of forming a semiconductor device comprising first and second nitride layers
#402Semiconductor device packages, packaging methods, and packaged semiconductor devices
#403Semiconductor device packages, packaging methods, and packaged semiconductor devices
#404Electrically conductive element, power semiconductor device having an electrically conductive element and method of manufacturing a power semiconductor device
#405Method for fabricating interlayer dielectric layer
#406Fabricating electronic device including a semiconductor memory that comprises an inter-layer dielectric layer with first and second nitride layer over stacked structure
#407Hybrid copper structure for advance interconnect usage
#408Magnetic trap for cylindrical diamagnetic materials
#409Capacitor in post-passivation structures and methods of forming the same
#410Neutral beam etching of Cu-containing layers in an organic compound gas environment
#411SEMICONDUCTOR DEVICE, SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
#412Combination interconnect structure and methods of forming same
#413Method for fabricating and manufacturing micro—and nano-fabricated devices and systems securely
#414Semiconductor substrate, eletronic device and method for manufacturing the same
#415Methods for stiction reduction in MEMS sensors
#416Methods of forming MIS contact structures for semiconductor devices and the resulting devices
#417Package systems
#418Semiconductor device
#4193D IC method and device
#420Conductive lines in circuits
#421Semiconductor device and method of manufacturing the same
#422Fluorine-containing conductive films
#423Ultrasonic transducers in complementary metal oxide semiconductor (CMOS) wafers and related apparatus and methods
#424Electric conduction through supramolecular assemblies of triarylamines
#425Dielectric liner added after contact etch before silicide formation
#426Collapsible probe tower device and method of forming thereof
#427Magnetic trap for cylindrical diamagnetic materials
#428Antifuse array and method of forming antifuse using anodic oxidation
#429Integrated metal spacer and air gap interconnect
#430Method of semiconductor integrated circuit fabrication
#431Microelectronic packages having mold-embedded traces and methods for the production thereof
#432Embedded on-chip security
#433Conductive line routing for multi-patterning technology
#434Semiconductor structure and method for manufacturing the same
#435Biometrics Sensor Having Flat Contact Surface Formed by Signal Extending Structure and Method of Manufacturing Such Sensor
#436Interconnect structure including a conductive feature and a barrier layer on sidewalls and a bottom surface of the conductive feature and method of forming the same
#437Chip package including recess in side edge
#438Laser doping of crystalline semiconductors using a dopant-containing amorphous silicon stack for dopant source and passivation
#439Apparatuses including stair-step structures and methods of forming the same
#440Toroid inductor in redistribution layers (RDL) of an integrated device
#441Semiconductor devices and methods of manufacture thereof
#442Method of manufacturing semiconductor device and semiconductor device
#443Method for manufacturing semiconductor devices using self-aligned process to increase device packing density
#444Methods of localized hardening of dicing channel by applying localized heat in wafer kerf
#445Semiconductor device and method comprising thickened redistribution layers
#446Selective formation of metallic films on metallic surfaces
#447Backside redistribution layer (RDL) structure
#448SEMICONDUCTOR DEVICES COMPRISING EDGE DOPED GRAPHENE AND METHODS OF MAKING THE SAME
#449Techniques for forming interconnects in porous dielectric materials
#4503-D IC device with enhanced contact area
#451Using materials with different etch rates to fill trenches in semiconductor devices
#452Forming conductive portions in insulating materials matreials using an ion beam
#453Selective area deposition of metal films by atomic layer deposition (ALD) and chemical vapor deposition (CVD)
#454Connecting techniques for stacked CMOS devices
#455Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
#456Process For Forming And Composite Comprising Conducting Paths Comprising Silver
#457Cleaning liquid composition, method for cleaning semiconductor element, and method for manufacturing semiconductor element
#458Ultra-thin structure to protect copper and method of preparation
#459Method for forming recess-free interconnect structure
#460Integrated circuit and fabricating method thereof
#461Method of manufacturing device substrate and display device manufactured using the same
#462Electronic device incorporating a randomized interconnection layer having a randomized conduction pattern
#463Bridging local semiconductor interconnects
#464Structure and method for forming interconnect structure
#465Memory architecture of 3D array with diode in memory string
#466Semiconductor devices and methods of formation thereof
#467Shielding design for metal gap fill
#468Die up fully molded fan-out wafer level packaging
#469Devices, systems and methods for manufacturing through-substrate vias and front-side structures
#470Method of packaging a circuit
#471Semiconductor device having an airbridge and method of fabricating the same
#472Semiconductor device
#473Method of manufacturing semiconductor device
#474Methods of forming parallel wires of different metal materials through double patterning and fill techniques
#475Metal redistribution layer for molded substrates
#476Method and apparatus for direct formation of nanometer scaled features
#477Contact structure and forming method
#478Interconnect wires including relatively low resistivity cores
#479Embedded on-chip security
#480SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#481Interconnection for memory electrodes
#482Single-chip multi-domain galvanic isolation device and method
#483Methods of fabricating semiconductor devices
#484Conductive line structures and methods of forming the same
#485Functionalised redistribution layer
#486Semiconductor device and method for manufacturing same
#487Semiconductor devices including multiple interconnection structures
#488Interconnection of several levels of a stack of supports for electronic components
#489Conductor with sub-lithographic self-aligned 3D confinement
#490Semiconductor device and manufacturing method thereof
#491Method of depositing film
#492METHOD FOR INTERCONNECTION OF COMPONENTS ON A SUBSTRATE
#493Method for off-grid routing structures utilizing self aligned double patterning (SADP) technology
#494Methods of forming an e-fuse for an integrated circuit product and the resulting e-fuse structure
#495Methods for producing semiconductor devices
#496Capacitor in post-passivation structures and methods of forming the same
#497SEMICONDUCTOR DEVICES COMPRISING EDGE DOPED GRAPHENE AND METHODS OF MAKING THE SAME
#498Method of making semiconductor device with distinct multiple-patterned conductive tracks on a same level
#499Methods of dividing layouts and methods of manufacturing semiconductor devices using the same
#500Semiconductor device with distinct multiple-patterned conductive tracks on a same level
#501Method and structure of packaging semiconductor devices
#502WIRING FILM AND ACTIVE MATRIX SUBSTRATE USING THE SAME, AND METHOD FOR MANUFACTURING WIRING FILM
#503BEOL selectivity stress film
#504Semiconductor device and method for manufacturing the same
#505Die seal ring and method of forming the same
#506Semiconductor device manufacturing method
#507Dielectric liner added after contact etch before silicide formation
#508Methods of forming conductive structures using a sacrificial material during a metal hard mask removal process
#509METHODS OF FORMING CONDUCTIVE STRUCTURES USING A SACRIFICIAL MATERIAL DURING AN ETCHING PROCESS THAT IS PERFORMED TO REMOVE A METAL HARD MASK
#510Methods for stiction reduction in MEMS sensors
#511Semiconductor device having parallel conductive lines including a cut portion and method of manufacturing the same
#512ETCH bias homogenization
#513Chip package and method for forming the same
#514Metal wiring and method of manufacturing the same, and metal wiring substrate and method of manufacturing the same
#515Via-free interconnect structure with self-aligned metal line interconnections
#516Hybrid graphene-metal interconnect structures
#517Display device
#518Manufacturing method of wafer level package
#519Semiconductor device and manufacturing method thereof
#520Systems and methods involving data bus inversion memory circuitry, configuration and/or operation including data signals grouped into 10 bits and/or other features
#521Systems and methods involving data bus inversion memory circuitry, configuration and/or operation
#522Semiconductor device and method of manufacturing the same
#523Semiconductor device and method for manufacturing same
#524POWER SEMICONDUCTOR DEVICE FABRICATION METHOD, POWER SEMICONDUCTOR DEVICE
#525Spacer etching process for integrated circuit design
#526Methods for hybrid wafer bonding integrated with CMOS processing
#527Oriented crystal nanowire interconnects
#528Copper interconnect structures and methods of making same
#529Method for forming recess-free interconnect structure
#530MICROWAVE-ASSISTED HEATING OF STRONG ACID SOLUTION TO REMOVE NICKEL PLATINUM/PLATINUM RESIDUES
#531IC package with stainless steel leadframe
#532Semiconductor device and method of manufacturing the same
#533Method of semiconductor integrated circuit fabrication
#534Semiconductor devices and methods of manufacture thereof
#535Semiconductor memory device and method for manufacturing same
#536Method of forming interconnection lines
#537Conductive line routing for multi-patterning technology
#538Method for line stress reduction through dummy shoulder structures
#539Mitigating pattern collapse
#540Semiconductor device and method of manufacturing the same
#541Graphene patterning method and patterning member
#542Semiconductor device
#543Method of forming patterns for semiconductor device
#5443D stacking semiconductor device and manufacturing method thereof
#5453D IC method and device
#546Method for tuning the effective work function of a gate structure in a semiconductor device
#547METHODS OF MANUFACTURING INTEGRATED CIRCUITS HAVING A COMPRESSIVE NITRIDE LAYER
#548Heteroleptic (allyl)(pyrroles-2-aldiminate) metal-containing precursors, their synthesis and vapor deposition thereof to deposit metal-containing films
#549Segmented conductive top layer for radio frequency isolation
#550Systems and methods for providing intramodule radio frequency isolation
#551Package systems and manufacturing methods thereof
#552Semiconductor devices having fine patterns
#553Method for fabricating interconnect structure
#554Segmented conductive ground plane for radio frequency isolation
#555Package with dielectric or anisotropic conductive (ACF) buildup layer
#556Method for manufacturing semiconductor device, semiconductor device and jig for forming wiring
#557Contact plugs in SRAM cells and the method of forming the same
#558Flip Chip Interconnection Structure
#559Processing for overcoming extreme topography
#560Gallium-nitride-on-diamond wafers and devices, and methods of manufacture
#561Method for fabricating a carbon nanotube interconnection structure
#562Method for manufacturing stretchable thin film transistor
#563Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus
#564Semiconductor device having conductive pads and a method of manufacturing the same
#565Low resistance stacked annular contact
#566Semiconductor device and method of manufacturing the same
#567TSV formation
#568Electrode and method of forming the master electrode
#569Additive conductor redistribution layer (ACRL)
#570System and method for forming an aluminum fuse for compatibility with copper BEOL interconnect scheme
#571Interconnection for memory electrodes
#572Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability
#573Method of making an interconnect device
#574Laser Doping of Crystalline Semiconductors Using a Dopant-Containing Amorphous Silicon Stack For Dopant Source and Passivation
#575Laser doping of crystalline semiconductors using a dopant-containing amorphous silicon stack for dopant source and passivation
#576Protection layer for halftone process of third metal
#577Encapsulated metal interconnect
#578Method for manufacturing display device
#579Chip comprising an integrated circuit, fabrication method and method for locally rendering a carbonic layer conductive
#580Semiconductor device with low resistance wiring and manufacturing method for the device
#581Multiple metal film stack in BSI chips
#582Multi-level vertical plug formation with stop layers of increasing thicknesses
#583Conductive lines and pads and method of manufacturing thereof
#584Method to improve fine Cu line reliability in an integrated circuit device
#585Two-track cross-connect in double-patterned structure using rectangular via
#586Semiconductor device and method for fabricating the same
#587PHOTORESIST COMPOSITION, THIN FILM TRANSISTOR ARRAY PANEL, AND METHOD OF MANUFACTURING THE SAME
#588Three dimensional memory and methods of forming the same
#589Semiconductor device
#590Method for forming tungsten film having low resistivity, low roughness and high reflectivity
#591Power module substrate, power module, and method for manufacturing power module substrate
#592Method for fabricating a semiconductor device with formation of conductive lines
#593Method of manufacturing semiconductor device
#594Method of manufacturing semiconductor device
#595Apparatuses including stair-step structures and methods of forming the same
#596Substrate conductor structure and method
#597Semiconductor module and manufacturing method thereof
#598Semiconductor device and method of manufacturing thereof
#599System and method for forming aluminum fuse for compatibility with copper BEOL interconnect scheme
#600Method for forming metal wire