207503 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof; Manufacture of specific parts of devices defined in group; Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
Semiconductor wafer plating bus and method for forming
#602Method for forming patterns of dense conductor lines and their contact pads, and memory array having dense conductor lines and contact pads
#603INTERCONNECTION OF SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
#604Low temperature thin wafer backside vacuum process with backgrinding tape
#605Via-free interconnect structure with self-aligned metal line interconnections
#606Etch bias homogenization
#607Apparatus and method for depositing a layer onto a substrate
#608Semiconductor device with self-aligned interconnects and blocking portions
#609Semiconductor device fabrication method capable of scribing chips with high yield
#610Chip pad resistant to antenna effect and method
#611Interconnect structures for integrated circuits and their formation
#612Nanotube electronics templated self-assembly
#613Method for forming fine pitch structures
#614Method for making high-speed ceramic modules with hybrid referencing scheme for improved performance and reduced cost
#615Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability
#616Pattern forming method
#617Manufacturing method of semiconductor device
#618Leadframe based multi terminal IC package
#619Method for making a redistributed electronic device using a transferrable redistribution layer
#620Method for making a redistributed wafer using transferrable redistribution layers
#621Method of depositing metals using high frequency plasma
#622Method for building vertical pillar interconnect
#623Semiconductor devices with copper interconnects and methods for fabricating same
#624Shielding design for metal gap fill
#625Die up fully molded fan-out wafer level packaging
#626Electrically conductive device and manufacturing method thereof
#627Semiconductor wafer plating bus
#628Multilayer connection structure
#629Tungsten metallization: structure and fabrication of same
#630Resized wafer with a negative photoresist ring and design structures thereof
#631Electroless plating apparatus and electroless plating method
#632Method of fabricating land grid array semiconductor package
#633AlCu hard mask process
#634SUBSTRATE COMPRISING A TRANSPARENT CONDUCTIVE OXIDE FILM AND ITS MANUFACTURING PROCESS
#635Method for forming metal film with twins
#636Semiconductor device and method for manufacturing same
#637Semiconductor substrate, electronic device and method for manufacturing the same
#638INTEGRATED CIRCUIT AND METHOD OF MAKING
#639Method for protection of a layer of a vertical stack and corresponding device
#640Methods of forming a metal containing layer on a substrate with high uniformity and good profile control
#641Thin Film, Pattern Layer, And Manufacturing Method Thereof
#642Semiconductor device
#643Semiconductor device and method of manufacturing the same
#644Method for fabricating a semiconductor device with formation of conductive lines
#645Wiring film and active matrix substrate using the same, and method for manufacturing wiring film
#646Semiconductor device including conductive lines and pads
#647SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#648SEMICONDUCTOR PROCESS
#649Semiconductor device and method for manufacturing the same
#650Method of forming a conductive image on a non-conductive surface
#651Tungsten metallization: structure and fabrication of same
#652Method of forming a conductive image on a non-conductive surface
#653Power MOSFET contact metallization
#654METHODS OF FORMING METAL OR METAL NITRIDE PATTERNS AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#655Multi-chip wafer level package
#656Semiconductor structure having material layers which are level with each other and manufacturing method thereof
#657Electric conduction through supramolecular assemblies of triarylamines
#658Reducing metal pits through optical proximity correction
#659Chip comprising an integrated circuit, fabrication method and method for locally rendering a carbonic layer conductive
#660Apparatuses including stair-step structures and methods of forming the same
#661Electrode and method of forming the master electrode
#662Method of manufacturing semiconductor device
#663Semiconductor device having a trace comprises a beveled edge
#664SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
#665Electronic circuits including planar electronic devices
#666METHOD OF FORMING A MULTILAYER STRUCTURE
#667Display device
#668MASTER ELECTRODE AND METHOD OF FORMING IT
#669Method of forming an interconnect structure having an enlarged region
#670Interconnect structure containing various capping materials for electrical fuse and other related applications
#671CHEMICAL MECHANICAL POLISHING (CMP) PROCESSING OF THROUGH-SILICON VIA (TSV) AND CONTACT PLUG SIMULTANEOUSLY
#672Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus
#673Methods of fabricating semiconductor devices
#674Template and pattern forming method
#675Electron beam induced deposition of interface to carbon nanotube
#676Two-track cross-connects in double-patterned metal layers using a forbidden zone
#677Pattern-split decomposition strategy for double-patterned lithography process
#678Redundancy design with electro-migration immunity and method of manufacture
#679Two-track cross-connect in double-patterned structure using rectangular via
#680Metal wiring and method of manufacturing the same, and metal wiring substrate and method of manufacturing the same
#681MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND PATTERN-FORMING METHOD
#682Semiconductor device
#683Semiconductor device having an airbridge and method of fabricating the same
#684Semiconductor device conductive pattern structures including dummy conductive patterns
#685Reduced number of masks for IC device with stacked contact levels
#686Method for making multilayer connection structure
#687Method of forming metal silicide contact and metal interconnect
#688Method for depositing tungsten film having low resistivity, low roughness and high reflectivity
#689Redundancy design with electro-migration immunity and method of manufacture
#690Electronic interconnects and devices with topological surface states and methods for fabricating same
#691Chip pad resistant to antenna effect and method
#692METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
#693Semiconductor device and manufacturing method of semiconductor device
#694Through wafer vias with dishing correction methods
#695SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRIC DEVICE
#696Methods for reading a feature pattern from a packaged die
#697Product chips and die with a feature pattern that contains information relating to the product chip
#698Coated fullerenes, compositions and dielectrics made therefrom
#699Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
#700Contact structure for reducing gate resistance and method of making the same
#701Chip structure and process for forming the same
#702METHOD FOR MANUFACTURING WIRING, THIN FILM TRANSISTOR, LIGHT EMITTING DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE, AND DROPLET DISCHARGE APPARATUS FOR FORMING THE SAME
#703Method of forming patterns of semiconductor device
#704Package systems having a eutectic bonding material and manufacturing methods thereof
#705Display panel and method for manufacturing the same
#706Semiconductor structure and method for making same
#707Method for Producing a Thin-Film Semiconductor Chip
#708Display device
#709SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
#710Memory architecture of 3D array with diode in memory string
#711Bundle of long thin carbon structures, manufacturing method therefor, and electronic device
#712Semiconductor device having a conductive layer reliably formed under an electrode pad
#713Photovoltaic device with through-vias
#714REDUCED-STEP CMOS PROCESSES FOR LOW COST RADIO FREQUENCY IDENTIFICATION DEVICES
#715Semiconductor device and manufacturing method thereof
#716Interconnection architecture for semiconductor device
#717Conductive lines and pads and method of manufacturing thereof
#718Metal-insulator-metal capacitor alloying process
#719Three dimensional memory and methods of forming the same
#720Method of fabricating metal interconnection and method of fabricating image sensor using the same
#721Semiconductor integrated circuit device
#722Interconnect structure to reduce stress induced voiding effect
#723Semiconductor device and method of manufacturing the same
#724METHOD OF PATTERNING THIN METAL FILMS
#725SEMICONDUCTOR DEVICE
#726Methods of forming a plurality of conductive lines in the fabrication of integrated circuitry, methods of forming an array of conductive lines, and integrated circuitry
#727Carbon nanotube circuit component structure
#728Semiconductor structure and manufacturing method of the same
#729DIRECTIONAL SELF-ASSEMBLY OF BIOLOGICAL ELECTRICAL INTERCONNECTS
#730Flip chip interconnection structure
#731Semiconductor Device and the Fabricating Method Thereof
#732Chemical mechanical polishing (CMP) processing of through-silicon via (TSV) and contact plug simultaneously
#733Dummy shoulder structure for line stress reduction
#734Leadframe based multi terminal IC package
#735TRENCH INTERCONNECT STRUCTURE AND FORMATION METHOD
#736Semiconductor device having via connecting between interconnects
#737Transistor and manufacturing method of the same
#738Display device
#739Semiconductor device having conductive pads and a method of manufacturing the same
#740Semiconductor device and method for fabricating the same
#741Method for manufacturing thin film transistor and display device
#742System and Method for Manufacturing Embedded Conformal Electronics
#743Structure for interconnect structure containing various capping materials for electrical fuse and other related applications
#744SEMICONDUCTOR DEVICE WITH FUSE AND METHOD FOR FABRICATING THE SAME
#745Method for manufacturing wiring, thin film transistor, light emitting device and liquid crystal display device, and droplet discharge apparatus for forming the same
#746High-speed ceramic modules with hybrid referencing scheme for improved performance and reduced cost
#747Processing for overcoming extreme topography
#748Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation
#749Method for manufacturing a semiconductor device
#750Nano imprint technique with increased flexibility with respect to alignment and feature shaping
#751AUTOMATED SHORT LENGTH WIRE SHAPE STRAPPING AND METHODS OF FABRICTING THE SAME
#752THERMO-MECHANICAL STRESS IN SEMICONDUCTOR WAFERS
#753Semiconductor device and method of fabricating the same
#754Method of patterning transparent conductive film, thin film transistor substrate using the same and fabricating method thereof
#755Semiconductor device and method of manufacturing same
#756Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#757Semiconductor device comprising oxide semiconductor layer
#758Power module substrate, power module, and method for manufacturing power module substrate
#759Template and pattern forming method
#760Semiconductor device and method for manufacturing the same
#761Semiconductor device manufacturing method
#762Interconnection between sublithographic-pitched structures and lithographic-pitched structures
#763Method of manufacturing semiconductor device
#764Horizontal coffee-stain method using control structure to pattern self-organized line structures
#765Interconnection structure, a thin film transistor substrate, and a manufacturing method thereof, as well as a display device
#766System for Depositing a Film by Modulated Ion-Induced Atomic Layer Deposition (MII-ALD)
#767Semiconductor process
#768Method of forming pitch multiplied contacts
#769METHOD AND SYSTEM FOR MAKING THIN METAL FILMS
#770Dissolving precipates in alloy material in capacitor structure
#771Method of forming patterns of semiconductor device
#772Horizontal coffee-stain method using control structure to pattern self-organized line structures
#773Vertical coffee-stain method for forming self-organized line structures
#774Improvements for reducing electromigration effect in an integrated circuit
#775System and method for reducing process-induced charging
#776Local metallization and use thereof in semiconductor devices
#777Semiconductor devices including a topmost metal layer with at least one opening and their methods of fabrication
#778INCREASED GRAIN SIZE IN METAL WIRING STRUCTURES THROUGH FLASH TUBE IRRADIATION
#779Method for manufacturing display device with electrode having frame shape
#780Methods of forming a plurality of conductive lines in the fabrication of integrated circuitry, methods of forming an array of conductive lines, and integrated circuitry
#781Method of making integrated circuit chip utilizing oriented carbon nanotube conductive layers
#782REDUCED-STEP CMOS PROCESSES FOR LOW COST RADIO FREQUENCY IDENTIFICATION DEVICES
#783METHOD FOR APPLYING ELECTRICAL CONTACTS ON SEMICONDUCTING SUBSTRATES, SEMICONDUCTING SUBSTRATE AND USE OF THE METHOD
#784Superlattice nanopatterning of wires and complex patterns
#785Structurally stabilized semiconductor nanowire
#786Horizontal micro-electro-mechanical-system switch
#787Method for the printing of homogeneous electronic material with a multi-ejector print head
#788Method for the printing of homogeneous electronic material with a multi-ejector print head
#789Method for the printing of homogeneous electronic material with a multi-ejector print head
#790Fabrication method of semiconductor integrated circuit device
#791Integrated Circuit with Ribtan Interconnects
#792Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
#793Display device
#794Method of forming patterns for semiconductor device
#795PATTERN FORMATION METHOD
#796METHODS OF FABRICATING SEMICONDUCTOR DEVICES WITH METAL-SEMICONDUCTOR COMPOUND SOURCE/DRAIN CONTACT REGIONS
#797Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof
#798METHOD OF FORMING SEMICONDUCTOR DEVICES EMPLOYING DOUBLE PATTERNING
#799High density plasma chemical vapor deposition process
#800Extended liner for localized thick copper interconnect
#801SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRIC DEVICE
#802METHOD FOR REMOVING HARDENED POLYMER RESIDUE
#803Method for improving electromigration lifetime of copper interconnection by extended post anneal
#804Semiconductor device including wiring having main portion and extended portion
#805Rapid patterning of nanostructures
#806Semiconductor device and method of manufacturing the same
#807Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereor, and material for coupling a dielectric layer and a metal layer in a semiconductor device
#808Process for manufacturing semiconductor integrated circuit device
#809DIRECT PATTERNING METHOD FOR MANUFACTURING A METAL LAYER OF A SEMICONDUCTOR DEVICE
#810Method of manufacturing an integrated circuit
#811Capacitor device and method of manufacturing the same
#812Method for patterning metal using nanoparticle containing precursors
#813Electrochemical-codeposition methods for forming carbon nanotube reinforced metal composites
#814Top layers of metal for high performance IC's
#815Multilevel imprint lithography
#816Semiconductor device, electronic device, and method of manufacturing semiconductor device
#817Semiconductor integrated circuit device
#818Method for forming tungsten materials during vapor deposition processes
#819Methods of forming fine patterns in the fabrication of semiconductor devices
#820High density nanodot nonvolatile memory
#821Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation
#822Method for the Production of a Windshield Wiping Concentrate in the Form of Tablets, Windshield Wiping Concentrate, and Corresponding Presentation
#823Method for producing silver particle powder
#824Nonvolatile semiconductor memory and method for fabricating the same
#825Methods of forming particle-containing materials
#826Semiconductor device having via connecting between interconnects
#827Fabricating product chips and die with a feature pattern that contains information relating to the product chip
#828METHOD OF FORMING METAL LINE OF INDUCTOR
#829Maskless nanofabrication of electronic components
#830Radio frequency power semiconductor device comprising matrix of cavities as dielectric isolation structure
#831Through wafer vias with dishing correction methods
#832IC chip and design structure with through wafer vias dishing correction
#833Display panel and method for manufacturing the same
#834CARBON NANOTUBE INTERCONNECT STRUCTURES
#835Aluminum Inks and Methods of Making the Same, Methods for Depositing Aluminum Inks, and Films Formed by Printing and/or Depositing an Aluminum Ink
#836Electric linkage in a semiconductor electronic device between a nanometric circuit architecture and standard electronic components
#837Method for fabricating conducting plates for a high-Q MIM capacitor
#838METHOD FOR FORMING CONDUCTIVE PATTERN, SEMICONDUCTOR DEVICE USING THE SAME AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
#839CLEANING COMPOSITIONS WITH VERY LOW DIELECTRIC ETCH RATES
#840Devices having vertically-disposed nanofabric articles and methods of making the same
#841Multi-exposure lithography employing a single anti-reflective coating layer
#842Patterning method
#843METHOD FOR FORMING ELECTRODE ON SEMICONDUCTOR WAFER
#844SEMICONDUCTOR DEVICE WITH IMPROVED INTERCONNECTION OF CONDUCTOR PLUG
#845Chip pad resistant to antenna effect and method
#846Method of aligning nanotubes and wires with an etched feature
#847Method for forming fine pitch structures
#848Methods of forming fine patterns in the fabrication of semiconductor devices
#849Top layers of metal for high performance IC's
#850Manufacturing method of semiconductor device
#851Laser ablation of electronic devices
#852Processing for overcoming extreme topography
#853Electrically-conductive and semi-conductive films
#854Techniques for precision pattern transfer of carbon nanotubes from photo mask to wafers
#855Method of making self-aligned nanotube contact structures
#856Carbon nanotube device and manufacturing method of the same
#857Electromechanical memory array using nanotube ribbons and method for making same
#858METHODS OF MAKING CARBON NANOTUBE FILMS, LAYERS, FABRICS, RIBBONS, ELEMENTS AND ARTICLES
#859Electronic device and semiconductor device and method for manufacturing the same
#860Redundancy design with electro-migration immunity
#861Structure for interconnect structure containing various capping materials for electrical fuse and other related applications
#862MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND PATTERN-FORMING METHOD
#863Method for growing carbon nanotubes, and electronic device having structure of ohmic connection to carbon element cylindrical structure body and production method thereof
#864Method for fabricating a metal interconnection using a dual damascene process and resulting semiconductor device
#865Semiconductor integrated circuit device having memory cells disposed at cross point of metal lines and method for fabricating the same
#866Method for manufacturing wiring, thin film transistor, light emitting device and liquid crystal display device, and droplet discharge apparatus for forming the same
#867Semiconductor device and manufacturing method thereof
#868Method for manufacturing semiconductor device
#869Method of aligning deposited nanotubes onto an etched feature using a spacer
#870Structure for reduction of soft error rates in integrated circuits
#871Semiconductor device and method for manufacturing the same
#872Nanowire-based device having isolated electrode pair
#873ELECTRODE AND METHOD OF FORMING THE ELECTRODE
#874Master Electrode and Method of Forming the Master Electrode
#875ELECTRODE AND METHOD OF FORMING THE MASTER ELECTRODE
#876Electrode and method of forming the electrode
#877Method of Forming a Multilayer Structure
#878Methods for Electrochemically Fabricating Structures Using Adhered Masks, Incorporating Dielectric Sheets, and/or Seed Layers That Are Partially Removed Via Planarization
#879METHOD OF FORMING A MULTILAYER STRUCTURE
#880Method for the printing of homogeneous electronic material with a multi-ejector print head
#881Method for Generation of Metal Surface Structures and Apparatus Therefor
#882Semiconductor device having a reductant layer and manufacturing method thereof
#883Programmable nanotube interconnect
#884Methods of forming a conductive interconnect in a pixel of an imager and in other integrated circuitry
#885METHOD OF FORMING A MULTILAYER STRUCTURE
#886METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#887Wiring substrate, semiconductor device and manufacturing method thereof
#888Semiconductor integrated circuit having improved power supply wiring
#889Semiconductor Device and Method of Fabricating the Same
#890Semiconductor device with fuse and method for fabricating the same
#891SEMICONDUCTOR DEVICE WITH FUSE AND METHOD FOR FABRICATING THE SAME
#892METHOD FOR FORMING A PLURALITY OF METAL LINES IN A SEMICONDUCTOR DEVICE USING DUAL INSULATING LAYER
#893Method for forming tungsten materials during vapor deposition processes
#894SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRIC DEVICE
#895Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases
#896Method of manufacturing metal wiring and method of manufacturing semiconductor device
#897Top layers of metal for high performance IC's
#898Method and apparatus for processing thin metal layers
#899Method of fabricating metal interconnection and method of fabricating image sensor using the same
#900Interconnect structure to reduce stress induced voiding effect