207503 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof; Manufacture of specific parts of devices defined in group; Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
Semiconductor device
#902Laser assisted nano deposition
#903Semiconductor device, DRAM integrated circuit device, and method of producing the same
#904Polyconductor line end formation and related mask
#905Semiconductor integrated circuit device and a method of manufacturing the same
#906Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor to be used for reliability evaluation
#907Metal line in semiconductor device and fabricating method thereof
#908METHODS FOR FORMING NESTED AND ISOLATED LINES IN SEMICONDUCTOR DEVICES
#909Method for forming metal line in semiconductor device
#910Method for Functionalizing Surfaces
#911METAL LINE STACKING STRUCTURE IN SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF
#912Capacitor and semiconductor device having a ferroelectric material
#913Supercritical fluid-assisted direct write for printing integrated circuits
#914Method of making a semiconductor device having improved contacts
#915Carbon nanotube films, layers, fabrics, ribbons, elements and articles
#916Semiconductor Device with Multi-Layer Metallization
#917Methods of forming a conductive interconnect in a pixel of an imager and in other integrated circuitry
#918SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRIC DEVICE
#919CLEANING SOLUTION FORMULATIONS FOR SUBSTRATES
#920MASTER ELECTRODE AND METHOD OF FORMING IT
#9213D IC method and device
#922Method for growing carbon nanotubes having a predetermined chirality
#923Methods of making electromechanical three-trace junction devices
#924Semiconductor device and method for fabricating the same
#925CONTROLLED SURFACE OXIDATION OF ALUMINUM INTERCONNECT
#926Semiconductor device having via connecting between interconnects
#927Top layers of metal for high performance IC's
#928Devices having horizontally-disposed nanofabric articles and methods of making the same
#929Manufacturing method for wiring
#930Bipolar and CMOS integration with reduced contact height
#931Dendrite growth control circuit
#932Method for fabricating tungsten line and method for fabricating gate of semiconductor device using the same
#933Metal material, and coating film and wiring for semiconductor integrated circuitry utilizing the metal material
#934FILM-FORMING APPARATUS AND FILM-FORMING METHOD
#935Semiconductor device
#936Semiconductor device and manufacturing method thereof
#937Methods of making metal silicide contacts, interconnects, and/or seed layers
#938Method and system for controlled material removal by electrochemical polishing
#939Semiconductor device and method for fabricating the same
#940Methods of trench and contact formation in memory cells
#941Methods and apparatuses promoting adhesion of dielectric barrier film to copper
#942Semiconductor device and method of manufacturing same
#943Wiring board, manufacturing method thereof, semiconductor device and manufacturing method thereof
#944Forming complimentary metal features using conformal insulator layer
#945SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#946METHOD OF IMPROVING INTERCONNECTION BETWEEN ALUMINUM AND COPPER IN SEMICONDUCTOR METAL LINE PROCESS
#947LATERAL CURRENT CARRYING CAPABILITY IMPROVEMENT IN SEMICONDUCTOR DEVICES
#948Method for pattern metalization of substrates
#949MANUFACTURING METHOD OF A THIN FILM TRANSISTOR ARRAY PANEL
#950Methods of making carbon nanotube films, layers, fabrics, ribbons, elements and articles
#951STRUCTURE FOR OPTIMIZING FILL IN SEMICONDUCTOR FEATURES DEPOSITED BY ELECTROPLATING
#952Electrically Conductive Line
#953Method of Manufacturing a Structure
#954Method for Producing a Thin-Film Semiconductor Chip
#955Semiconductor device and manufacturing method of the same
#956SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#957Method for manufacturing semiconductor devices using self-aligned process to increase device packing density
#958Methods and apparatus for dynamically authenticated identification
#959Semiconductor device and semiconductor device manufacturing method
#960TOP LAYERS OF METAL FOR INTEGRATED CIRCUITS
#961Method for aligning microscopic structures and substrate having microscopic structures aligned, as well as integrated circuit apparatus and display element
#962Method and system for making thin metal films
#963Display device
#964Method for realizing a nanometric circuit architecture between standard electronic components and semiconductor device obtained with said method
#965Top layers of metal for high performance IC's
#966Method for fabricating conductive layer
#967Process for manufacturing semiconductor integrated circuit device
#968Semiconductor integrated circuit device and fabrication process thereof
#969Methods for Electrochemically Fabricating Structures Using Adhered Masks, Incorporating Dielectric Sheets, and/or Seed layers That Are Partially Removed Via Planarization
#970Method for manufacturing display device
#971METHOD FOR FORMING MINIATURE WIRES
#972Laterally grown nanotubes and method of formation
#973Method of forming conducting nanowires
#974Controlled Transport and Assembly of Nanostructures
#975Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and material for coupling a dielectric layer and a metal layer in a semiconductor device
#976Method for producing a metal article intended for at least partially coating with a substance
#977Semiconductor Device with Reduced Structural Pitch and Method of Making the Same
#978WIRING STRUCTURES OF SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME
#979Method for manufacturing wiring, thin film transistor, light emitting device and liquid crystal display device, and droplet discharge apparatus for forming the same
#980Method for realizing an electric linkage in a semiconductor electronic device between a nanometric circuit architecture and standard electronic components
#981Semiconductor integrated circuit device including wiring lines and interconnections
#982Method of creating isolated electrodes in a nanowire-based device
#983Method for reduction of soft error rates in integrated circuits
#984Method of patterning transparent conductive film, thin film transistor substrate using the same and fabricating method thereof
#985SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
#986Semiconductor device and method for fabricating the same
#987SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
#988Semiconductor device and manufacturing method thereof
#989Manufacturing method of semiconductor device
#990METHOD FOR FORMING METAL WIRING IN SEMICONDUCTOR DEVICE
#991Multilevel wiring, laminated aluminum wiring, semiconductor device and manufacturing method of the same
#992Method of forming wiring of a semiconductor memory device
#993Method for manufacturing semiconductor device capable of reducing parasitic bit line capacitance
#994Top layers of metal for high performance IC's
#995DEVICE HAVING CONTACT PAD WITH A CONDUCTIVE LAYER AND A CONDUCTIVE PASSIVATION LAYER
#996Top layers of metal for high performance IC's
#997Top layers of metal for high performance IC's
#998SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#999Chip structure and process for forming the same
#1000Semiconductor constructions comprising a layer of metal over a substrate
#1001Integrated circuit having a top side wafer contact and a method of manufacture therefor
#1002Method for redirecting void diffusion away from vias in an integrated circuit design
#1003Substrate, device, method of manufacturing device, method of manufacturing active matrix substrate, electro-optical apparatus and electronic apparatus
#1004Bundle of long thin carbon structures, manufacturing method thereof, and electronic device
#1005TUNGSTEN INTERCONNECT SUPER STRUCTURE FOR SEMICONDUCTOR POWER DEVICES
#1006Method for forming fine patterns of a semiconductor device using a double patterning process
#1007Chip structure and process for forming the same
#1008Nonvolatile semiconductor memory and method for fabricating the same
#1009Methods for lateral current carrying capability improvement in semiconductor devices
#1010Top layers of metal for integrated circuits
#1011Method of manufacturing fine patterns
#1012Material for Metallic-Pattern Formation, Crosslinking Monomer, and Method of Forming Metallic Pattern
#1013Forming self-aligned nano-electrodes
#1014High performance system-on-chip using post passivation process
#1015Integrated circuit device and method of producing the same
#1016INTEGRATED CIRCUIT INTERCONNECT LINES HAVING REDUCED LINE RESISTANCE
#1017Semiconductor device, wiring of semiconductor device, and method of forming wiring
#1018Method for forming pattern, thin film transistor, display device and method for manufacturing the same, and television device
#1019Methods for Electrochemically Fabricating Structures Using Adhered Masks, Incorporating Dielectric Sheets, and/or Seed layers That Are Partially Removed Via Planarization
#1020Contact structure and method of forming the same
#1021High performance system-on-chip using post passivation process
#1022Method of manufacturing a semiconductor device
#1023Method for manufacturing a semiconductor device including interconnections having a smaller width
#1024Method for manufacturing a structure in a semiconductor device and a structure in a semiconductor device
#1025Method for fabricating conducting plates for a high-Q MIM capacitor
#1026Post passivation interconnection schemes on top of IC chips
#1027Post passivation interconnection schemes on top of IC chips
#1028Top layers of metal for high performance IC's
#1029Top layers of metal for high performance IC's
#1030Separation-material composition for photo-resist and manufacturing method of semiconductor device
#1031REDUCTION OF HILLOCKS PRIOR TO DIELECTRIC BARRIER DEPOSITION IN CU DAMASCENE
#1032Post passivation interconnection schemes on top of IC chip
#1033Post passivation interconnection schemes on top of IC chip
#1034Post passivation interconnection schemes on top of IC chip
#1035Electromechanical memory array using nanotube ribbons and method for making same
#1036Method of forming a metal line of a semiconductor device
#1037Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases
#1038Crack stop for low K dielectrics
#1039Post passivation interconnection schemes on top of IC chip
#1040SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#1041Post passivation interconnection schemes on top of IC chip
#1042Manufacturing method of a semiconductor device having polycide wiring layer
#1043METHOD OF FABRICATING METAL LINE BY WET PROCESS
#1044Process for minimizing electromigration in an electronic device
#1045Semiconductor structure formed using a sacrificial structure
#1046Top layers of metal for high performance IC's
#1047Chip structure and process for forming the same
#1048Top layers of metal for high performance IC's
#1049METHOD OF FABRICATING CONDUCTIVE LINES AND STRUCTURE OF THE SAME
#1050Top layers of metal for high performance IC's
#1051SEMICONDUCTOR DEVICE
#1052Semiconductor device and fabricating method thereof
#1053Vapor deposition system using benzotriazole (BTA) and isopropyl alcohol for protecting copper interconnects
#1054Post passivation interconnection schemes on top of IC chip
#1055Top layers of metal for integrated circuits
#1056Post passivation interconnection schemes on top of IC chips
#1057Post passivation interconnection schemes on top of IC chips
#1058Post passivation interconnection schemes on top of IC chip
#1059High performance system-on-chip using post passivation process
#1060High performance system-on-chip using post passivation process
#1061Post passivation interconnection schemes on top of the IC chips
#1062Post passivation interconnection schemes on top of IC chip
#1063Post passivation interconnection schemes on top of IC chip
#1064Post passivation interconnection schemes on top of IC chip
#1065High performance system-on-chip using post passivation process
#1066Method for manufacturing a semiconductor device
#1067Integrated circuit chip utilizing oriented carbon nanotube conductive layers
#1068Post passivation interconnection schemes on top of IC chip
#1069High performance system-on-chip using post passivation process
#1070High performance system-on-chip using post passivation process
#1071High performance system-on-chip using post passivation process
#1072Integrated circuit system employing gate shield and/or ground shield
#1073Trench MOSFET with terraced gate and manufacturing method thereof
#1074Display panel and method for manufacturing the same
#1075SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#1076High performance system-on-chip using post passivation process
#1077Semiconductor integrated circuit device
#1078Semiconductor device having multilayer wiring structure
#1079High performance system-on-chip using post passivation process
#1080High performance system-on-chip using post passivation process
#1081Method for manufacturing contact structures of wiring
#1082Post passivation interconnection schemes on top of the IC chips
#1083Crossbar-array designs and wire addressing methods that tolerate misalignment of electrical components at wire overlap points
#1084Post passivation interconnection schemes on top of the IC chips
#1085Methods of trench and contact formation in memory cells
#1086Method for fabricating charge-trapping memory
#1087Substrate treatment method and film forming method, film forming apparatus, and computer program
#1088Method for Manufacturing Semiconductor Device
#1089Interconnection architecture for semiconductor device
#1090Semiconductor device
#1091SEMICONDUCTOR CHIP
#1092Semiconductor integrated circuit device
#1093SEMICONDUCTOR STRUCTURE HAVING EXTRA POWER/GROUND SOURCE CONNECTIONS AND LAYOUT METHOD THEREOF
#1094Method to improve metal defects in semiconductor device fabrication
#1095Method of making a circuitized substrate
#1096Semiconductor Device and Method of Fabricating the Same
#1097Post passivation interconnection schemes on top of the IC chips
#1098Post passivation interconnection schemes on top of the IC chips
#1099Laser isolation of metal over alumina underlayer and structures formed thereby
#1100Nano imprint technique with increased flexibility with respect to alignment and feature shaping
#1101Method for fabricating semiconductor memory device
#1102Method of forming metal line of semiconductor device
#1103Post passivation interconnection schemes on top of the IC chips
#1104Post passivation interconnection schemes on top of IC chip
#1105Post passivation interconnection schemes on top of IC chip
#1106Post passivation interconnection schemes on top of IC chip
#1107Post passivation interconnection schemes on top of IC chip
#1108METHOD FOR REDUCING DEFECTS AFTER A METAL ETCHING IN SEMICONDUCTOR DEVICES
#1109Post passivation interconnection schemes on top of IC chip
#1110Post passivation interconnection schemes on top of IC chip
#1111Capacitor and method of manufacturing a capacitor
#1112Method for forming metal wiring of semiconductor device and a semiconductor device manufactured by the same
#1113Top layers of metal for high performance IC's
#1114Top layers of metal for high performance IC's
#1115METHOD AND STRUCTURE FOR FORMING SELF-PLANARIZING WIRING LAYERS IN MULTILEVEL ELECTRONIC DEVICES
#1116Top layers of metal for high performance IC's
#1117Top layers of metal for high performance IC's
#1118Top layers of metal for high performance IC's
#1119Top layers of metal for high performance IC's
#1120Top layers of metal for high performance IC's
#1121Top layers of metal for high performance IC's
#1122Top layers of metal for high performance IC's
#1123Top layers of metal for high performance IC's
#1124Top layers of metal for high performance IC's
#1125Top layers of metal for high performance IC's
#1126Top layers of metal for high performance IC's
#1127Top layers of metal for high performance IC's
#1128MULTI-LAYER WIRING, METHOD OF MANUFACTURING THE SAME AND THIN FILM TRANSISTOR HAVING THE SAME
#1129Substrate Processing Apparatus
#1130Top layers of metal for high performance IC's
#1131Semiconductor system with surface modification
#1132Power MOSFET contact metallization
#1133Top layers of metal for high performance IC's
#1134Top layers of metal for high performance IC's
#1135Top layers of metal for high performance IC's
#1136Top layers of metal for high performance IC's
#1137Top layers of metal for high performance IC's
#1138Top layers of metal for high performance IC's
#1139Top layers of metal for high performance IC's
#1140Semiconductor device and method for fabricating the same
#1141Top layers of metal for high performance IC's
#1142Top layers of metal for high performance IC's
#1143Methods of forming carbon nanotubes and methods of fabricating integrated circuitry
#1144Top layers of metal for high performance IC's
#1145Top layers of metal for high performance IC's
#1146Top layers of metal for high performance IC's
#1147Top layers of metal for high performance IC's
#1148Top layers of metal for high performance IC's
#1149Top layers of metal for high performance IC's
#1150Top layers of metal for high performance IC's
#1151Top layers of metal for high performance IC's
#1152Top layers of metal for high performance IC's
#1153FULL REMOVAL OF DUAL DAMASCENE METAL LEVEL
#1154Top layers of metal for high performance IC's
#1155Top layers of metal for high performance IC's
#1156Top layers of metal for high performance IC's
#1157Top layers of metal for high performance IC's
#1158Top layers of metal for high performance IC's
#1159Top layers of metal for high performance IC's
#1160Top layers of metal for high performance IC's
#1161Top layers of metal for high performance IC's
#1162Top layers of metal for high performance IC's
#1163Top layers of metal for high performance IC's
#1164Semiconductor device
#1165Metallization layer for a power semiconductor device
#1166Top layers of metal for high performance IC's
#1167System and method for reducing process-induced charging
#1168METHOD FOR FORMING METAL WIRING LINE, METHOD FOR MANUFACTURING ACTIVE MATRIX SUBSTRATE, DEVICE, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPARATUS
#1169Layer forming method, layer forming apparatus, device, manufacturing method for device, and electronic apparatus
#1170Top layers of metal for high performance IC's
#1171Top layers of metal for high performance IC's
#1172Top layers of metal for high performance IC's
#1173Top layers of metal for high performance IC's
#1174Top layers of metal for high performance IC's
#1175Top layers of metal for high performance IC's
#1176Fabrication method of semiconductor integrated circuit device
#1177Methods for forming resistors including multiple layers for integrated circuit devices
#1178Method for forming tungsten materials during vapor deposition processes
#1179Method for manufacturing a semiconductor device
#1180CHIP PACKAGING STRUCTURE
#1181Semiconductor device
#1182Method for forming thin film transistor
#1183Devices having horizontally-disposed nanofabric articles and methods of making the same
#1184Poly-Insulator-Poly Capacitor and Fabrication Method for Making the Same
#1185Laterally grown nanotubes and method of formation
#1186Methods of bridging lateral nanowires and device using same
#1187SEMICONDUCTOR DEVICE HAVING CAPACITOR FORMED IN MULTILAYER WIRING STRUCTURE
#1188Substrate processing method and substrate processing apparatus
#1189Semiconductor device and method for fabricating the same
#1190Hillock-free aluminum layer and method of forming the same
#1191Semiconductor integrated circuit device
#1192Aluminum based conductor for via fill and interconnect
#1193Capacitor
#1194INTEGRATED CIRCUIT HAVING A MULTILAYER CAPACITANCE ARRANGEMENT
#1195Semiconductor device and method of manufacturing the same
#1196Method of manufacturing semiconductor device
#1197Method for manufacturing thin film transistor display array with dual-layer metal line
#1198Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
#1199Lithographic Method Products Obtained And Use Of Said Method
#1200MOS capacitor and semiconductor device