207503 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof; Manufacture of specific parts of devices defined in group; Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
Selective heating using flash anneal
#1202Tungsten Plug Corrosion Prevention Method Using Water
#1203Semiconductor device and method of manufacturing the same
#1204Method for forming fine pattern of semiconductor device
#1205Method of making openings in a layer of a semiconductor device
#1206Interconnect structure to reduce stress induced voiding effect
#1207Rapid patterning of nanostructures
#1208Methods of forming metal-containing films over surfaces of semiconductor substrates
#1209Methods of Processing Thick ILD Layers Using Spray Coating or Lamination for C4 Wafer Level Thick Metal Integrated Flow
#1210PATTERNED ELECTROLESS METALLIZATION PROCESSES FOR LARGE AREA ELECTRONICS
#1211Method for patterning metal using nanoparticle containing precursors
#1212Production of elemental films using a boron-containing reducing agent
#1213Semiconductor device and method for fabricating the same
#1214Method for processing copper surface, method for forming copper pattern wiring and semiconductor device manufactured using such method
#1215Controlling the temperature of a substrate in a film deposition apparatus
#1216Semiconductor device and method for manufacturing same
#1217Cleaning solution and cleaning method of a semiconductor device
#1218Poly etch without separate oxide decap
#1219Universal photomask
#1220Method of manufacturing film
#1221Semiconductor device featuring common capacitor electrode layer, and method for manufacturing such semiconductor device
#1222Semiconductor device and method for fabricating the same
#1223Manufacturing method for wiring
#1224Method for symmetric deposition of metal layer
#1225Pattern forming method and its mold
#1226Carbon nanotube circuit component structure
#1227Poly etch without separate oxide decap
#1228Structure for optimizing fill in semiconductor features deposited by electroplating
#1229Method of microminiaturizing a nano-structure
#1230Method and apparatus for redirecting void diffusion away from vias in an integrated circuit design
#1231Method of fabricating a carbon nanotube interconnect structures
#1232Semiconductor device and method for fabricating the same
#1233SINGLE OR DUAL DAMASCENE VIA LEVEL WIRINGS AND/OR DEVICES, AND METHODS OF FABRICATING SAME
#1234Semiconductor device and method for manufacturing same
#1235Method of manufacturing semiconductor device
#1236METHOD FOR FORMING A FINE PATTERN OF A SEMICONDUCTOR DEVICE
#1237Semiconductor device and manufacturing method thereof
#1238Method for fabricating a metal interconnection using a dual damascene process and resulting semiconductor device
#1239FPGA structure provided with multi parallel structure and method for forming the same
#1240Integrated circuit devices including a capacitor
#1241Direct patterning method for manufacturing a metal layer of a semiconductor device
#1242Method and apparatus for a deposited fill layer
#1243Methods of nanotube films and articles
#1244Semiconductor device and method for fabricating the same
#1245Methods of forming metal layers in the fabrication of semiconductor devices
#1246Light emitting display device and method for manufacturing the same
#1247METHOD AND APPARATUS FOR ANNEALING COPPER FILMS
#1248Dual damascene wiring and method
#1249Semiconductor device and fabrication process thereof
#1250Method for manufacturing conductive layer and semiconductor device
#1251Method of producing a layer arrangement, method of producing an electrical component, layer arrangement, and electrical component
#1252Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure
#1253Fabricating method of an interconnect structure
#1254Hydrogen plasma photoresist strip and polymeric residue cleanup process for low dielectric constant materials
#1255Method of forming gate wiring pattern by droplet discharge
#1256Interconnect structure
#1257Damascene copper wiring optical image sensor
#1258Programmable nanotube interconnect
#1259Method of cleaning semiconductor substrate conductive layer surface
#1260Method of forming metal line stacking structure in semiconductor device
#1261Semiconductor device and manufacturing method thereof to prevent a notch
#1262Semiconductor method having silicon-diffused metal wiring layer
#1263Semiconductor device with dummy conductors
#1264METHOD FOR FORMING PATTERNS AND THIN FILM TRANSISTORS
#1265Conductive material patterning methods
#1266Method of making a circuitized substrate
#1267Semiconductor device having first and second dummy wirings varying in sizes/coverage ratios around a plug connecting part
#1268Semiconductor apparatus
#1269Method for forming large area display wiring by droplet discharge, and method for manufacturing electronic device and semiconductor device
#1270Etch stop layer in poly-metal structures
#1271Method for manufacturing semiconductor device
#1272FUNCTIONAL FILM AND METHOD OF PATTERN FORMATION
#1273Radio frequency power semiconductor device package comprising dielectric platform and shielding plate
#1274Simulation method of wafer warpage
#1275Method for forming a semiconductor product and semiconductor product
#1276Increased grain size in metal wiring structures through flash tube irradiation
#1277Integrated circuit arrangement having a plurality of conductive structure levels and capacitor, and a method for producing the integrated circuit arrangement
#1278Method for fabricating a nano-imprinting mold
#1279METHOD OF FABRICATING CONDUCTIVE LAYER
#1280METHOD OF MANUFACTURING SEMICONDUCTOR STUCTURE
#1281System for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD)
#1282Semiconductor device and method for designing same
#1283Semiconductor device having pattern-dummy and method for manufacturing the same using pattern-dummy
#1284Semiconductor device interconnection contact and fabrication method
#1285Semiconductor device and method of manufacturing same
#1286Directional self-assembly of biological electrical interconnects
#1287Power semiconductor device and method therefor
#1288Liquid crystal display device and method for manufacturing the same, and liquid crystal television receiver
#1289Method for processing a layered stack in the production of a semiconductor device
#1290Method of forming pitch multipled contacts
#1291Process for producing semiconductor integrated circuit device
#1292Method for making integrated circuit chip utilizing oriented carbon nanotube conductive layers
#1293Method for forming a layer, method for manufacturing an active matrix substrate, and method for manufacturing a multilayered wiring substrate
#1294Method for manufacturing semiconductor device
#1295Method for realizing an electric linkage in a semiconductor electronic device between a nanometric circuit architecture and standard electronic components
#1296Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation
#1297Method for using a Cu BEOL process to fabricate an integrated circuit (IC) originally having an al design
#1298Method to form an interconnect
#1299Semiconductor device having a multilayer interconnection structure, fabrication method thereof, and designing method thereof
#13003D IC method and device
#1301Efficient transistor structure
#1302Rapid thermal annealing of targeted thin film layers
#1303Carbon nanotube reinforced metal composites
#1304Efficient transistor structure
#1305Efficient transistor structure
#1306Efficient transistor structure
#1307Method for forming conductive wiring and interconnects
#1308Offset dependent resistor for measuring misalignment of stitched masks
#1309Integrated circuit having a top side wafer contact and a method of manufacture therefor
#1310Semiconductor wafer with a wiring structure, a semiconductor component, and methods for their production
#1311Photoresist stripper composition and methods for forming wire structures and for fabricating thin film transistor substrate using composition
#1312Devices having vertically-disposed nanofabric articles and methods of making the same
#1313Method and structure for reduction of soft error rates in integrated circuits
#1314Semiconductor device
#1315Device and manufacturing method thereof
#1316Techniques for precision pattern transfer of carbon nanotubes from photo mask to wafers
#1317Droplet ejection apparatus
#1318Method for forming a semiconductor product and semiconductor product
#1319Plasma processing method
#1320Method for forming tungsten materials during vapor deposition processes
#1321Tungsten plug corrosion prevention method using ionized air
#1322Fabricating method for flat display device
#1323Use selective growth metallization to improve electrical connection between carbon nanotubes and electrodes
#1324Poly etch without separate oxide decap
#1325Method of fabricating conductive lines
#1326Forming interconnects
#1327Pattern forming method, device, method of manufacture thereof, electro-optical apparatus, and electronic apparatus
#1328Semiconductor devices including a topmost metal layer with at least one opening and their methods of fabrication
#1329Semiconductor integrated circuit device method of fabricating the same
#1330Method of aligning deposited nanotubes onto an etched feature using a spacer
#1331Method for fabricating metal line in semiconductor device
#1332Nanotube articles with adjustable electrical conductivity and methods of making the same
#1333Method for forming metal line of semiconductor device
#1334Vertical type semiconductor device and method for manufacturing the same
#1335Cleaning solution and cleaning method of a semiconductor device
#1336Vapor deposition of benzotriazole (BTA) for protecting copper interconnects
#1337Method of forming bit line of flash memory device
#1338Lateral phase change memory and method therefor
#1339Supercritical fluid-assisted direct write for printing integrated circuits
#1340Method of aligning nanotubes and wires with an etched feature
#1341Dendrite growth control circuit
#1342Combined barrier layer and seed layer
#1343Method of forming a metal trace
#1344Methods of forming particle-containing materials
#1345Process for producing an integrated circuit comprising a capacitor
#1346Manufacturing method of semiconductor device
#1347Method of manufacturing semiconductor device having conductive thin films
#1348Method of preparing silver nano-structure by means of scanning turnneling microscopy
#1349MAKING CONTACT WITH THE EMITTER CONTACT OF A SEMICONDUCTOR
#1350Semiconductor device including multi-layered interconnection and method of manufacturing the device
#1351Method for manufacturing semiconductor device
#1352SEMICONDUCTOR STUCTURE AND METHOD OF MANUFACTURING THE SAME
#1353Pattern formation method, electronic circuit manufactured by the same, and electronic device using the same
#1354Integrated circuit interconnect
#1355Method for manufacturing semiconductor device
#1356Method for fabricating an integrated circuit comprising a three-dimensional capacitor
#1357WAT process to avoid wiring defects
#1358Laser-assisted deposition
#1359Inductor for semiconductor integrated circuit and method of fabricating the same
#1360Semiconductor device and manufacturing method thereof
#1361Semiconductor structure formed using a sacrificial structure
#1362Integrated circuit device and method of producing the same
#1363Power semiconductor device and method therefor
#1364Coating of copper and silver air bridge structures to improve electromigration resistance and other applications
#1365Thin-film device
#1366Semiconductor integrated circuit device and a method of manufacturing the same
#1367Power semiconductor device having buried gate bus and process for fabricating the same
#1368Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof
#1369Carbon nanotube device and manufacturing method of the same
#1370High density interconnections with nanowiring
#1371Semiconductor constructions comprising particle-containing materials
#1372Removal of copper oxides from integrated interconnects
#1373Semiconductor device
#1374Method for forming a plurality of metal lines in a semiconductor device using dual insulating layer
#1375Method of manufacturing a semiconductor integrated circuit, a program for a computer automated design system, and a semiconductor integrated circuit
#1376Semiconductor integrated circuit device
#1377Electrically conductive line, method of forming an electrically conductive line, and method of reducing titanium silicide agglomeration in fabrication of titanium silicide over polysilicon transistor gate lines
#1378IMPROVED MIM CAPACITOR STRUCTURE AND PROCESS
#1379Suspended transmission line structures in back end of line processing
#1380Semiconductor device and method for producing the same
#1381Metal interconnect structure and method
#1382Application of impressed-current cathodic protection to prevent metal corrosion and oxidation
#1383Trench interconnect structure and formation method
#1384Method of manufacturing semiconductor device and semiconductor device
#1385Etchant composition and manufacturing method for thin film transistor array panel
#1386Method for manufacturing a patterned structure
#1387Method of fine patterning a metal layer
#1388Electrophotographic printing of electronic devices
#1389Semiconductor device, electronic device, and method of manufacturing semiconductor device
#1390Method of forming a MIM capacitor for Cu BEOL application
#1391Method of fabricating conductive lines with silicide layer
#1392Method for manufacturing a thin film semiconductor device
#1393Semiconductor constructions
#1394Method of manufacturing a semiconductor device and an apparatus for use in such a method
#1395Semiconductor device having a reductant layer and manufacturing method thereof
#1396Metal etching method for an interconnect structure and metal interconnect structure obtained by such method
#1397Article with a metal layer on a substrate
#1398Process for manufacturing semiconductor integrated circuit device
#1399Method for forming metal line of semiconductor device
#1400Methods for patterning a layer of a semiconductor device
#1401Interlocking via for package via integrity
#1402Method for fabricating metal-insulator-metal capacitor of semiconductor device with reduced patterning steps
#1403Localized slots for stress relieve in copper
#1404MIM capacitor of semiconductor device and manufacturing method thereof
#1405Method of forming on-chip decoupling capacitor with bottom electrode layer having surface roughness
#1406Removing solution
#1407Wiring structure of a semiconductor device
#1408Method of removing etch residues
#1409Method and system for controlling the presence of fluorine in refractory metal layers
#1410Devices having vertically-disposed nanofabric articles and methods of making the same
#1411Integrated semiconductor device and method of manufacturing the same
#1412Methods of forming transistor constructions
#1413Method for manufacturing display device
#1414Methods and apparatus for addition of electrical conductors to previously fabricated device
#1415Damascene interconnect structure with cap layer
#1416Method for manufacturing semiconductor device
#1417Plasma etch process for multilayer vias having an organic layer with vertical sidewalls
#1418Method for manufacturing semiconductor device
#1419Multi-layer wiring, method of manufacturing the same and thin film transistor having the same
#1420Damascene copper wiring image sensor
#1421Metallic chromonic compounds
#1422Method of forming a wiring pattern, method of manufacturing a device, device, electro-optic device, and electronic instrument
#1423Direct imprinting of etch barriers using step and flash imprint lithography
#1424Dendrite growth control circuit
#1425Method for forming wiring pattern, method for manufacturing device, device, electro-optic apparatus, and electronic equipment
#1426Method of forming conductive pattern
#1427Structure for reducing stress-induced voiding in an interconnect of integrated circuits
#1428Method of manufacturing semiconductor device
#1429Method to make nano structure below 25 nanometer with high uniformity on large scale
#1430High density plasma chemical vapor deposition process
#1431Interconnect structure to reduce stress induced voiding effect
#1432Crack stop for low K dielectrics
#1433Method for manufacturing electronic device
#1434Nanopatterning method
#1435Semiconductor device and its manufacturing method
#1436Wiring pattern forming method, film pattern forming method, semiconductor device, electro-optical device, and electronic equipment
#1437Pattern formation method and functional film
#1438Functional film and method of pattern formation
#1439Capacitor device and method of manufacturing the same
#1440Metal oxide-containing nanoparticles
#1441Copper processing using an ozone-solvent solution
#1442Metal nitride carbide deposition by ALD
#1443Post passivation interconnection schemes on top of the IC chips
#1444Thick metal layer integrated process flow to improve power delivery and mechanical buffering
#1445Semiconductor device having polycide wiring layer, and manufacturing method of the same
#1446Method of forming a pattern, method of forming wiring, semiconductor device, TFT device, electro-optic device, and electronic instrument
#1447Etching process and patterning process
#1448Hollow wire and method for making the same
#1449Manufacturing method of a thin film transistor array panel
#1450Conductive path made of metallic nanoparticles and conductive organic material
#1451Semiconductor integrated circuit having improved power supply wiring
#1452Method of manufacturing semiconductor device
#1453Post passivation interconnection schemes on top of the IC chips
#1454Semiconductor device
#1455Hybrid memory device
#1456Method for using a water vapor treatment to reduce surface charge after metal etching
#1457Top layers of metal for integrated circuits
#1458Post passivation interconnection schemes on top of the IC chips
#1459Top layers of metal for integrated circuits
#1460Sub-resolution gaps generated by controlled over-etching
#1461Method and system for making thin metal films
#1462Process for forming integrated circuit comprising copper lines
#1463Post passivation interconnection schemes on top of the IC chips
#1464Semiconductor device having metal-insulator-metal capacitor and method for fabricating the same
#1465Patterning carbon nanotube coatings by selective chemical modification
#1466Metal-insulator-metal capacitor and method for manufacturing the same
#1467Semiconductor device and method for fabricating the same
#1468Top layers of metal for high performance IC's
#1469Apparatus and a method for forming an alloy layer over a substrate
#1470Processing methods of forming an electrically conductive plug to a node location
#1471Tungsten plug corrosion prevention method using gas sparged water
#1472Selective etching of oxides to metal nitrides and metal oxides
#1473Method for fabricating semiconductor device
#1474Nanostructures, nanogrooves, and nanowires
#1475Semiconductor device and method for forming a metal line in the semiconductor device
#1476Top layers of metal for high performance IC's
#1477Post passivation interconnection schemes on top of the IC chips
#1478Semiconductor device and method for producing the same
#1479Semiconductor element
#1480Method and apparatus for deep sub-micron design of integrated circuits
#1481Interconnect dielectric tuning
#1482Substrate, device, method of manufacturing device, method of manufacturing active-matrix substrate, electro-optical apparatus and electronic apparatus
#1483Reduced-step CMOS processes for low-cost radio frequency identification devices
#1484Depositing material on photosensitive material
#1485Method to form an interconnect
#1486Semiconductor device and method for fabricating the same
#1487Method of sizing via arrays and interconnects to reduce routing congestion in flip chip integrated circuits
#1488Interlevel dielectric layer and metal layer sealing
#1489Method for fabricating a high-frequency and high-power semiconductor module
#1490Very thick metal interconnection scheme in IC chips
#1491Semiconductor device and method for manufacturing the same
#1492Semiconductor device and method of manufacturing the same
#1493Integrated circuit chip utilizing oriented carbon nanotube conductive layers
#1494Methods of metallization for microelectronic devices utilizing metal oxide
#1495Semiconductor device having body contact through gate and method of fabricating the same
#1496Device having contact pad with a conductive layer and a conductive passivation layer
#1497Semiconductor package having protective layer for re-routing lines and method of manufacturing the same
#1498Stacked via-stud with improved reliability in copper metallurgy
#1499Semiconductor device and method for fabricating the same
#1500Method for forming an integrated semiconductor circuit arrangement