H01L2221/1005 - CPC Classification Index

ClassID:

209299 ⎘

H01L2221/1005 - CPC Classification

Classification description:

Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by; Applying interconnections to be used for carrying current between separate components within a device Formation and after-treatment of dielectrics

Sub-classes:

H01L2221/101 » Forming openings in dielectrics 14
H01L2221/1042 » the dielectric comprising air gaps 25
H01L2221/1052 » Formation of thin functional dielectric layers 1

Recent Application in this class:

20180047584

2018-02-15

Method for etch-based planarization of a substrate

20140273516

2014-09-18

VBD AND TDDB IMPROVEMENT THRU INTERFACE ENGINEERING

20140220760

2014-08-07

Integration of shallow trench isolation and through-substrate vias into integrated circuit designs

20120153430

2012-06-21

Integration of shallow trench isolation and through-substrate vias into integrated circuit designs