209300 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by; Applying interconnections to be used for carrying current between separate components within a device; Formation and after-treatment of dielectrics Forming openings in dielectrics
Sub-classes:MEMORY DEVICE
#2MEMORY DEVICE AND METHOD OF FORMING THE SAME
#3PATTERNING MATERIAL INCLUDING CARBON-CONTAINING LAYER AND METHOD FOR SEMICONDUCTOR DEVICE FABRICATION
#4Display device and electronic device
#5Semiconductor devices having a conductive pillar and methods of manufacturing the same
#6Semiconductor devices having a conductive pillar and methods of manufacturing the same
#7Display device and electronic device
#8Control method for differentiated etching depth
#9High aspect ratio gap fill
#10Method for building up a fan-out RDL structure with fine pitch line-width and line-spacing
#11Microelectronic conductive routes and methods of making the same
#12Display device and electronic device
#13Method of manufacturing display substrate, repair method of display substrate and display substrate repaired by the repair method
#14Method for building up a fan-out RDL structure with fine pitch line-width and line-spacing
#15Display device and electronic device
#16Air gaps between copper lines
#17Substrate manufacturing method