Patents-Review.com
ClassID:

209306 ⎘

H01L2221/1042 - CPC Classification

Classification description:

Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by; Applying interconnections to be used for carrying current between separate components within a device; Formation and after-treatment of dielectrics the dielectric comprising air gaps

Sub-classes:
Recent Application in this class:
#1
20250267852
2025-08-21

MEMORY STRUCTURE INCLUDING LOW DIELECTRIC CONSTANT CAPPING LAYER

 #2
20250191971
2025-06-12

INTEGRATED CHIP WITH CAVITY STRUCTURE

 #3
20240312876
2024-09-19

Air Gap Seal for Interconnect Air Gap and Method of Fabricating Thereof

 #4
20240032278
2024-01-25

MEMORY STRUCTURE

 #5
20230225104
2023-07-13

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME

 #6
20230133691
2023-05-04

THREE DIMENSIONAL (3D) MEMORY DEVICE AND FABRICATION METHOD USING SELF-ALIGNED MULTIPLE PATTERNING AND AIRGAPS

 #7
20220336263
2022-10-20

Integrated chip with an etch-stop layer forming a cavity

 #8
20220262708
2022-08-18

Air gap seal for interconnect air gap and method of fabricating thereof

 #9
20210028103
2021-01-28

Semiconductor device and method for fabricating the same

 #10
20200411415
2020-12-31

Air gap seal for interconnect air gap and method of fabricating thereof

 #11
20200235000
2020-07-23

IC structure with air gaps and protective layer and method for manufacturing the same

 #12
20200227308
2020-07-16

Interconnect structures with airgaps and dielectric-capped interconnects

 #13
20200105577
2020-04-02

Semiconductor device and manufacturing method thereof

 #14
20200066853
2020-02-27

Semiconductor structure and manufacturing method thereof

 #15
20200058755
2020-02-20

Semiconductor structure and manufacturing method thereof

 #16
20200020568
2020-01-16

Multi-barrier deposition for air gap formation

 #17
20200006115
2020-01-02

Integrated circuit with airgaps to control capacitance

 #18
20190139812
2019-05-09

Multi-barrier deposition for air gap formation

 #19
20190109203
2019-04-11

Method for manufacturing semiconductor structure

 #20
20190019759
2019-01-17

Semiconductor device

 #21
20180374923
2018-12-27

Semiconductor structure and manufacturing method thereof

 #22
20180174957
2018-06-21

Method of forming interconnection structure

 #23
20180145035
2018-05-24

Doric pillar supported maskless airgap structure for capacitance benefit with unlanded via solution

 #24
20170358481
2017-12-14

Multi-barrier deposition for air gap formation

 #25
20170317178
2017-11-02

Method for manufacturing semiconductor structure

 #26
20170140979
2017-05-18

Multi-barrier deposition for air gap formation

 #27
20170110398
2017-04-20

Interconnection structure and method of forming the same

 #28
20160343718
2016-11-24

Forming 3D memory cells after word line replacement

 #29
20150162277
2015-06-11

ADVANCED INTERCONNECT WITH AIR GAP

 #30
20150130017
2015-05-14

Semiconductor device comprising epitaxially grown semiconductor material and an air gap

 #31
15695245
2018-06-19

Semiconductor device and method for manufacturing same

 #32
13457031
2015-01-20

Selective epitaxial overgrowth comprising air gaps