H01L2221/1015 - CPC Classification Index

ClassID:

209301 ⎘

H01L2221/1015 - CPC Classification

Classification description:

Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by; Applying interconnections to be used for carrying current between separate components within a device; Formation and after-treatment of dielectrics; Forming openings in dielectrics for dual damascene structures

Sub-classes:

H01L2221/1021 » Pre-forming the dual damascene structure in a resist layer 34
H01L2221/1026 » the via being formed by burying a sacrificial pillar in the dielectric and removing the pillar 49
H01L2221/1031 » Dual damascene by forming vias in the via-level dielectric prior to deposition of the trench-level dielectric 111
H01L2221/1036 » Dual damascene with different via-level and trench-level dielectrics 104

Recent Application in this class:

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SEMICONDUCTOR DEVICE INCLUDING STRUCTURE CONNECTING FRONTSIDE AND BACKSIDE METAL AND METHOD OF MANUFACTURING THE SAME

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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

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Semiconductor package and method of fabricating semiconductor package

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SEMICONDUCTOR DEVICE INCLUDING STRUCTURE CONNECTING FRONTSIDE AND BACKSIDE METAL AND METHOD OF MANUFACTURING THE SAME

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Semiconductor package and method of fabricating semiconductor package

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Semiconductor package and method of fabricating semiconductor package

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Method for forming interconnect structure

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Creating an aligned via and metal line in an integrated circuit including forming an oversized via mask

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Structure and method of metal wraparound for low via resistance

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Semiconductor package and method of fabricating semiconductor package

20190096756

Method of creating aligned vias in ultra-high density integrated circuits

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Semiconductor package and method of fabricating semiconductor package

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Method for forming interconnect structure

20160042992

Method for forming interconnect structure

20150187588

Plasma etching method and semiconductor device manufacturing method

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Method for forming interconnect structure

20140234992

Plasma etching method and semiconductor device manufacturing method